Inventor · disambiguated record
Tomohisa Hoshino
Also filed as: HOSHINO TOMOHISA
17 granted patents·16 pending applications·80 citations·filing 2001–2021
91Inventor score
Top patents by PatentIndex Score
33 records- 0193US7827932B2Vaporizer and processorTOKYO ELECTRON LTD·Filed 2006·Granted Nov 9, 2010·16 cites·10 claims
- 0283US6747465B2Contractor, method for manufacturing the same, and probe card using the sameTOKYO ELECTRON LTD·Filed 2001·Granted Jun 8, 2004·27 cites·18 claims
- 0374US7692434B2Probe and method for fabricating the sameTOKYO ELECTRON LTD·Filed 2005·Granted Apr 6, 2010·5 cites·6 claims
- 0472US6893953B2Fabrication process of a semiconductor device including a CVD process of a metal filmTOKYO ELECTRON LTD·Filed 2001·Granted May 17, 2005·16 cites·29 claims
- 0567US7619424B2Probe needle, method for manufacturing the probe needle and method for constructing a three-dimensional structureTOKYO ELECTRON LTD·Filed 2005·Granted Nov 17, 2009·4 cites·6 claims
- 0665US7866038B2Through substrate, interposer and manufacturing method of through substrateTOKYO ELECTRON LTD·Filed 2005·Granted Jan 11, 2011·3 cites·2 claims
- 0763US8159256B2Probe needle, method for manufacturing the probe needle and method for constructing a three-dimensional structureHOSHINO TOMOHISA·Filed 2009·Granted Apr 17, 2012·4 cites·8 claims
- 0860US7891090B2Method for manufacturing an interposerTOKYO ELECTRON LTD·Filed 2006·Granted Feb 22, 2011·2 cites·5 claims
- 0958US7323220B2Gas phase growth system, method of operating the system, and vaporizer for the systemTOKYO ELECTRON LTD·Filed 2004·Granted Jan 29, 2008·3 cites·5 claims
- 1054US11427921B2Electrolytic treatment apparatus and electrolytic treatment methodTOKYO ELECTRON LTD·Filed 2018·Granted Aug 30, 2022·0 cites·18 claims
- 1153US11427920B2Electrolytic processing jig and electrolytic processing methodTOKYO ELECTRON LTD·Filed 2017·Granted Aug 30, 2022·0 cites·6 claims
- 1253US10903081B2Substrate processing methodTOKYO ELECTRON LTD·Filed 2017·Granted Jan 26, 2021·0 cites·4 claims
- 1349US10392719B2Electrolytic treatment apparatus and electrolytic treatment methodTOKYO ELECTRON LTD·Filed 2016·Granted Aug 27, 2019·0 cites·10 claims
- 1449US2005249874A1Deposition apparatus and deposition method, and process gas supply methodTOKYO ELECTRON LTD·Filed 2005·Application pending·0 cites
- 1548US2011109338A1Interposer, probe card and method for manufacturing the interposerTOKYO ELECTRON LTD·Filed 2011·Application pending·0 cites
- 1647US2023221350A1Inspection deviceYOKOWO SEISAKUSHO KK·Filed 2021·Application pending·0 cites
- 1747US2023221349A1Plunger and method of manufacturing plungerYOKOWO SEISAKUSHO KK·Filed 2021·Application pending·0 cites
- 1847US2017170021A1Substrate processing apparatus, substrate processing method and recording mediumTOKYO ELECTRON LTD·Filed 2016·Application pending·0 cites
- 1947US2023236223A1Inspection deviceYOKOWO SEISAKUSHO KK·Filed 2021·Application pending·0 cites
- 2046US2012085655A1Interposer and manufacturing method for the sameKAGAWA KENICHI·Filed 2011·Application pending·0 cites
- 2144US10428438B2Substrate processing method and templateTOKYO ELECTRON LTD·Filed 2014·Granted Oct 1, 2019·0 cites·32 claims
- 2244US2008067073A1Interposer And Manufacturing Method For The SameKAGAWA KENICHI·Filed 2005·Application pending·0 cites
- 2343US2002017246A1Gas phase growth system, method of operating the system, and vaporizer for the systemTOKYO ELECTRON LTD·Filed 2001·Application pending·0 cites
- 2441US10354915B2Adhesion layer forming method, adhesion layer forming system and recording mediumTOKYO ELECTRON LTD·Filed 2016·Granted Jul 16, 2019·0 cites·7 claims
- 2541US2013206460A1Circuit board for semiconductor device inspection apparatus and manufacturing method thereofTOKYO ELECTRON LIMTED·Filed 2013·Application pending·0 cites
- 2640US11111592B2Manufacturing apparatus and manufacturing method for semiconductor deviceTOKYO ELECTRON LTD·Filed 2016·Granted Sep 7, 2021·0 cites·13 claims
- 2740US2013099813A1Contact terminal for a probe card, and the probe cardTOKYO ELECTRON LTD·Filed 2012·Application pending·0 cites
- 2838US2009015281A1Method of positioning an anisotropic conductive connector, method of positioning the anisotropic conductive connector and a circuit board for inspection, anisotropic conductive connector, and probe cardJSR CORP·Filed 2008·Application pending·0 cites
- 2938US2013033282A1Contact structure and method of manufacturing contact structureTOKYO ELECTRON LTD·Filed 2011·Application pending·0 cites
- 3037US11542627B2Electrolytic processing jig and electrolytic processing methodTOKYO ELECTRON LTD·Filed 2017·Granted Jan 3, 2023·0 cites·13 claims
- 3136US2007257692A1ProbeYAKABE MASAMI·Filed 2005·Application pending·0 cites
- 3235US2017167029A1Substrate processing apparatus, substrate processing method and recording mediumTOKYO ELECTRON LTD·Filed 2016·Application pending·0 cites
- 3332US2007194395A1Capacity type sensorHOSHINO TOMOHISA·Filed 2005·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →