Composition for polishing pad and polishing pad therewith

Abstract

An objective of the present invention is to provide a composition for polishing pad that is excellent in formability, abrasion resistance and small in temperature dependence of Young's modulus and a polishing pad therewith. The composition for polishing pad of the present invention comprises a water-insoluble matrix and a water-soluble particle dispersed in the water-insoluble matrix. The water-insoluble matrix contains a crosslinked ethylene-vinyl acetate copolymer and/or a crosslinked 1,2-polybutadiene and each of these is contained by a prescribed amount against the total of the water-insoluble matrix.

What is claimed is:  
     
         1 . A composition for polishing pad comprising a water-insoluble matrix and a water-soluble particle dispersed in said water-insoluble matrix, 
 wherein said water-insoluble matrix contains a crosslinked ethylene-vinyl acetate copolymer and does not contain crosslinked 1,2-polybutadiene; and a content of said crosslinked ethylene-vinyl acetate copolymer is 10% by weight or more based on 100% by weight of the total of said water-insoluble matrix.    
     
     
         2 . A composition for polishing pad obtained by subjecting a crosslinkable polymer composition comprising an uncrosslinked water-insoluble polymer and a water-soluble particle to a crosslinking treatment, 
 wherein said uncrosslinked water-insoluble polymer contains uncrosslinked ethylene-vinyl acetate copolymer and does not contain uncrosslinked 1,2-polybutadiene; a content of said uncrosslinked ethylene-vinyl acetate copolymer is 10% by weight or more based on 100% by weight of a material to be a water-insoluble matrix; and at least one part of said uncrosslinked ethylene-vinyl acetate copolymer is crosslinked by said crosslinking treatment.    
     
     
         3 . A composition for polishing pad comprising a water-insoluble matrix and a water-soluble particle dispersed in said water-insoluble matrix, 
 wherein said water-insoluble matrix contains crosslinked 1,2-polybutadiene and other crosslinked polymer except for crosslinked ethylene-vinyl acetate copolymer; and a content of said crosslinked 1,2-polybutadiene is 10% by weight or more based on 100% by weight of the total of said water-insoluble matrix.    
     
     
         4 . A composition for polishing pad obtained by subjecting a crosslinkable polymer composition comprising an uncrosslinked water-insoluble polymer and a water-soluble particle to a crosslinking treatment, 
 wherein said uncrosslinked water-insoluble polymer contains uncrosslinked 1,2-polybutadiene and other crosslinkable polymer except for uncrosslinked ethylene-vinyl acetate copolymer; a content of said uncrosslinked 1,2-polybutadiene is 10% by weight or more based on 100% by weight of the total of a material to be a water-insoluble matrix; and at least one part of said uncrosslinked 1,2-polybutadiene is crosslinked by said crosslinking treatment.    
     
     
         5 . A composition for polishing pad comprising a water-insoluble matrix and a water-soluble particle dispersed in said water-insoluble matrix, 
 wherein said water-insoluble matrix contains crosslinked ethylene-vinyl acetate copolymer and crosslinked 1,2-polybutadiene; and a content of said crosslinked ethylene-vinyl acetate copolymer or said crosslinked 1,2-polybutadiene is 10% by weight or more based on 100% by weight of the total of said water-insoluble matrix.    
     
     
         6 . The composition for polishing pad according to  claim 5 , wherein a content of said crosslinked ethylene-vinyl acetate copolymer is 10% by weight or more based on 100% by weight of the total of said water-insoluble matrix; and a content of said crosslinked ethylene-vinyl acetate copolymer is exceeding 50% by weight based on 100% by weight of the total of said crosslinked 1,2-polybutadiene and said crosslinked ethylene-vinyl acetate copolymer.  
     
     
         7 . The composition for polishing pad according to  claim 5 , wherein a content of said crosslinked 1,2-polybutadiene is 10% by weight or more based on 100% by weight of the total of said water-insoluble matrix; and a content of said crosslinked 1,2-polybutadiene is 50% by weight or more based on 100% by weight of the total of said crosslinked 1,2-polybutadiene and said crosslinked ethylene-vinyl acetate copolymer.  
     
     
         8 . A composition for polishing pad obtained by subjecting a crosslinkable polymer composition comprising an uncrosslinked water-insoluble polymer and a water-soluble particle to a crosslinking treatment, 
 wherein said uncrosslinked water-insoluble polymer contains uncrosslinked ethylene-vinyl acetate copolymer and uncrosslinked ethylene-vinyl acetate copolymer; a content of said uncrosslinked 1,2-polybutadiene or said uncrosslinked 1,2-polybutadiene is 10% by weight or more based on 100% by weight of the total of a material to be a water-insoluble matrix; and at least one part of said uncrosslinked ethylene-vinyl acetate copolymer and said uncrosslinked 1,2-polybutadiene is crosslinked by said crosslinking treatment.    
     
     
         9 . The composition for polishing pad according to  claim 8 , wherein a content of said uncrosslinked ethylene-vinyl acetate copolymer is 10% by weight or more based on 100% by weight of the total of said material to be a water-insoluble matrix; and a content of said uncrosslinked ethylene-vinyl acetate copolymer is exceeding 50% by weight based on 100% by weight of the total of said uncrosslinked 1,2-polybutadiene and said uncrosslinked ethylene-vinyl acetate copolymer.  
     
     
         10 . The composition for polishing pad according to  claim 8 , wherein a content of said uncrosslinked 1,2-polybutadiene is 10% by weight or more based on 100% by weight of the total of said material to be a water-insoluble matrix; and a content of said uncrosslinked 1,2-polybutadiene is 50% by weight or more based on 100% by weight of the total of said uncrosslinked 1,2-polybutadiene and said uncrosslinked ethylene-vinyl acetate copolymer.  
     
     
         11 . A polishing pad comprising a polishing part made of a composition for polishing pad set forth in any one of  claims 1  to  10 .