Assignee
MENGEL MANFRED
DE·10 granted patents·15 citations·filing 2008–2011
Top patents by PatentIndex Score
10 records- 0174US9093416B2Chip-package and a method for forming a chip-packageMENGEL MANFRED·Filed 2011·Granted Jul 28, 2015·4 cites·15 claims
- 0272US8569109B2Method for attaching a metal surface to a carrier, a method for attaching a chip to a chip carrier, a chip-packaging module and a packaging moduleMENGEL MANFRED·Filed 2011·Granted Oct 29, 2013·3 cites·29 claims
- 0367US8884434B2Method and system for improving reliability of a semiconductor deviceMENGEL MANFRED·Filed 2010·Granted Nov 11, 2014·2 cites·15 claims
- 0467US8633600B2Device and method for manufacturing a deviceMENGEL MANFRED·Filed 2010·Granted Jan 21, 2014·2 cites·8 claims
- 0566US8531014B2Method and system for minimizing carrier stress of a semiconductor deviceMENGEL MANFRED·Filed 2010·Granted Sep 10, 2013·2 cites·24 claims
- 0663US8101463B2Method of manufacturing a semiconductor deviceMENGEL MANFRED·Filed 2009·Granted Jan 24, 2012·2 cites·16 claims
- 0757US9313898B2Low viscosity polymeric printing solutions and electronic components bearing polyimide based upon the low viscosity polymeric printing solutionsMENGEL MANFRED·Filed 2008·Granted Apr 12, 2016·0 cites·1 claims
- 0849US8076003B2Coating composition and a method of coatingMENGEL MANFRED·Filed 2008·Granted Dec 13, 2011·0 cites·26 claims
- 0948US9735126B2Solder alloys and arrangementsMENGEL MANFRED·Filed 2011·Granted Aug 15, 2017·0 cites·25 claims
- 1048US8110912B2Semiconductor deviceMENGEL MANFRED·Filed 2008·Granted Feb 7, 2012·0 cites·8 claims
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