Inventor · disambiguated record
Raghuveer R. Patlolla
Also filed as: PATLOLLA RAGHUVEER · PATLOLLA RAGHUVEER R · PATLOLLA RAGHUVEER REDDY
49 granted patents·11 pending applications·162 citations·filing 2013–2024
97Inventor score
Top patents by PatentIndex Score
60 records- 0198US9685406B1Selective and non-selective barrier layer wet removalIBM·Filed 2016·Granted Jun 20, 2017·34 cites·14 claims
- 0297US10204829B1Low-resistivity metallic interconnect structures with self-forming diffusion barrier layersIBM·Filed 2018·Granted Feb 12, 2019·21 cites·13 claims
- 0397US9859218B1Selective surface modification of interconnect structuresIBM·Filed 2016·Granted Jan 2, 2018·16 cites·11 claims
- 0493US10002831B2Selective and non-selective barrier layer wet removalIBM·Filed 2017·Granted Jun 19, 2018·7 cites·15 claims
- 0593US9806023B1Selective and non-selective barrier layer wet removalIBM·Filed 2017·Granted Oct 31, 2017·8 cites·20 claims
- 0692US10699945B2Back end of line integration for interconnectsIBM·Filed 2018·Granted Jun 30, 2020·5 cites·16 claims
- 0792US10096769B2Bottom electrode for MRAM applicationsIBM·Filed 2017·Granted Oct 9, 2018·7 cites·20 claims
- 0891US9881833B1Barrier planarization for interconnect metallizationIBM·Filed 2016·Granted Jan 30, 2018·6 cites·16 claims
- 0991US9190285B1Rework and stripping of complex patterning layers using chemical mechanical polishingIBM·Filed 2014·Granted Nov 17, 2015·11 cites·19 claims
- 1087US10559530B2Forming dual metallization interconnect structures in single metallization levelIBM·Filed 2017·Granted Feb 11, 2020·4 cites·12 claims
- 1187US9275874B2Methods for fabricating integrated circuits using chemical mechanical planarization to recess metalGLOBALFOUNDRIES INC·Filed 2013·Granted Mar 1, 2016·7 cites·19 claims
- 1285US10910307B2Back end of line metallization structureIBM·Filed 2018·Granted Feb 2, 2021·3 cites·16 claims
- 1385US10903161B2Back end of line metallization structureIBM·Filed 2019·Granted Jan 26, 2021·3 cites·20 claims
- 1485US9837350B2Semiconductor interconnect structure with double conductorsIBM·Filed 2016·Granted Dec 5, 2017·3 cites·13 claims
- 1585US9666529B2Method and structure to reduce the electric field in semiconductor wiring interconnectsIBM·Filed 2015·Granted May 30, 2017·4 cites·11 claims
- 1684US2024395702A1Semiconductor interconnect structure with double conductorsTESSERA LLC·Filed 2024·Application pending·0 cites
- 1782US10832917B2Low oxygen cleaning for CMP equipmentIBM·Filed 2017·Granted Nov 10, 2020·3 cites·11 claims
- 1881US11018087B2Metal interconnectsIBM·Filed 2018·Granted May 25, 2021·2 cites·6 claims
- 1979US10461248B2Bottom electrode for MRAM applicationsIBM·Filed 2018·Granted Oct 29, 2019·2 cites·13 claims
- 2079US10211153B2Low aspect ratio interconnectIBM·Filed 2016·Granted Feb 19, 2019·2 cites·13 claims
- 2178US11133457B2Controllable formation of recessed bottom electrode contact in a memory metallization stackIBM·Filed 2019·Granted Sep 28, 2021·1 cites·11 claims
- 2278US10741748B2Back end of line metallization structuresIBM·Filed 2018·Granted Aug 11, 2020·2 cites·6 claims
- 2375US9379057B2Method and structure to reduce the electric field in semiconductor wiring interconnectsHUANG ELBERT EMIN·Filed 2014·Granted Jun 28, 2016·4 cites·9 claims
- 2473US9640514B1Wafer bonding using boron and nitrogen based bonding stackGLOBALFOUNDRIES INC·Filed 2016·Granted May 2, 2017·2 cites·17 claims
- 2572US12087685B2Semiconductor interconnect structure with double conductorsTESSERA LLC·Filed 2020·Granted Sep 10, 2024·0 cites·21 claims
- 2672US11031337B2Forming dual metallization interconnect structures in single metallization levelIBM·Filed 2019·Granted Jun 8, 2021·1 cites·14 claims
- 2772US11031250B2Semiconductor structures of more uniform thicknessIBM·Filed 2018·Granted Jun 8, 2021·1 cites·12 claims
- 2872US10686126B2Back end of line metallization structuresIBM·Filed 2019·Granted Jun 16, 2020·1 cites·9 claims
- 2971US10373867B2Cobalt contact and interconnect structuresIBM·Filed 2017·Granted Aug 6, 2019·1 cites·19 claims
- 3069US10177030B2Cobalt contact and interconnect structuresIBM·Filed 2017·Granted Jan 8, 2019·1 cites·1 claims
- 3163US2020328156A1Low aspect ratio interconnectTESSERA INC·Filed 2020·Application pending·0 cites
- 3262US10672707B2Low aspect ratio interconnectTESSERA INC·Filed 2019·Granted Jun 2, 2020·0 cites·20 claims
- 3360US11031339B2Metal interconnectsIBM·Filed 2019·Granted Jun 8, 2021·0 cites·13 claims
- 3460US10896846B2Controlling performance and reliability of conductive regions in a metallization networkIBM·Filed 2019·Granted Jan 19, 2021·0 cites·20 claims
- 3559US11037875B2Forming dual metallization interconnect structures in single metallization levelIBM·Filed 2019·Granted Jun 15, 2021·0 cites·20 claims
- 3659US2020219759A1Back end of line integration for interconnectsIBM·Filed 2020·Application pending·0 cites
- 3758US10714382B2Controlling performance and reliability of conductive regions in a metallization networkIBM·Filed 2018·Granted Jul 14, 2020·0 cites·15 claims
- 3857US11205587B2Liner and cap structures for reducing local interconnect vertical resistance without compromising reliabilityIBM·Filed 2019·Granted Dec 21, 2021·0 cites·20 claims
- 3957US10804193B2Semiconductor interconnect structure with double conductorsTESSERA INC·Filed 2017·Granted Oct 13, 2020·0 cites·8 claims
- 4057US2024090353A1Sub-euv patterning heaters for bar mushroom cell pcmIBM·Filed 2022·Application pending·0 cites
- 4156US11804378B2Surface conversion in chemical mechanical polishingIBM·Filed 2021·Granted Oct 31, 2023·0 cites·20 claims
- 4256US10373909B2Selective surface modification of interconnect structuresIBM·Filed 2017·Granted Aug 6, 2019·0 cites·13 claims
- 4354US10685876B2Liner and cap structures for reducing local interconnect vertical resistance without compromising reliabilityIBM·Filed 2018·Granted Jun 16, 2020·0 cites·17 claims
- 4453US12107008B2Maskless alignment scheme for BEOL memory array manufacturingIBM·Filed 2021·Granted Oct 1, 2024·0 cites·20 claims
- 4553US2018114719A1Barrier planarization for interconnect metallizationIBM·Filed 2017·Application pending·0 cites
- 4652US11664271B2Dual damascene with short linerIBM·Filed 2019·Granted May 30, 2023·0 cites·14 claims
- 4752US11164878B2Interconnect and memory structures having reduced topography variation formed in the BEOLIBM·Filed 2020·Granted Nov 2, 2021·0 cites·20 claims
- 4852US11094527B2Wet clean solutions to prevent pattern collapseIBM·Filed 2018·Granted Aug 17, 2021·0 cites·20 claims
- 4952US10833122B2Bottom electrode and dielectric structure for MRAM applicationsIBM·Filed 2019·Granted Nov 10, 2020·0 cites·16 claims
- 5052US2019221477A1Low-resistivity metallic interconnect structures with self-forming diffusion barrier layersIBM·Filed 2018·Application pending·0 cites
Showing the top 50 of 60 patent records by PatentIndex Score.
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