Inventor · disambiguated record
Kenta Ogawa
Also filed as: OGAWA KENTA
28 granted patents·10 pending applications·105 citations·filing 2000–2023
95Inventor score
Files withNEC ELECTRONICS CORP11RENESAS ELECTRONICS CORP11KONAMI DIGITAL ENTERTAINMENT CO LTD4FURUNO ELECTRIC CO3NAKASHIBA YASUTAKA3
Top patents by PatentIndex Score
38 records- 0194US8378470B2Semiconductor device that performs signal transmission using induction coupling, method of said manufacturing semiconductor device, and lead frame thereofRENESAS ELECTRONICS CORP·Filed 2010·Granted Feb 19, 2013·15 cites·20 claims
- 0287US7838779B2Wiring board, method for manufacturing same, and semiconductor packageNEC CORP·Filed 2006·Granted Nov 23, 2010·16 cites·11 claims
- 0386US7745736B2Interconnecting substrate and semiconductor deviceNEC ELECTRONICS CORP·Filed 2006·Granted Jun 29, 2010·15 cites·28 claims
- 0485US11473914B2Navigation device and method of creating routeFURUNO ELECTRIC CO·Filed 2019·Granted Oct 18, 2022·5 cites·20 claims
- 0583US7649749B2Wiring substrate, semiconductor device, and method of manufacturing the sameNEC ELECTRONICS CORP·Filed 2007·Granted Jan 19, 2010·10 cites·26 claims
- 0681US11266904B2Game system, game control device, and information storage mediumKONAMI DIGITAL ENTERTAINMENT CO LTD·Filed 2019·Granted Mar 8, 2022·5 cites·10 claims
- 0781US6391179B1Plating apparatus and method of preventing substitute depositionNEC CORP·Filed 2000·Granted May 21, 2002·13 cites·20 claims
- 0880US7911038B2Wiring board, semiconductor device using wiring board and their manufacturing methodsRENESAS ELECTRONICS CORP·Filed 2007·Granted Mar 22, 2011·7 cites·18 claims
- 0977US8810021B2Semiconductor device including a recess formed above a semiconductor chipNAKASHIBA YASUTAKA·Filed 2012·Granted Aug 19, 2014·3 cites·16 claims
- 1067US10857461B2Game control device, game system, and information storage mediumKONAMI DIGITAL ENTERTAINMENT CO LTD·Filed 2019·Granted Dec 8, 2020·1 cites·10 claims
- 1167US8357935B2Electronic component having an authentication patternRENESAS ELECTRONICS CORP·Filed 2011·Granted Jan 22, 2013·3 cites·10 claims
- 1263US8283770B2Semiconductor device and communication methodNAKASHIBA YASUTAKA·Filed 2011·Granted Oct 9, 2012·1 cites·8 claims
- 1363US7674989B2Wiring board and method for manufacturing the sameNEC ELECTRONICS CORP·Filed 2006·Granted Mar 9, 2010·2 cites·23 claims
- 1462US8705238B2External storage device and method of manufacturing external storage deviceNAKASHIBA YASUTAKA·Filed 2010·Granted Apr 22, 2014·1 cites·19 claims
- 1559US7701726B2Method of manufacturing a wiring substrate and semiconductor deviceNEC ELECTRONICS CORP·Filed 2008·Granted Apr 20, 2010·1 cites·10 claims
- 1657US2023286621A1Ship state estimation device, ship state estimation system, ship state estimation method, and ship state estimation programFURUNO ELECTRIC CO·Filed 2023·Application pending·0 cites
- 1755US6884523B2Electronic component and method of manufacturing the sameNEC ELECTRONICS CORP·Filed 2004·Granted Apr 26, 2005·5 cites·16 claims
- 1854US12491440B2Game system, medium, and method for determining ball speed and climb angleKONAMI DIGITAL ENTERTAINMENT CO LTD·Filed 2023·Granted Dec 9, 2025·0 cites·11 claims
- 1954USRE45987EElectronic component and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2013·Granted Apr 26, 2016·0 cites·62 claims
- 2054US9165879B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2014·Granted Oct 20, 2015·0 cites·19 claims
- 2154US8772914B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2013·Granted Jul 8, 2014·0 cites·20 claims
- 2254US8753922B2Method of manufacturing a semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2013·Granted Jun 17, 2014·0 cites·20 claims
- 2354US8389414B2Method of manufacturing a wiring boardKIKUCHI KATSUMI·Filed 2011·Granted Mar 5, 2013·0 cites·30 claims
- 2454US2011223998A1Game device, method for controlling game device, program and information storing mediumKONAMI DIGITAL ENTERTAINMENT·Filed 2009·Application pending·0 cites
- 2553US9666659B2External storage device and method of manufacturing external storage deviceRENESAS ELECTRONICS CORP·Filed 2014·Granted May 30, 2017·0 cites·19 claims
- 2651US7982303B2Semiconductor device and communication methodRENESAS ELECTRONICS CORP·Filed 2010·Granted Jul 19, 2011·0 cites·9 claims
- 2751US2010044416A1Method of manufacturing electronic components having bumpNEC CORP·Filed 2009·Application pending·0 cites
- 2850US10773154B2Game control device, game system, and information storage mediumKONAMI DIGITAL ENTERTAINMENT CO LTD·Filed 2019·Granted Sep 15, 2020·0 cites·11 claims
- 2949US2007243405A1Electronic device with lead-free metal thin film formed on the surface thereofNEC ELECTRONICS CORP·Filed 2007·Application pending·0 cites
- 3048US9362263B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2015·Granted Jun 7, 2016·0 cites·20 claims
- 3147US7235309B2Electronic device having external terminals with lead-free metal thin film formed on the surface thereofNEC ELECTRONICS CORP·Filed 2003·Granted Jun 26, 2007·2 cites·14 claims
- 3246US11193787B2Graph generating deviceFURUNO ELECTRIC CO·Filed 2019·Granted Dec 7, 2021·0 cites·7 claims
- 3345US2010232127A1Wiring board composite body, semiconductor device, and method for manufacturing the wiring board composite body and the semiconductor deviceNEC ELECTRONICS CORP·Filed 2007·Application pending·0 cites
- 3442US2013122662A1Electronic component and method of manufacturing electronic componentRENESAS ELECTRONICS CORP·Filed 2013·Application pending·0 cites
- 3537US2003193094A1Semiconductor device and method for fabricating the sameNEC ELECTRONICS CORP·Filed 2003·Application pending·0 cites
- 3637US2003156395A1Electronic component and method of manufacturing sameNEC ELECTRONICS CORP·Filed 2003·Application pending·0 cites
- 3732US2010258955A1Semiconductor device and method of manufacturing the sameNEC ELECTRONICS CORP·Filed 2010·Application pending·0 cites
- 3828US2012045114A1Authentication device, authentication method, and an information storage medium storing a programMATSUMARU YASUHIRO·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →