Assignee
HEINRICH ALEXANDER
DE·5 granted patents·27 citations·filing 2009–2011
Top patents by PatentIndex Score
5 records- 0183US8177878B2Bonding material with exothermically reactive heterostructuresHEINRICH ALEXANDER·Filed 2009·Granted May 15, 2012·15 cites·15 claims
- 0279US9490193B2Electronic device with multi-layer contactHEINRICH ALEXANDER·Filed 2011·Granted Nov 8, 2016·4 cites·6 claims
- 0375US9010884B2Backing piece for attaching an electrical component to a housing wallHEINRICH ALEXANDER·Filed 2011·Granted Apr 21, 2015·5 cites·24 claims
- 0471US8802553B2Method for mounting a semiconductor chip on a carrierHEINRICH ALEXANDER·Filed 2011·Granted Aug 12, 2014·3 cites·24 claims
- 0547US9689561B2Lighting unit for a large electrical deviceHEINRICH ALEXANDER·Filed 2011·Granted Jun 27, 2017·0 cites·20 claims
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