Electrochemical processing cell
Abstract
Embodiments of the invention may generally provide a small volume electrochemical plating cell. The plating cell generally includes a fluid basin configured to contain a plating solution therein, the fluid basin having a substantially horizontal weir. The cell further includes an anode positioned in a lower portion of the fluid basin, the anode having a plurality of parallel channels formed therethrough, and a base member configured to receive the anode, the base member having a plurality of groves formed into an anode receiving surface, each of the plurality of grooves terminating into an annular drain channel. A membrane support assembly configured to position a membrane immediately above the anode in a substantially planar orientation with respect to the anode surface is provided, the membrane support assembly having a plurality of channels and bores formed therein.
Claims
exact text as granted — not AI-modified1 . An anode used to electrochemically plate a metal on a substrate, comprising a substantially disk-shaped member having a plurality slots formed therethrough.
2 . The anode of claim 1 , wherein substantially disk-shaped member is manufactured from a metal that is to be plated in an electrochemical plating process.
3 . The anode of claim 1 , wherein substantially disk-shaped member is made of copper.
4 . The anode of claim 1 , wherein the plurality of slots comprise a plurality of longer segments and a plurality of shorter segments, each of the plurality of longer segments being positioned in longitudinal abutment with a corresponding one of the plurality of shorter segments and separated therefrom by a remaining portion of the anode.
5 . An anode used in an electrochemical plating cell, comprising:
a substantially disk-shaped member having a plurality slots formed therethrough, wherein the plurality of slots are aligned parallel to a first direction.
6 . The anode of claim 5 , wherein substantially disk-shaped member is manufactured from a metal that is to be plated in an electrochemical plating process.
7 . The anode of claim 5 , wherein substantially disk-shaped member is made of copper.
8 . The anode of claim 5 , wherein the plurality of slots comprise one or more slots that have a first length and one or more slots that are a second length, wherein the first length is longer than the second length.
9 . An anode used in an electrochemical plating cell, comprising:
a substantially disk-shaped member having a plurality slots formed therethrough, wherein the plurality of slots are aligned parallel to a first direction and the plurality of slots comprise:
a first group of slots that includes at least a first slot that is a first length and has a first end, and a second slot that is a second length and has a second end, wherein the second slot and the first slot are oriented so that they form a first space between the first end and the second end; and
a second group of slots that are parallel to the first group of slots and the first direction, wherein the second group of slots includes at least a third slot that is a third length and has a third end, and a fourth slot that is a fourth length and has a fourth end, wherein the fourth slot and the third slot are oriented so that they form a second space between the third end and the fourth end.
10 . The anode of claim 9 , wherein the second slot and the first slot are oriented so that they are collinear and the fourth slot and the third slot are oriented so that they are collinear.
11 . The anode of claim 9 , wherein the first and second group of slots are spaced a distance apart in a direction substantially perpendicular to the first direction.
12 . The anode of claim 9 , wherein substantially disk-shaped member is manufactured from a metal that is to be plated in an electrochemical plating process.
13 . The anode of claim 9 , wherein substantially disk-shaped member is made of copper.Join the waitlist — get patent alerts
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