Inventor · disambiguated record
Nicolay Kovarsky
Also filed as: KOVARSKY NICOLAY · KOVARSKY NICOLAY Y
15 granted patents·26 pending applications·231 citations·filing 2001–2011
93Inventor score
Top patents by PatentIndex Score
41 records- 0196US7935240B2Electroplating apparatus and method based on an array of anodesAPPLIED MATERIALS INC·Filed 2006·Granted May 3, 2011·37 cites·11 claims
- 0296US7670465B2Anolyte for copper platingAPPLIED MATERIALS INC·Filed 2006·Granted Mar 2, 2010·33 cites·25 claims
- 0393US7704352B2High-aspect ratio anode and apparatus for high-speed electroplating on a solar cell substrateAPPLIED MATERIALS INC·Filed 2006·Granted Apr 27, 2010·24 cites·28 claims
- 0492US7651934B2Process for electroless copper depositionAPPLIED MATERIALS INC·Filed 2006·Granted Jan 26, 2010·25 cites·41 claims
- 0583US8980382B2Oxygen-doping for non-carbon radical-component CVD filmsINGLE NITIN·Filed 2010·Granted Mar 17, 2015·15 cites·16 claims
- 0680US7837851B2In-situ profile measurement in an electroplating processAPPLIED MATERIALS INC·Filed 2005·Granted Nov 23, 2010·6 cites·31 claims
- 0777US7247222B2Electrochemical processing cellAPPLIED MATERIALS INC·Filed 2002·Granted Jul 24, 2007·18 cites·32 claims
- 0876US7128823B2Anolyte for copper platingAPPLIED MATERIALS INC·Filed 2003·Granted Oct 31, 2006·16 cites·31 claims
- 0976US6878258B2Apparatus and method for removing contaminants from semiconductor copper electroplating bathsAPPLIED MATERIALS INC·Filed 2002·Granted Apr 12, 2005·35 cites·52 claims
- 1068US7736928B2Precision printing electroplating through plating mask on a solar cell substrateAPPLIED MATERIALS INC·Filed 2006·Granted Jun 15, 2010·1 cites·25 claims
- 1163US6852209B2Insoluble electrode for electrochemical operations on substratesAPPLIED MATERIALS INC·Filed 2002·Granted Feb 8, 2005·8 cites·29 claims
- 1263US6685815B2Electroplating of semiconductor wafersAPPLIED MATERIALS INC·Filed 2002·Granted Feb 3, 2004·3 cites·18 claims
- 1360US6773569B2Potential pulse-scan methods of analyzing organic additives in plating baths with multi-component additivesAPPLIED MATERIALS INC·Filed 2002·Granted Aug 10, 2004·3 cites·46 claims
- 1460US2006266655A1Multiple chemistry electrochemical plating methodSUN ZHI-WEN·Filed 2006·Application pending·0 cites
- 1558US7273535B2Insoluble anode with an auxiliary electrodeAPPLIED MATERIALS INC·Filed 2003·Granted Sep 25, 2007·7 cites·15 claims
- 1658US2011031113A1Electroplating apparatusLOPATIN SERGEY·Filed 2010·Application pending·0 cites
- 1757US2006108228A1Method of stabilizing additive concentrations in an electroplating bath for interconnect formationAPPLIED MATERIALS INC·Filed 2005·Application pending·0 cites
- 1854US2008128019A1Method of metallizing a solar cell substrateAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
- 1951US2007181441A1Method and apparatus for electropolishingAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
- 2050US2004154926A1Multiple chemistry electrochemical plating methodFiled 2003·Application pending·0 cites
- 2149US2006124468A1Contact plating apparatusAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
- 2249US2006237307A1Electrochemical processing cellAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
- 2349US2005274620A1Copper replenishment system for interconnect applicationsKOVARSKY NICOLAY Y·Filed 2004·Application pending·0 cites
- 2448US2005016857A1Stabilization of additives concentration in electroplating baths for interconnect formationAPPLIED MATERIALS INC·Filed 2003·Application pending·0 cites
- 2548US2005218000A1Conditioning of contact leads for metal plating systemsAPPLIED MATERIALS INC·Filed 2005·Application pending·0 cites
- 2648US2008092947A1Pulse plating of a low stress film on a solar cell substrateAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
- 2747US2011198229A1Electroplating apparatus based on an array of anodesAPPLIED MATERIALS INC·Filed 2011·Application pending·0 cites
- 2847US2005133374A1Method and apparatus for acid and additive breakdown removal from copper electrodeposition bathAPPLIED MATERIALS INC·Filed 2003·Application pending·0 cites
- 2946US2005082172A1Copper replenishment for copper plating with insoluble anodeAPPLIED MATERIALS INC·Filed 2003·Application pending·0 cites
- 3045US2011031112A1In-situ profile measurement in an electroplating processBIRANG MANOOCHER·Filed 2010·Application pending·0 cites
- 3144US2004000491A1Electroplating cell with copper acid correction module for substrate interconnect formationAPPLIED MATERIALS INC·Filed 2002·Application pending·0 cites
- 3243US2003201191A1Electrochemical method for direct organic additives analysis in copper bathsAPPLIED MATERIALS INC·Filed 2002·Application pending·0 cites
- 3343US2003029726A1Apparatus and method of evaluating electroplating solutions and conditionsAPPLIED MATERIALS INC·Filed 2001·Application pending·0 cites
- 3442US7025861B2Contact plating apparatusAPPLIED MATERIALS INC·Filed 2003·Granted Apr 11, 2006·0 cites·15 claims
- 3539US2005145499A1Plating of a thin metal seed layerAPPLIED MATERIALS INC·Filed 2005·Application pending·0 cites
- 3639US2007125657A1Method of direct plating of copper on a substrate structureSUN ZHI-WEN·Filed 2005·Application pending·0 cites
- 3738US2005284751A1Electrochemical plating cell with a counter electrode in an isolated anolyte compartmentKOVARSKY NICOLAY·Filed 2004·Application pending·0 cites
- 3838US2004026255A1Insoluble anode loop in copper electrodeposition cell for interconnect formationAPPLIED MATERIALS INC·Filed 2003·Application pending·0 cites
- 3938US2004134775A1Electrochemical processing cellAPPLIED MATERIALS INC·Filed 2003·Application pending·0 cites
- 4037US2011136347A1Point-of-use silylamine generationAPPLIED MATERIALS INC·Filed 2010·Application pending·0 cites
- 4136US2005274622A1Plating chemistry and method of single-step electroplating of copper on a barrier metalSUN ZHI-WEN·Filed 2004·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →