Electroplating apparatus based on an array of anodes

Abstract

The present invention generally relates to apparatus and methods for plating conductive materials on a substrate. One embodiment of the present invention provides an apparatus for plating a conductive material on a substrate. The apparatus comprises a fluid basin configured to retain an electrolyte, a contact ring configured to support the substrate and contact the substrate electrically, and an anode assembly disposed in the fluid basin, wherein the anode assembly comprises a plurality of anode elements arranged in rows.

1 . An apparatus for electrochemically plating a conductive material on a substrate, comprising:
 a fluid basin for retaining an electrolyte;   a contact ring configured to support the substrate, contact the substrate electrically, and position the substrate in the fluid basin; and   an anode assembly comprising a plurality of anode elements arranged in a grid and disposed in the fluid basin, wherein the plurality of anode elements are independently operable to implement a symmetrical patterned bias or a non-symmetrical patterned bias.   
     
     
         2 . The apparatus of  claim 1 , wherein the plurality of anode elements form a plurality of zones, each of the plurality of zones comprises one or more of the plurality of anode elements and each of the plurality of zones is independently biasable relative to another of the plurality of zones. 
     
     
         3 . The apparatus of  claim 2 , wherein the anode assembly further comprises a frame member having a plurality of openings, and each of the plurality of openings has a respective one of the plurality of anode elements secured therein. 
     
     
         4 . The apparatus of  claim 2 , wherein the anode assembly further comprises a printed circuit board having a plurality of conductive plates, each of the plurality of anode elements is coupled to the printed circuit board at a corresponding conductive plate, and each of the plurality of anode elements is connected to a power supply through a path formed on the printed circuit board. 
     
     
         5 . The apparatus of  claim 4 , wherein the anode assembly further comprises one or more connectors for connecting adjacent anode elements to form the plurality of zones. 
     
     
         6 . The apparatus of  claim 1 , wherein each of the plurality of anode elements comprises:
 a head having an anode surface; and   a rod extending from an opposite side of the anode surface on the head.   
     
     
         7 . The apparatus of  claim 6 , wherein the anode surface has a shape selected from the group consisting of a hexagon, a rectangle, a triangle, a square, and a circle. 
     
     
         8 . The apparatus of  claim 2 , wherein the plurality of zones having a concentric arrangement. 
     
     
         9 . The apparatus of  claim 2 , wherein the plurality of zones have a linear and parallel arrangement. 
     
     
         10 . An electrochemical plating system, comprising:
 a fluid basin for retaining an electrolyte;   a substrate support having a contact ring configured to contact a substrate electrically; and   an anode assembly comprising:
 a grid of anode elements disposed in the fluid basin; and 
 a wiring means connecting the grid of anode elements, wherein the wiring means divides the grid of anode elements into a plurality of zones, each of the plurality of zones is independently operable to implement a symmetrical patterned bias or a non-symmetrical patterned bias. 
   
     
     
         11 . The system of  claim 10 , wherein the wiring means comprises a printed circuit board having a plurality of conductive plates, each of the plurality of anode elements is coupled to the printed circuit board at a corresponding conductive plate, and each of the plurality of anode elements is connected to a power supply through a path formed on the printed circuit board. 
     
     
         12 . The system of  claim 11 , wherein the wiring means further comprises one or more connectors for connecting adjacent anode elements to form the plurality of zones. 
     
     
         13 . The system of  claim 10 , wherein each of the plurality of anode elements has a top surface selected from a group consisting of a hexagon, a rectangle, a triangle, a square, and a circle. 
     
     
         14 . A method for electrochemically plating a conductive material on a substrate, comprising:
 contacting a substrate to a contact ring;   immersing the substrate in an electrolyte retained a fluid basin; and   applying a plating bias between the contact ring and a plurality of zones arranged in a grid of anode elements in the fluid basin, wherein applying a plating bias comprises:
 biasing at least a first zone of the plurality of zones independently relative to a second zone of the plurality of zones. 
   
     
     
         15 . The method of  claim 14 , wherein applying the plating bias comprises symmetrically biasing the plurality of zones. 
     
     
         16 . The method of  claim 14 , wherein applying the plating bias comprises non-symmetrically biasing the plurality of zones. 
     
     
         17 . The method of  claim 14 , wherein applying the plating bias comprises:
 electrically connecting the anode elements in each of the plurality of zones through a path formed in a printed circuit board.   
     
     
         18 . The method of  claim 14 , wherein immersing the substrate in the electrolyte comprises:
 dividing the grid of anode elements is divided into a plurality of parallel zones; and   powering each of the plurality of parallel zones independently.   
     
     
         19 . The method of  claim 18 , wherein immersing the substrate in the electrolyte further comprises applying immersing bias to the respective parallel zones corresponding to immersed portion of the substrate. 
     
     
         20 . The method of  claim 14 , further comprising:
 sensing potential or current in the electrolyte; and   adjusting the bias applied to the grid of anode elements.