Interposer And Manufacturing Method For The Same

Abstract

In a manufacturing method for an interposer, a seed layer is formed at an opening portion in a through hole on back surface side of a substrate, an electrode layer for electroplated coating is formed based on the seed layer, and an electroplated coating layer is formed to fill the through hole from the electrode layer for electroplated coating layer to a front surface side. As a result, a manufacturing method for an interposer is provided in which the manufacturing process is simple and the void is not generated inside of the through hole.

1 . An interposer comprising: 
 a substrate which has one surface, another surface opposed to said one surface, and a through hole passing through from said one surface to said another surface;    a seed layer which is formed at an opening portion of said through hole on said one surface side of said substrate;    an electrode layer for electroplated coating which is formed by covering said seed layer; and    an electroplated coating layer which extends from said electrode layer for electroplated coating to said another surface side to fill said through hole.    
     
     
         2 . The interposer according to  claim 1 , wherein said through hole has a shape whose center portion is concave.  
     
     
         3 . The interposer according to  claim 1 , wherein said seed layer, said electrode layer for electroplated coating and said electroplated coating layer are made out of the same material.  
     
     
         4 . The interposer according to  claim 1 , wherein at least two of said seed layer, said electrode layer for electroplated coating and said electroplated coating layer are made out of different materials.  
     
     
         5 . A method for manufacturing an interposer comprising steps of: 
 preparing a substrate which has one surface and another surface opposed to said one surface;    forming a through hole on said substrate;    forming a seed layer at an opening portion of said through hole on said one surface side; and    filling said through hole by forming an electroplated coating layer from said seed layer on said one surface side to said another surface side.    
     
     
         6 . The method for manufacturing an interposer according to  claim 5 , wherein said step of filling said through hole by forming an electroplated coating layer from said seed layer on said one surface side to said another surface side includes steps of: 
 forming an electrode layer for electroplated coating to close said through hole at said one surface side; and    forming said electroplated coating layer utilizing said electrode layer.    
     
     
         7 . The method for manufacturing an interposer according to  claim 5 , wherein said step of forming the through hole includes a step of forming a through hole whose center portion becomes concave.  
     
     
         8 . The method for manufacturing an interposer according to  claim 6 , wherein said seed layer, said electrode layer for electroplated coating and said electroplated coating layer are made out of the same material.  
     
     
         9 . The method for manufacturing an interposer according to  claim 6 , wherein at least two of said seed layer, said electrode layer for electroplated coating and said electroplated coating layer are made out of different materials.  
     
     
         10 . An interposer having a through hole wherein: 
 said through hole is made from a surface of one side of said substrate to a surface of another side;    said through hole has a first opening area at said surface of said one side and the opening area becomes smaller in succession as the hole goes from said surface to inside and has a second opening area at said surface of said another side and the opening area becomes smaller in succession as the hole goes from said surface of another side to inside; and    a conducting layer is formed on said through hole.    
     
     
         11 . The interposer according to  claim 10 , wherein the first opening area and the second opening area are different.  
     
     
         12 . The manufacturing method for the interposer according to  claim 10 , wherein said through hole has a cylindrical hole part having the same opening area between said surfaces of said one side and said another side.  
     
     
         13 . The interposer according to  claim 1 , wherein said through hole has a smaller opening area in succession as it goes from said surface of said one side to said surface of said another side.  
     
     
         14 . A method for manufacturing an interposer comprising steps of: 
 preparing a substrate which has one surface and another surface opposed to the one surface;    forming a through hole by performing an etching such that an opening area of said through hole becomes smaller in succession as the hole goes from said surface of said one side and from said surface of said another side to inside; and    forming a conducting layer in said through hole.    
     
     
         15 . The method for manufacturing an interposer according to  claim 14 , wherein said etching is performed such that said opening area of said surface on said one side and said opening area of said surface on said another side are different.  
     
     
         16 . The method for manufacturing an interposer according to  claim 14  further comprising a step of forming a through hole whose opening area at said surface of said one side is the same as that at said surface of said another side.  
     
     
         17 . The method for manufacturing the interposer according to  claim 5 , wherein said step of forming said through hole on said substrate is performed utilizing etching such that an opening area of said through hole becomes smaller in succession as the hole goes from one side of the substrate to another side.  
     
     
         18 . The method for manufacturing an interposer according to  claim 14 , wherein said etching is performed utilizing dry etching.  
     
     
         19 . The method for manufacturing an interposer according to  claim 14 , wherein said step of forming said conducting layer is performed utilizing evaporation, electroplated coating or electroless plating.