Inventor · disambiguated record
Nobuo Kawahashi
Also filed as: KAWAHASHI NOBUO
32 granted patents·17 pending applications·865 citations·filing 1990–2008
98Inventor score
Top patents by PatentIndex Score
49 records- 0195US5318797ACoated particles, hollow particles, and process for manufacturing the sameUNIV CLARKSON·Filed 1990·Granted Jun 7, 1994·132 cites·14 claims
- 0294US6579153B2Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing processJSR CORP·Filed 2001·Granted Jun 17, 2003·101 cites·33 claims
- 0393US6527818B2Aqueous dispersion for chemical mechanical polishingJSR CORP·Filed 2001·Granted Mar 4, 2003·77 cites·16 claims
- 0492US6582761B1Method of production of composited particle, composited particle produced by this method and aqueous dispersion for chemical mechanical polishing containing this composited particle, and method of production of aqueous dispersion for chemical mechanical polishingJSR CORP·Filed 2000·Granted Jun 24, 2003·64 cites·21 claims
- 0591US6790883B2Composition for polishing pad and polishing pad using the sameJSR CORP·Filed 2001·Granted Sep 14, 2004·36 cites·18 claims
- 0690US7077879B2Composition for polishing pad and polishing pad using the sameJSR CORP·Filed 2004·Granted Jul 18, 2006·28 cites·10 claims
- 0790US6447695B1Aqueous dispersion composition for chemical mechanical polishing for use in manufacture of semiconductor devicesJSR CORP·Filed 2000·Granted Sep 10, 2002·52 cites·21 claims
- 0889US6832949B2Window member for chemical mechanical polishing and polishing padJSR CORP·Filed 2002·Granted Dec 21, 2004·44 cites·24 claims
- 0988US7498294B2Cleaning composition, method for cleaning semiconductor substrate, and process for manufacturing semiconductor deviceJSR CORP·Filed 2005·Granted Mar 3, 2009·15 cites·16 claims
- 1083US7183211B2Process for chemical mechanical polishing of semiconductor substrate and aqueous dispersion for chemical mechanical polishingJSR CORP·Filed 2003·Granted Feb 27, 2007·29 cites·51 claims
- 1183US6924227B2Slurry for chemical mechanical polishing and method of manufacturing semiconductor deviceJSR CORP·Filed 2001·Granted Aug 2, 2005·28 cites·20 claims
- 1282US7005382B2Aqueous dispersion for chemical mechanical polishing, chemical mechanical polishing process, production process of semiconductor device and material for preparing an aqueous dispersion for chemical mechanical polishingTOSHIBA KK·Filed 2003·Granted Feb 28, 2006·30 cites·8 claims
- 1381US6992123B2Polishing padJSR CORP·Filed 2003·Granted Jan 31, 2006·28 cites·31 claims
- 1481US6383240B1Aqueous dispersion for chemical mechanical polishingJSR CORP·Filed 2000·Granted May 7, 2002·26 cites·26 claims
- 1580US7252782B2Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing methodJSR CORP·Filed 2005·Granted Aug 7, 2007·7 cites·18 claims
- 1680US6935928B2Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing methodTOSHIBA KK·Filed 2004·Granted Aug 30, 2005·24 cites·20 claims
- 1778US7183213B2Chemical mechanical polishing pad and chemical mechanical polishing methodJSR CORP·Filed 2004·Granted Feb 27, 2007·18 cites·10 claims
- 1878US6786944B2Aqueous dispersion for chemical mechanical polishingJSR CORP·Filed 2003·Granted Sep 7, 2004·22 cites·20 claims
- 1978US6740629B2Composition for washing a polishing pad and method for washing a polishing padJSR CORP·Filed 2002·Granted May 25, 2004·17 cites·18 claims
- 2073US6559056B2Aqueous dispersion for chemical mechanical polishingJSR CORP·Filed 2001·Granted May 6, 2003·15 cites·18 claims
- 2172US7323415B2Polishing pad for semiconductor wafer, polishing multilayered body for semiconductor wafer having same, and method for polishing semiconductor waferJSR CORP·Filed 2004·Granted Jan 29, 2008·14 cites·27 claims
- 2271US6653267B2Aqueous dispersion for chemical mechanical polishing used for polishing of copperTOSHIBA KK·Filed 2001·Granted Nov 25, 2003·13 cites·14 claims
- 2365US7378349B2Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing methodJSR CORP·Filed 2005·Granted May 27, 2008·2 cites·8 claims
- 2462US7163448B2Chemical/mechanical polishing method for STIJSR CORP·Filed 2004·Granted Jan 16, 2007·10 cites·8 claims
- 2558US7090786B2Aqueous dispersion for chemical/mechanical polishingJSR CORP·Filed 2004·Granted Aug 15, 2006·4 cites·9 claims
- 2658US7087530B2Aqueous dispersion for chemical mechanical polishingTOSHIBA KK·Filed 2003·Granted Aug 8, 2006·5 cites·14 claims
- 2754US6976910B2Polishing padJSR CORP·Filed 2004·Granted Dec 20, 2005·5 cites·15 claims
- 2853US2008274620A1Chemical mechanical polishing agent kit and chemical mechanical polishing method using the sameJSR CORP·Filed 2008·Application pending·0 cites
- 2948US7153369B2Method of chemical mechanical polishingJSR CORP·Filed 2002·Granted Dec 26, 2006·2 cites·29 claims
- 3048US5457167APolyorganosiloxane-type thermoplastic resinJAPAN SYNTHETIC RUBBER CO LTD·Filed 1994·Granted Oct 10, 1995·8 cites·10 claims
- 3147US7442116B2Chemical mechanical polishing padJSR CORP·Filed 2004·Granted Oct 28, 2008·1 cites·8 claims
- 3246US2004224611A1Polishing pad and method of polishing a semiconductor waferJSR CORP·Filed 2004·Application pending·0 cites
- 3344US5773532AProcess for producing a polyorganosiloxane-based thermoplastic resinJAPAN SYNTHETIC RUBBER CO LTD·Filed 1997·Granted Jun 30, 1998·8 cites·13 claims
- 3444US2004224616A1Polishing pad and chemical mechanical polishing methodJSR CORP·Filed 2004·Application pending·0 cites
- 3543US2004237413A1Chemical mechanical polishing agent kit and chemical mechanical polishing method using the sameJSR CORP·Filed 2004·Application pending·0 cites
- 3642US2006276041A1Chemical mechanical polishing aqueous dispersion, chemical mechanical polishing method, and kit for preparing chemical mechanical polishing aqueous dispersionJSR CORP·Filed 2006·Application pending·0 cites
- 3741US7550020B2Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing methodJSR CORP·Filed 2005·Granted Jun 23, 2009·0 cites·8 claims
- 3841US2005245171A1Chemical mechanical polishing pad, manufacturing process thereof and chemical mechanical polishing method for semiconductor wafersJSR CORP·Filed 2005·Application pending·0 cites
- 3941US2006201914A1Chemical mechanical polishing aqueous dispersion, chemical mechanical polishing method, and kit for preparing chemical mechanical polishing aqueous dispersionJSR CORP·Filed 2006·Application pending·0 cites
- 4041US2005222336A1Chemical mechanical polishing pad, production method thereof, and chemical mechanical polishing processJSR CORP·Filed 2005·Application pending·0 cites
- 4140US2004063391A1Composition for polishing pad and polishing pad therewithJSR CORP·Filed 2003·Application pending·0 cites
- 4239US2005284844A1Cleaning composition for semiconductor components and process for manufacturing semiconductor deviceJSR CORP·Filed 2005·Application pending·0 cites
- 4339US2001049912A1Aqueous dispersion for chemical mechanical polishingJSR CORP·Filed 2001·Application pending·0 cites
- 4439US2004203320A1Abrasive pad, method and metal mold for manufacturing the same, and semiconductor wafer polishing methodJSR CORP·Filed 2004·Application pending·0 cites
- 4539US2005239380A1Chemical mechanical polishing pad, manufacturing process thereof and chemical mechanical polishing methodJSR CORP·Filed 2005·Application pending·0 cites
- 4638US2004266326A1Method of machining semiconductor wafer-use polishing pad and semiconductor wafer-use polishing padFiled 2003·Application pending·0 cites
- 4738US2004162011A1Aqueous dispersion for chemical mechanical polishing and production process of semiconductor deviceJSR CORP·Filed 2003·Application pending·0 cites
- 4836US2004014413A1Polishing pad and multi-layer polishing padJSR CORP·Filed 2003·Application pending·0 cites
- 4936US2002005017A1Aqueous dispersion for chemical mechanical polishingJSR CORP·Filed 2001·Application pending·0 cites
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