Polishing pad and multi-layer polishing pad

Abstract

The present invention intends to provide a polishing pad and a multi-layer polishing pad that can particularly effectively suppress scratch from occurring. The polishing pad of the invention comprises at least one part selected from a groove (a) having at least one kind of shape selected from annular, lattice-like and spiral form on a polishing surface side, a concave portion (b) and a through hole (c). In the above, surface roughness of an inner surface of the part is 20 μm or less and the polishing pad is used for chemical mechanical polishing.

What is claimed is:  
     
         1 . A polishing pad comprising: 
 at least one part selected from the group consisting of a groove (a) having at least one kind of shape selected from annular, lattice-like and spiral form on a polishing surface side, a concave portion (b) and a through hole (c);    wherein surface roughness of an inner surface of said part is 20 μm or less; and    wherein said polishing pad is used for chemical mechanical polishing.    
     
     
         2 . The polishing pad according to  claim 1 , wherein a depth of said groove (a) is 0.1 mm or more and a width thereof is 0.1 mm or more.  
     
     
         3 . The polishing pad according to  claim 1 , wherein said groove (a) is formed concentrically.  
     
     
         4 . The polishing pad according to  claim 1 , wherein a depth of said concave portion (b) is 0.1 mm or more, and a minimum length of an opening thereof is 0.1 mm or more.  
     
     
         5 . The polishing pad according to  claim 1 , wherein a minimum length of an opening of said through hole (c) is 0.1 mm or more.  
     
     
         6 . The polishing pad according to  claim 1 , wherein an area of an opening of one said concave portion (b) is 0.0075 mm 2  or more.  
     
     
         7 . The polishing pad according to  claim 1 , wherein an area of an opening of one said through hole (c) is 0.0075 mm 2  or more.  
     
     
         8 . The polishing pad according to  claim 1 , wherein a minimum length between adjacent openings of each of said groove (a), said concave portion (b) and said through hole (c) is 0.05 mm or more.  
     
     
         9 . The polishing pad according to  claim 1 , wherein at least part of said polishing pad comprises a water-insoluble matrix that contains a crosslinked polymer and a water-soluble particle dispersed in said water-insoluble matrix.  
     
     
         10 . The polishing pad according to  claim 1 , wherein said groove (a), said concave portion (b) and said through hole (c) are formed by a method selected from cutting and die forming.  
     
     
         11 . A multi-layer polishing pad comprising: 
 a polishing layer comprising at least one part selected from the group consisting of a groove (a) having at least one kind of shape selected from annular, lattice-like and spiral form on a polishing surface side, a concave portion (b) and a through hole (c);    wherein surface roughness of an inner surface of said part is 20 μm or less; and    a supporting layer laminated on a non-polishing surface side of said polishing layer;    wherein said multi-layer polishing pad is used for chemical mechanical polishing.    
     
     
         12 . The multi-layer polishing pad according to  claim 11 , wherein a depth of said groove (a) is 0.1 mm or more and a width thereof is 0.1 mm or more.  
     
     
         13 . The multi-layer polishing pad according to  claim 11 , wherein said groove (a) is formed concentrically.  
     
     
         14 . The multi-layer polishing pad according to  claim 11 , wherein a depth of said concave portion (b) is 0.1 mm or more, and a minimum length of an opening thereof is 0.1 mm or more.  
     
     
         15 . The multi-layer polishing pad according to  claim 11 , wherein a minimum length of an opening of said through hole (c) is 0.1 mm or more.  
     
     
         16 . The multi-layer polishing pad according to  claim 11 , wherein an area of an opening of one said concave portion (b) is 0.0075 mm 2  or more.  
     
     
         17 . The multi-layer polishing pad according to  claim 11 , wherein an area of an opening of one said through hole (c) is 0.0075 mm 2  or more.  
     
     
         18 . The multi-layer polishing pad according to  claim 11 , wherein a minimum length between adjacent openings of each of said groove (a), said concave portion (b) and said through hole (c) is 0.05 mm or more.  
     
     
         19 . The multi-layer polishing pad according to  claim 11 , wherein at least part of said polishing layer comprises a water-insoluble matrix that contains a crosslinked polymer and a water-soluble particle dispersed in said water-insoluble matrix.  
     
     
         20 . The multi-layer polishing pad according to  claim 11 , wherein said groove (a), said concave portion (b) and said through hole (c) are formed by a method selected from cutting and die forming.