Assignee
ARAI KAZUHISA
JP·2 granted patents·1 pending application·3 citations·filing 2003–2012
Top patents by PatentIndex Score
3 records- 0171US8673743B2Wafer dividing methodARAI KAZUHISA·Filed 2012·Granted Mar 18, 2014·3 cites·5 claims
- 0245US8142259B2Grinding machine and methodARAI KAZUHISA·Filed 2009·Granted Mar 27, 2012·0 cites·2 claims
- 0334US2005233548A1Method for fabricating semiconductor waferARAI KAZUHISA·Filed 2003·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →