Inventor · disambiguated record
Yoshinori Shizuno
Also filed as: SHIZUNO YOSHINORI
41 granted patents·7 pending applications·447 citations·filing 1996–2015
98Inventor score
Files withOKI ELECTRIC IND CO LTD20IBIDEN CO LTD11OKI SEMICONDUCTOR CO LTD10SHIZUNO YOSHINORI3OUCHI SHINJI2
Top patents by PatentIndex Score
48 records- 0195US7087514B2Substrate having built-in semiconductor apparatus and manufacturing method thereofOKI ELECTRIC IND CO LTD·Filed 2005·Granted Aug 8, 2006·32 cites·10 claims
- 0294US9431347B2Wiring board and method for manufacturing the sameIBIDEN CO LTD·Filed 2014·Granted Aug 30, 2016·28 cites·20 claims
- 0391US9893016B2Multilayer wiring board having wiring structure for mounting multiple electronic components and method for manufacturing the sameIBIDEN CO LTD·Filed 2015·Granted Feb 13, 2018·8 cites·16 claims
- 0490US8381394B2Circuit board with embedded component and method of manufacturing sameOKI SEMICONDUCTOR CO LTD·Filed 2011·Granted Feb 26, 2013·11 cites·8 claims
- 0590US7568390B2Semiconductor acceleration sensor device and method for manufacturing the sameOKI SEMICONDUCTOR CO LTD·Filed 2005·Granted Aug 4, 2009·22 cites·6 claims
- 0689US9425159B2Wiring board and method for manufacturing the sameIBIDEN CO LTD·Filed 2014·Granted Aug 23, 2016·12 cites·20 claims
- 0783US7989706B2Circuit board with embedded component and method of manufacturing sameOKI SEMICONDUCTOR CO LTD·Filed 2005·Granted Aug 2, 2011·10 cites·9 claims
- 0883US5864174ASemiconductor device having a die pad structure for preventing cracks in a molding resinOKI ELECTRIC IND CO LTD·Filed 1996·Granted Jan 26, 1999·53 cites·6 claims
- 0981US7329598B2Method of manufacturing a semiconductor deviceOKI ELECTRIC IND CO LTD·Filed 2005·Granted Feb 12, 2008·10 cites·20 claims
- 1081US6177725B1Semiconductor device having an improved structure for preventing cracks, improved small-sized semiconductor and method of manufacturing the sameOKI ELECTRIC IND CO LTD·Filed 1998·Granted Jan 23, 2001·48 cites·13 claims
- 1180US7521807B2Semiconductor device with inclined through holesOKI SEMICONDUCTOR CO LTD·Filed 2006·Granted Apr 21, 2009·9 cites·17 claims
- 1279US6969916B2Substrate having built-in semiconductor apparatus and manufacturing method thereofOKI ELECTRIC IND CO LTD·Filed 2003·Granted Nov 29, 2005·23 cites·22 claims
- 1378US7227243B2Semiconductor deviceOKI ELECTRIC IND CO LTD·Filed 2005·Granted Jun 5, 2007·7 cites·14 claims
- 1476US7788976B2Semiconductor acceleration sensor device and method for manufacturing the sameOKI SEMICONDUCTOR CO LTD·Filed 2009·Granted Sep 7, 2010·5 cites·8 claims
- 1575US9035463B2Wiring board and method for manufacturing the sameIBIDEN CO LTD·Filed 2013·Granted May 19, 2015·4 cites·16 claims
- 1675US8755196B2Wiring board and method for manufacturing the sameOUCHI SHINJI·Filed 2011·Granted Jun 17, 2014·5 cites·20 claims
- 1774US6888222B2Semiconductor deviceOKI ELECTRIC IND CO LTD·Filed 2003·Granted May 3, 2005·18 cites·9 claims
- 1874US6569755B2Semiconductor device having an improved structure for preventing cracks, improved small sized semiconductor and method of manufacturing the sameOKI ELECTRIC IND CO LTD·Filed 2002·Granted May 27, 2003·16 cites·3 claims
- 1973US6841884B2Semiconductor deviceOKI ELECTRIC IND CO LTD·Filed 2003·Granted Jan 11, 2005·19 cites·14 claims
- 2071US6914327B2Semiconductor device and manufacturing method thereofOKI ELECTRIC IND CO LTD·Filed 2004·Granted Jul 5, 2005·17 cites·9 claims
- 2171US6459145B1Semiconductor device having an improved structure for preventing cracks, and improved small-sized semiconductorOKI ELECTRIC IND CO LTD·Filed 2000·Granted Oct 1, 2002·13 cites·16 claims
- 2269US6894384B1Semiconductor device and method of manufacturing the sameOKI ELECTRIC IND CO LTD·Filed 2000·Granted May 17, 2005·16 cites·8 claims
