Inventor · disambiguated record
Edmund Riedl
Also filed as: RIEDL EDMUND
28 granted patents·10 pending applications·95 citations·filing 2002–2024
94Inventor score
Files withINFINEON TECHNOLOGIES AG32RIEDL EDMUND3HEINRICH ALEXANDER1MENGEL MANFRED1SCHNEEGANS MANFRED1
Top patents by PatentIndex Score
38 records- 0183US8177878B2Bonding material with exothermically reactive heterostructuresHEINRICH ALEXANDER·Filed 2009·Granted May 15, 2012·15 cites·15 claims
- 0282US7705472B2Semiconductor device with semiconductor device components embedded in a plastic housing compositionINFINEON TECHNOLOGIES AG·Filed 2006·Granted Apr 27, 2010·14 cites·22 claims
- 0374US12288727B2Method of manufacturing a package having an adhesion promoterINFINEON TECHNOLOGIES AG·Filed 2023·Granted Apr 29, 2025·0 cites·15 claims
- 0474US2024413033A1Interlayer of Sub-structure Having Elevations and Further Sub-structure with Filler Particles in Recesses Between the ElevationsINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 0573US7874475B2Method for the planar joining of components of semiconductor devices and a diffusion joining structureINFINEON TECHNOLOGIES AG·Filed 2006·Granted Jan 25, 2011·6 cites·20 claims
- 0673US6727587B2Connection device and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2002·Granted Apr 27, 2004·20 cites·39 claims
- 0772US11450642B2Soldering a conductor to an aluminum metallizationINFINEON TECHNOLOGIES AG·Filed 2020·Granted Sep 20, 2022·0 cites·15 claims
- 0871US10615145B2Soldering a conductor to an aluminum metallizationINFINEON TECHNOLOGIES AG·Filed 2018·Granted Apr 7, 2020·0 cites·10 claims
- 0971US7368824B2Diffusion solder position, and process for producing itINFINEON TECHNOLOGIES AG·Filed 2004·Granted May 6, 2008·17 cites·15 claims
- 1070US10896893B2Soldering a conductor to an aluminum metallizationINFINEON TECHNOLOGIES AG·Filed 2020·Granted Jan 19, 2021·0 cites·20 claims
- 1170US7911061B2Semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2007·Granted Mar 22, 2011·4 cites·19 claims
- 1269US10892247B2Soldering a conductor to an aluminum metallizationINFINEON TECHNOLOGIES AG·Filed 2020·Granted Jan 12, 2021·0 cites·20 claims
- 1368US7511382B2Semiconductor chip arrangement and methodINFINEON TECHNOLOGIES AG·Filed 2005·Granted Mar 31, 2009·4 cites·12 claims
- 1465US12136578B2Interlayer of sub-structure having elevations and further sub-structure with filler particles in recesses between the elevationsINFINEON TECHNOLOGIES AG·Filed 2021·Granted Nov 5, 2024·0 cites·15 claims
- 1564US11652012B2Inorganic encapsulant for electronic component with adhesion promoterINFINEON TECHNOLOGIES AG·Filed 2020·Granted May 16, 2023·0 cites·17 claims
- 1663US8410586B2Semiconductor package and method of assembling a semiconductor packageRIEDL EDMUND·Filed 2008·Granted Apr 2, 2013·5 cites·24 claims
- 1763US7909978B2Method of making an integrated circuit including electrodeposition of metallic chromiumINFINEON TECHNOLOGIES AG·Filed 2007·Granted Mar 22, 2011·0 cites·16 claims
- 1863US7540950B2Electrically conductive body including an adhesion promoter layer, and process for depositing an adhesion promoter layerINFINEON TECHNOLOGIES AG·Filed 2005·Granted Jun 2, 2009·2 cites·9 claims
- 1962US2009129971A1Lead-free soft solderINFINEON TECHNOLOGIES AG·Filed 2009·Application pending·0 cites
- 2061US2021167034A1Chip arrangementsINFINEON TECHNOLOGIES AG·Filed 2021·Application pending·0 cites
- 2155US7851910B2Diffusion soldered semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2004·Granted Dec 14, 2010·6 cites·11 claims
- 2254US2023274996A1Chip arrangement, chip package, method of forming a chip arrangement, and method of forming a chip packageINFINEON TECHNOLOGIES AG·Filed 2023·Application pending·0 cites
- 2353US10930614B2Chip arrangementsINFINEON TECHNOLOGIES AG·Filed 2017·Granted Feb 23, 2021·0 cites·16 claims
- 2453US8147621B2Method for producing a metal article intended for at least partially coating with a substanceRIEDL EDMUND·Filed 2008·Granted Apr 3, 2012·0 cites·18 claims
- 2553US2008257744A1Method of making an integrated circuit including electrodeposition of aluminiumINFINEON TECHNOLOGIES AG·Filed 2007·Application pending·0 cites
- 2653US2023064442A1Chip package structure, chip package system, and method of forming a chip package structureINFINEON TECHNOLOGIES AG·Filed 2022·Application pending·0 cites
- 2751US7384698B2Metal article intended for at least partially coating with a substance and a method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2004·Granted Jun 10, 2008·2 cites·11 claims
- 2850US2022275217A1Filler particle having morphological adhesion promoter shell on coreINFINEON TECHNOLOGIES AG·Filed 2022·Application pending·0 cites
- 2948US9735126B2Solder alloys and arrangementsMENGEL MANFRED·Filed 2011·Granted Aug 15, 2017·0 cites·25 claims
- 3048US2023027669A1Electronic system having intermetallic connection structure with central intermetallic mesh structure and mesh-free exterior structuresINFINEON TECHNOLOGIES AG·Filed 2022·Application pending·0 cites
- 3147US8156643B2Semiconductor deviceSCHNEEGANS MANFRED·Filed 2011·Granted Apr 17, 2012·0 cites·20 claims
- 3246US7989930B2Semiconductor packageINFINEON TECHNOLOGIES AG·Filed 2007·Granted Aug 2, 2011·0 cites·22 claims
- 3345US2020231800A1Corrosion Protected Mold CompoundINFINEON TECHNOLOGIES AG·Filed 2020·Application pending·0 cites
- 3444US11328935B2Method of forming a layer structure, layer structure, method of forming a contact structure, method of forming a chip package, and chip packageINFINEON TECHNOLOGIES AG·Filed 2020·Granted May 10, 2022·0 cites·15 claims
- 3544US10734352B2Metallic interconnect, a method of manufacturing a metallic interconnect, a semiconductor arrangement and a method of manufacturing a semiconductor arrangementINFINEON TECHNOLOGIES AG·Filed 2018·Granted Aug 4, 2020·0 cites·21 claims
- 3644US8603864B2Method of fabricating a semiconductor deviceRIEDL EDMUND·Filed 2008·Granted Dec 10, 2013·0 cites·5 claims
- 3742US2020381314A1Method for Providing Coated Leadframes or for Measuring an Adhesion Force of an Encapsulant on a LeadframeINFINEON TECHNOLOGIES AG·Filed 2020·Application pending·0 cites
- 3837US10366946B2Connection member with bulk body and electrically and thermally conductive coatingINFINEON TECHNOLOGIES AG·Filed 2017·Granted Jul 30, 2019·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →