Electronic component and method of manufacturing electronic component

Abstract

A method of manufacturing an electronic component, wherein a resin including colored particles composing dots in a dot pattern which will act as an authentication pattern is flowed in and solidified over the electronic component, thereby fixing the colored particles.

What is claimed is: 
     
         1 . A method of manufacturing an electronic component,
 wherein a resin including colored particles composing dots in a dot pattern which will act as an authentication pattern is flowed in and solidified over the electronic component, thereby fixing the colored particles.   
     
     
         2 . The method of manufacturing an electronic component according to  claim 1 , comprising:
 preparing an electronic component;   heating a pattern material including a base resin which will become the base of the authentication pattern and colored particles; and   after the heating the pattern material, flowing in and solidifying the heated and thus melted substance over the electronic component,   wherein the heating is performed under a condition in which the base resin is melted, but the colored particles are not melted in the heating the pattern material, and   the colored particles have a hue that can be identified in the pattern material.   
     
     
         3 . The method of manufacturing an electronic component according to  claim 2 ,
 wherein a recessed portion is formed over exposed surfaces in the electronic component prepared in the preparing the electronic component, and   the molten substance is flowed into the recessed portion in the solidifying the substance.   
     
     
         4 . The method of manufacturing an electronic component according to  claim 2 ,
 wherein the colored particles include a resin, and   the base resin and the resin included in the colored particles are a same resin.   
     
     
         5 . The method of manufacturing an electronic component according to  claim 1 , comprising:
 mounting a substrate over which semiconductor chips are mounted in a sealing mold;   after the mounting the substrate, heating a sealing material including a sealing resin and colored particles, both of which have been injected in a pot, and   after the heating the sealing material, flowing by pressure and solidifying the heated and thus melted substance in the sealing mold,   wherein the heating is performed under a condition in which the sealing resin is melted, but the colored particles are not melted in the heating the sealing material, and   the colored particles have a hue that can be identified in the sealing material.   
     
     
         6 . The method of manufacturing an electronic component according to  claim 5 ,
 wherein the colored particles include a resin; and   the sealing resin and the resin included in the colored particles are a same resin.   
     
     
         7 . The method of manufacturing an electronic component according to  claim 2 , further comprising:
 after the solidifying the substance, removing the exposed surfaces of a solidified substance of the molten substance, and forming second exposed surfaces composed of the solidified substance.   
     
     
         8 . The method of manufacturing an electronic component according to  claim 2 , further comprising:
 after the solidifying the substance, selectively removing the exposed surfaces of the solidified substance of the molten substance, and forming protrusions and recesses over the exposed surfaces.   
     
     
         9 . The method of manufacturing an electronic component according to  claim 7 , further comprising:
 after the forming the exposed surface, selectively removing the second exposed surfaces, and forming protrusions and recesses over the second exposed surfaces.   
     
     
         10 . A method of manufacturing an electronic component, comprising:
 preparing an electronic component having an authentication pattern, which includes a base section including a resin and colored particles having a hue that can be identified in the base section, and, in which the colored particles are dispersed so as to form a dotted pattern in the base section;   photographing the authentication pattern; and   saving still image data of the photographed authentication pattern.   
     
     
         11 . A method of manufacturing an electronic component, comprising:
 preparing a semiconductor chip; and   forming a sealing resin layer including a silica filler, a carbon black, an epoxy resin and colored particles having a particle diameter of 10 μm to 100 μm on the semiconductor chip,   wherein the forming the sealing resin layer includes:
 dispersing the colored particles in the sealing resin layer, and 
 forming a dotted pattern composed of the colored particles on a surface of the sealing resin layer.