Inventor · disambiguated record
Frank Kuechenmeister
Also filed as: KUECHENMEISTER FRANK · KUECHENMEISTER FRANK G · KUECHENMEISTER FRANK GOTTFRIED
38 granted patents·12 pending applications·189 citations·filing 2002–2023
97Inventor score
Files withADVANCED MICRO DEVICES INC13GLOBALFOUNDRIES INC8GLOBALFOUNDRIES US INC5LEHR MATTHIAS5KUECHENMEISTER FRANK3
Top patents by PatentIndex Score
50 records- 0194US11740418B2Barrier structure with passage for waveguide in photonic integrated circuitGLOBALFOUNDRIES US INC·Filed 2021·Granted Aug 29, 2023·3 cites·20 claims
- 0291US7833839B1Method for decreasing surface delamination of gel-type thermal interface material by management of the material cure temperatureGLOBALFOUNDRIES INC·Filed 2007·Granted Nov 16, 2010·22 cites·21 claims
- 0390US11543606B2Photonics chips with an edge coupler and a continuous crackstopGLOBALFOUNDRIES US INC·Filed 2021·Granted Jan 3, 2023·2 cites·20 claims
- 0489US8957524B2Pillar structure for use in packaging integrated circuit products and methods of making such a pillar structureGLOBALFOUNDRIES INC·Filed 2013·Granted Feb 17, 2015·15 cites·17 claims
- 0587US7678615B2Semiconductor device with gel-type thermal interface materialADVANCED MICRO DEVICES INC·Filed 2007·Granted Mar 16, 2010·15 cites·27 claims
- 0684US8624404B1Integrated circuit package having offset viasSU MICHAEL Z·Filed 2012·Granted Jan 7, 2014·7 cites·25 claims
- 0781US8043956B2Wire bonding on reactive metal surfaces of a metallization of a semiconductor device by providing a protective layerGLOBALFOUNDRIES INC·Filed 2009·Granted Oct 25, 2011·8 cites·12 claims
- 0881US7375032B2Semiconductor substrate thinning method for manufacturing thinned dieADVANCED MICRO DEVICES INC·Filed 2005·Granted May 20, 2008·11 cites·22 claims
- 0978US8580672B2Methods of forming bump structures that include a protection layerKUECHENMEISTER FRANK·Filed 2011·Granted Nov 12, 2013·7 cites·15 claims
- 1076US12341111B2Crackstop structuresGLOBALFOUNDRIES SG PTE LTD·Filed 2023·Granted Jun 24, 2025·0 cites·18 claims
- 1176US8479578B2Assessing metal stack integrity in sophisticated semiconductor devices by mechanically stressing die contactsGEISLER HOLM·Filed 2010·Granted Jul 9, 2013·6 cites·28 claims
- 1274US8039958B2Semiconductor device including a reduced stress configuration for metal pillarsADVANCED MICRO DEVICES INC·Filed 2009·Granted Oct 18, 2011·6 cites·16 claims
- 1374US7897433B2Semiconductor chip with reinforcement layer and method of making the sameADVANCED MICRO DEVICES INC·Filed 2009·Granted Mar 1, 2011·6 cites·21 claims
- 1473US7829453B2Method for forming solder balls with a stable oxide layer by controlling the reflow ambientGLOBALFOUNDRIES INC·Filed 2006·Granted Nov 9, 2010·6 cites·24 claims
- 1573US7306976B2Technique for enhancing thermal and mechanical characteristics of an underfill material of a substrate/die assemblyADVANCED MICRO DEVICES INC·Filed 2005·Granted Dec 11, 2007·5 cites·18 claims
- 1672US8293636B2Conductive connection structure with stress reduction arrangement for a semiconductor device, and related fabrication methodSCHULZE THOMAS·Filed 2010·Granted Oct 23, 2012·5 cites·4 claims
- 1772US7585759B2Technique for efficiently patterning an underbump metallization layer using a dry etch processADVANCED MICRO DEVICES INC·Filed 2006·Granted Sep 8, 2009·7 cites·29 claims
- 1871US7491556B2Efficient method of forming and assembling a microelectronic chip including solder bumpsADVANCED MICRO DEVICES INC·Filed 2005·Granted Feb 17, 2009·6 cites·8 claims
- 1971US6639314B2Solder bump structure and a method of forming the sameADVANCED MICRO DEVICES INC·Filed 2002·Granted Oct 28, 2003·20 cites·25 claims
- 2070US8357268B2System for driving and controlling a movable electrode assembly in an electrochemical process toolADVANCED MICRO DEVICES INC·Filed 2007·Granted Jan 22, 2013·2 cites·19 claims
- 2170US2024030160A1Crackstop with embedded passive radio frequency noise suppressor and methodGLOBALFOUNDRIES US INC·Filed 2023·Application pending·0 cites
- 2266US11652069B2Crackstop structuresGLOBALFOUNDRIES SG PTE LTD·Filed 2020·Granted May 16, 2023·0 cites·15 claims
- 2366US7569937B2Technique for forming a copper-based contact layer without a terminal metalADVANCED MICRO DEVICES INC·Filed 2006·Granted Aug 4, 2009·3 cites·6 claims
- 2466US6894390B2Soft error resistant semiconductor deviceADVANCED MICRO DEVICES INC·Filed 2003·Granted May 17, 2005·17 cites·21 claims
- 2565US9449907B2Stacked semiconductor chips packagingADVANCED MICRO DEVICES INC·Filed 2015·Granted Sep 20, 2016·1 cites·11 claims
- 2664US8283247B2Semiconductor device including a die region designed for aluminum-free solder bump connection and a test structure designed for aluminum-free wire bondingLEHR MATTHIAS·Filed 2008·Granted Oct 9, 2012·4 cites·18 claims
- 2763US11855005B2Crackstop with embedded passive radio frequency noise suppressor and methodGLOBALFOUNDRIES US INC·Filed 2021·Granted Dec 26, 2023·0 cites·9 claims
- 2862US8664025B2Substrate dicing technique for separating semiconductor dies with reduced area consumptionRICHTER DANIEL·Filed 2011·Granted Mar 4, 2014·2 cites·14 claims
- 2960US8174131B2Semiconductor device having a filled trench structure and methods for fabricating the sameZHANG ZHEN·Filed 2009·Granted May 8, 2012·2 cites·20 claims
- 3059US8920027B2Assessing thermal mechanical characteristics of complex semiconductor devices by integrated heating systemsGRILLBERGER MICHAEL·Filed 2011·Granted Dec 30, 2014·1 cites·15 claims
- 3155US11907623B2Chip module structure and method and system for chip module design using chip-package co-optimizationGLOBALFOUNDRIES DRESDEN MOD 1·Filed 2021·Granted Feb 20, 2024·0 cites·20 claims
- 3251US8216880B2Wire bonding on reactive metal surfaces of a metallization of a semiconductor device by providing a protection layerLEHR MATTHIAS·Filed 2011·Granted Jul 10, 2012·0 cites·14 claims
- 3350US8561446B2Method and device for fabricating bonding wires on the basis of microelectronic manufacturing techniquesLEHR MATTHIAS·Filed 2009·Granted Oct 22, 2013·0 cites·24 claims
- 3449US11804440B2Chip module with robust in-package interconnectsGLOBALFOUNDRIES US INC·Filed 2021·Granted Oct 31, 2023·0 cites·20 claims
- 3549US9478489B2Semiconductor dies with reduced area consumptionGLOBALFOUNDRIES INC·Filed 2013·Granted Oct 25, 2016·0 cites·17 claims
- 3648US2014021604A1Integrated circuit devices with bump structures that include a protection layerGLOBALFOUNDRIES INC·Filed 2013·Application pending·0 cites
- 3746US2010052137A1Enhanced wire bond stability on reactive metal surfaces of a semiconductor device by encapsulation of the bond structureMEYER ANDREAS·Filed 2009·Application pending·0 cites
- 3846US2009166861A1Wire bonding of aluminum-free metallization layers by surface conditioningLEHR MATTHIAS·Filed 2008·Application pending·0 cites
- 3945US2012193788A1Stacked semiconductor chips packagingFU LEI·Filed 2011·Application pending·0 cites
- 4042US8841140B2Technique for forming a passivation layer without a terminal metalLETZ TOBIAS·Filed 2007·Granted Sep 23, 2014·0 cites·15 claims
- 4142US2008203571A1Backside metallization for integrated circuit devicesJUNGNICKEL GOTTHARD·Filed 2007·Application pending·0 cites
- 4242US2010164098A1Semiconductor device including a cost-efficient chip-package connection based on metal pillarsKUECHENMEISTER FRANK·Filed 2009·Application pending·0 cites
- 4341US2008099913A1Metallization layer stack without a terminal aluminum metal layerLEHR MATTHIAS·Filed 2007·Application pending·0 cites
- 4438US2013087907A1Metal Features to Reduce Crack-Inducing Stresses in Metallization StacksLEHR MATTHIAS U·Filed 2011·Application pending·0 cites
- 4535US9570430B2Articles including bonded metal structures and methods of preparing the sameGLOBALFOUNDRIES INC·Filed 2015·Granted Feb 14, 2017·0 cites·14 claims
- 4635US7993936B2System and method for controlling an electrochemical etch processADVANCED MICRO DEVICES INC·Filed 2007·Granted Aug 9, 2011·0 cites·22 claims
- 4735US2012286397A1Die Seal for Integrated Circuit DeviceKUECHENMEISTER FRANK·Filed 2011·Application pending·0 cites
- 4832US8384218B2Back side metallization with superior adhesion in high-performance semiconductor devicesGLOBALFOUNDRIES INC·Filed 2010·Granted Feb 26, 2013·0 cites·23 claims
- 4929US2012052677A1Method for Forming Lead-Free Solder Balls with a Stable Oxide Layer Based on a Plasma ProcessZENNER SOEREN·Filed 2011·Application pending·0 cites
- 5028US2006266652A1Method and system for on-line controlling of solder bump depositionNETZ ANDREAS·Filed 2006·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Frank Kuechenmeister files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →