Interposer, probe card and method for manufacturing the interposer

Abstract

An interposer is disclosed. The interposer includes a substrate capable of being processed by dry etching. The substrate includes a plurality of conductive holes penetrating from one side to the other side of said substrate. Each of said plurality of conductive holes has one end provided with a contact element on at least one side of said conductive hole.

1 . An interposer comprising
 a substrate capable of being processed by dry etching, wherein   said substrate includes a plurality of conductive holes penetrating from one side to the other side of said substrate; and   each of said plurality of conductive holes has one end provided with a contact element on at least one side of said conductive hole.   
     
     
         2 . The interposer according to  claim 1 , wherein
 said contact elements include probes.   
     
     
         3 . The interposer according to  claim 1 , wherein
 said plurality of contact elements on said plurality of conductive holes are spaced from each other by a distance of 100 μm or less.   
     
     
         4 . The interposer according to  claim 1 , wherein
 said substrate capable of being processed by dry etching is selected from a silicon substrate, an organic substrate, a silicon dioxide substrate and a glass substrate.   
     
     
         5 . The interposer according to  claim 1 , wherein
 each of said conductive holes has a diameter of 100 μm or less.   
     
     
         6 . An interposer comprising:
 a substrate capable of being processed by dry etching, said substrate having a plurality of conductive holes penetrating both sides of said substrate;   pads each having a diameter greater than that of each said conductive hole, said pads being connected to said conductive holes and mounted on a surface of said substrate; and   probes connected to said pads.   
     
     
         7 . A probe card for inspecting test objects for electrical characteristics comprising:
 a card body; and   probes individually connected to bonding portions on said card body, wherein   said card body includes a substrate capable of being processed by dry etching,   said substrate has a plurality of conductive holes penetrating from one side to the other side of said substrate, and   said probes are provided at the ends of said plurality of conductive holes on at least one side of the substrate.   
     
     
         8 - 13 . (canceled)