- 2368US7566638B2Method of dicing a semiconductor device into plural chipsOKI SEMICONDUCTOR CO LTD·Filed 2005·Granted Jul 28, 2009·2 cites·12 claims
- 2468US7375397B2Semiconductor device having an SOI structure and method for manufacturing the sameOKI ELECTRIC IND CO LTD·Filed 2006·Granted May 20, 2008·4 cites·14 claims
- 2567US7736944B2Semiconductor device with improved design freedom of external terminalOKI SEMICONDUCTOR CO LTD·Filed 2006·Granted Jun 15, 2010·3 cites·1 claims
- 2667US7151320B2Semiconductor device with improved design freedom of external terminalOKI ELECTRIC IND CO LTD·Filed 2003·Granted Dec 19, 2006·12 cites·14 claims
- 2764US8759691B2Wiring board and method for manufacturing the sameOUCHI SHINJI·Filed 2011·Granted Jun 24, 2014·2 cites·17 claims
- 2863US7053486B2Semiconductor device with improved design freedom of external terminalOKI ELECTRIC IND CO LTD·Filed 2003·Granted May 30, 2006·11 cites·12 claims
- 2962US7569419B2Method for manufacturing semiconductor device that includes mounting chip on board and sealing with two resinsOKI SEMICONDUCTOR CO LTD·Filed 2007·Granted Aug 4, 2009·2 cites·21 claims
- 3061US8659019B2Semiconductor deviceSHIZUNO YOSHINORI·Filed 2009·Granted Feb 25, 2014·2 cites·18 claims
- 3161US7323778B2Semiconductor device with improved design freedom of external terminalOKI ELECTRIC IND CO LTD·Filed 2003·Granted Jan 29, 2008·10 cites·19 claims
- 3260US8101435B2Fabrication method for semiconductor deviceSHIZUNO YOSHINORI·Filed 2011·Granted Jan 24, 2012·1 cites·15 claims
- 3360US7919336B2Fabrication method for semiconductor deviceOKI SEMICONDUCTOR CO LTD·Filed 2008·Granted Apr 5, 2011·1 cites·13 claims
- 3454US9433085B2Electronic component, method for manufacturing the same and method for manufacturing multilayer printed wiring boardIBIDEN CO LTD·Filed 2014·Granted Aug 30, 2016·0 cites·20 claims
- 3554US7525167B2Semiconductor device with simplified constitutionOKI SEMICONDUCTOR CO LTD·Filed 2003·Granted Apr 28, 2009·6 cites·12 claims
- 3652US8742323B2Semiconductor moduleSHIZUNO YOSHINORI·Filed 2009·Granted Jun 3, 2014·0 cites·18 claims
- 3752US2014231947A1Semiconductor moduleLAPIS SEMICONDUCTOR CO LTD·Filed 2014·Application pending·0 cites
- 3851US2014347837A1Wiring board and method for manufacturing the sameIBIDEN CO LTD·Filed 2014·Application pending·0 cites
- 3950US2014231990A1Wiring board and method for manufacturing the sameIBIDEN CO LTD·Filed 2014·Application pending·0 cites
- 4045US9480157B2Wiring board and method for manufacturing the sameIBIDEN CO LTD·Filed 2015·Granted Oct 25, 2016·0 cites·20 claims
- 4145US7049224B2Manufacturing method of electronic components embedded substrateOKI ELECTRIC IND CO LTD·Filed 2003·Granted May 23, 2006·1 cites·2 claims
- 4245US2015060127A1Combined printed wiring board and method for manufacturing the sameIBIDEN CO LTD·Filed 2014·Application pending·0 cites
- 4345US2015060124A1Combined printed wiring board and method for manufacturing the sameIBIDEN CO LTD·Filed 2014·Application pending·0 cites
- 4444US2014102768A1Wiring board and method for manufacturing the sameIBIDEN CO LTD·Filed 2013·Application pending·0 cites
- 4543US2005006728A1Semiconductor device and method of manufacturing the sameFiled 2003·Application pending·0 cites
- 4639US6852617B2Semiconductor device fabrication methodOKI ELECTRIC IND CO LTD·Filed 2004·Granted Feb 8, 2005·0 cites·26 claims
- 4738US7193330B2Semiconductor device with improved design freedom of external terminalOKI ELECTRIC IND CO LTD·Filed 2003·Granted Mar 20, 2007·0 cites·8 claims
- 4834US6188133B1Semiconductor with plurality of connecting parts arranged on lower surface of a substrateOKI ELECTRIC IND CO LTD·Filed 1998·Granted Feb 13, 2001·4 cites·23 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →