Inventor · disambiguated record
Kazuhisa Arai
Also filed as: ARAI KAZUHISA
21 granted patents·15 pending applications·348 citations·filing 2000–2014
95Inventor score
Top patents by PatentIndex Score
36 records- 0197US6528864B1Semiconductor wafer having regular or irregular chip pattern and dicing method for the sameDISCO CORP·Filed 2000·Granted Mar 4, 2003·180 cites·3 claims
- 0282US9400423B2Manufacturing method for photomaskDISCO CORP·Filed 2014·Granted Jul 26, 2016·3 cites·3 claims
- 0381US6527627B2Semiconductor wafer grinding methodDISCO CORP·Filed 2001·Granted Mar 4, 2003·26 cites·3 claims
- 0480US6676491B2Semiconductor wafer dividing methodDISCO CORP·Filed 2002·Granted Jan 13, 2004·30 cites·5 claims
- 0577US6702652B2Method of grinding rear side of semiconductor waferDISCO CORP·Filed 2002·Granted Mar 9, 2004·18 cites·12 claims
- 0674US7727810B2Wafer dividing methodDISCO CORP·Filed 2006·Granted Jun 1, 2010·5 cites·5 claims
- 0772US7498239B2Wafer processing methodDISCO CORP·Filed 2005·Granted Mar 3, 2009·4 cites·13 claims
- 0872US6927416B2Wafer support plateDISCO CORP·Filed 2003·Granted Aug 9, 2005·14 cites·16 claims
- 0971US8673743B2Wafer dividing methodARAI KAZUHISA·Filed 2012·Granted Mar 18, 2014·3 cites·5 claims
- 1070US6500047B2Semiconductor wafer cutting machineDISCO CORP·Filed 2001·Granted Dec 31, 2002·16 cites·4 claims
- 1169US7687375B2Lamination device manufacturing methodDISCO CORP·Filed 2008·Granted Mar 30, 2010·3 cites·4 claims
- 1269US7183178B2Method of manufacturing semiconductor waferDISCO CORP·Filed 2004·Granted Feb 27, 2007·12 cites·5 claims
- 1367US6759274B2Semiconductor chip pick-up methodDISCO CORP·Filed 2001·Granted Jul 6, 2004·12 cites·3 claims
- 1461US7816264B2Wafer processing methodDISCO CORP·Filed 2008·Granted Oct 19, 2010·2 cites·2 claims
- 1561US6594890B2Method of separating a plate-like workpiece held by adhesion on an elastic adsorption padDISCO CORP·Filed 2001·Granted Jul 22, 2003·8 cites·7 claims
- 1660US6358132B1Apparatus for grinding spherical objectsDISCO CORP·Filed 2000·Granted Mar 19, 2002·9 cites·6 claims
- 1753US2009298264A1Method of cutting adhesive film on a singulated wafer backsideDISCO CORP·Filed 2009·Application pending·0 cites
- 1849US2010003805A1Semiconductor device fabrication methodDISCO CORP·Filed 2009·Application pending·0 cites
- 1948US9627241B2Resin sheet attaching methodDISCO CORP·Filed 2014·Granted Apr 18, 2017·0 cites·8 claims
- 2048US7704769B2Optical device manufacturing methodDISCO CORP·Filed 2009·Granted Apr 27, 2010·0 cites·2 claims
- 2148US2007057378A1Electronic device and manufacturing method thereforDISCO CORP·Filed 2006·Application pending·0 cites
- 2246US7222772B2Flip chip bonderDISCO CORP·Filed 2004·Granted May 29, 2007·2 cites·2 claims
- 2345US8142259B2Grinding machine and methodARAI KAZUHISA·Filed 2009·Granted Mar 27, 2012·0 cites·2 claims
- 2445US2004209554A1Polishing material and method of polishing therewithFiled 2003·Application pending·0 cites
- 2545US2015093882A1Wafer processing methodDISCO CORP·Filed 2014·Application pending·0 cites
- 2642US7278206B2Method of preparing terminal boardDISCO CORP·Filed 2003·Granted Oct 9, 2007·1 cites·6 claims
- 2741US2006073705A1Method for dividing semiconductor wafer along streetsDISCO CORP·Filed 2005·Application pending·0 cites
- 2841US2003181150A1Semiconductor wafer assembly and machining apparatus having chuck tables for holding the sameFiled 2003·Application pending·0 cites
- 2939US2001049256A1Semiconductor wafer assembly and machining apparatus having chuck tables for holding the sameFiled 2001·Application pending·0 cites
- 3038US2005103635A1Method of producing micro componentFiled 2003·Application pending·0 cites
- 3138US2004203187A1Method for manufacturing semiconductor waferFiled 2004·Application pending·0 cites
- 3237US2004089958A1Conductor wafer and substrateFiled 2003·Application pending·0 cites
- 3337US2004241961A1Method for processing soi substrateFiled 2003·Application pending·0 cites
- 3437US2004208718A1Machine for processing electrodes formed on a plate-like workpieceFiled 2004·Application pending·0 cites
- 3536US2002045348A1Semiconductor wafer treating method and device for removing deposit on a semiconductor waferFiled 2001·Application pending·0 cites
- 3634US2005233548A1Method for fabricating semiconductor waferARAI KAZUHISA·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →