Chip arrangements

Abstract

A chip arrangement including: a chip including a chip back side; a substrate including a surface with a plating; and a zinc-based solder alloy which attaches the chip back side to the plating on the surface of the substrate, the zinc-based solder alloy including, by weight, 1% to 30% aluminum, 0.5% to 20% germanium, and 0.5% to 20% gallium, wherein a balance of the zinc-based solder alloy is zinc.

What is claimed is: 
     
         1 . A chip arrangement comprising:
 a chip comprising a chip back side;   a substrate comprising a surface with a plating; and   a zinc-based solder alloy which attaches the chip back side to the plating on the surface of the substrate, the zinc-based solder alloy comprising, by weight, 1% to 30% aluminum, 0.5% to 20% germanium, and 0.5% to 20% gallium, wherein a balance of the zinc-based solder alloy is zinc.   
     
     
         2 . The chip arrangement of  claim 1 , wherein the zinc-based solder alloy comprises by weight 3% to 8% aluminum. 
     
     
         3 . The chip arrangement of  claim 1 , wherein the zinc-based solder alloy comprises by weight 0.5% to 4% germanium. 
     
     
         4 . The chip arrangement of  claim 1 , wherein the zinc-based solder alloy comprises by weight 0.5% to 4% gallium. 
     
     
         5 . The chip arrangement of  claim 1 , wherein the zinc-based solder alloy further comprises at least one from the following group of materials: silver, gold, nickel, platinum, palladium, vanadium, molybdenum, tin, copper, arsenic, antimony, niobium, tantalum, and/or any combination thereof, by weight 0.001% to 10% of the zinc-based solder alloy. 
     
     
         6 . The chip arrangement of  claim 1 , wherein the plating comprises at least one of nickel or nickel-phosphorous. 
     
     
         7 . The chip arrangement of  claim 6 , wherein the substrate comprises one or more of copper, nickel, silver, or ceramic. 
     
     
         8 . The chip arrangement of  claim 7 , wherein the at least one of nickel or nickel-phosphorous in the plating provides a reduced void rate at an interface with the zinc-based solder alloy as compared to a void rate of the zinc-based solder alloy on the substrate without the plating. 
     
     
         9 . The chip arrangement of  claim 1 , wherein the chip back side comprises a back side metallization comprising a plurality of layers, wherein a first layer of the plurality of layers is a contact layer which contacts a semiconductor material of the chip back side. 
     
     
         10 . The chip arrangement of  claim 9 , wherein the contact layer comprises aluminum and has a thickness ranging from 50 nm to 1000 nm. 
     
     
         11 . The chip arrangement of  claim 9 , wherein a second layer of the plurality of layers is a barrier layer comprising titanium or titanium-tungsten and has a thickness ranging from 50 nm to 1000 nm. 
     
     
         12 . The chip arrangement of  claim 11 , wherein a third layer of the plurality of layers is a solder reaction layer comprising at least one of nickel, nickel-vanadium, silver, aluminum, gold, platinum, palladium, nickel, or combinations thereof, and has a thickness ranging from 50 nm to 1000 nm. 
     
     
         13 . The chip arrangement of  claim 12 , wherein a fourth layer of the plurality of layers is an oxidation protection layer with a thickness ranging from 50 nm to 1000 nm. 
     
     
         14 . A chip arrangement comprising:
 a chip comprising a chip back side;   a substrate comprising a surface with a plating, wherein the plating comprises at least one of nickel or nickel-phosphorous; and   a zinc-based solder alloy which attaches the chip back side to the plating on the surface of the substrate, the zinc-based solder alloy comprising, by weight, 1% to 20% aluminum, 1% to 20% magnesium, wherein a balance of the zinc-based solder alloy is zinc.   
     
     
         15 . The chip arrangement of  claim 14 , wherein the zinc-based solder alloy comprises by weight 3% to 8% aluminum. 
     
     
         16 . The chip arrangement of  claim 14 , wherein the zinc-based solder alloy comprises by weight 0.5% to 4% magnesium. 
     
     
         17 . The chip arrangement of  claim 14 , wherein the zinc-based solder alloy further comprises at least one from the following group of materials: silver, gold, nickel, platinum, palladium, vanadium, molybdenum, tin, copper, arsenic, antimony, gallium, niobium, tantalum, and/or any combination thereof, by weight 0.001% to 10% of the zinc-based solder alloy. 
     
     
         18 . The chip arrangement of  claim 14 , wherein the at least one of nickel or nickel-phosphorous in the plating provides a reduced void rate at an interface with the zinc-based solder alloy as compared to a void rate of the zinc-based solder alloy on the substrate without the plating. 
     
     
         19 . The chip arrangement of  claim 18 , wherein the substrate comprises one or more of copper, nickel, silver, or ceramic. 
     
     
         20 . The chip arrangement of  claim 19 , wherein the substrate comprises copper.