Polishing material and method of polishing therewith

Abstract

An abrasive obtained by curing raw materials containing at least (1) an organic polyisocyanate and at least one member selected from an organic polyol and an organic polyamine as matrix resin materials, and (2) a particle containing a predetermined amount of a hydroxyl group and/or colloidal silica and the like as an abrasive particle(s), by a polymerization reaction, the matrix resin being a resin having an urethane bond and/or an urea bond. The abrasive enables long-term continuous polishing of a workpiece to be polished without exerting a bad influence upon the environment.

1 . An abrasive obtained by curing raw materials containing at least (1) an organic polyisocyanate (component A) and at least one member selected from an organic polyol (component B) and an organic polyamine (component C) as raw materials of a matrix resin, and (2) an abrasive particle (component E), by a polymerization reaction, wherein 
 the particle (component E) is (a) a particle (component E 1 ) containing a hydroxyl group in an amount of 0.001 mmol/g or more (measured by neutralization titration) and/or (b) at least one member (component E 2 ) selected from fumed silica, colloidal silica, fumed alumina, colloidal alumina, boehmite and bayerite.    
     
     
         2 . The abrasive according to  claim 1 , wherein the matrix resin (resin F) is a resin having at least an urethane bond.  
     
     
         3 . The abrasive according to  claim 1  or  2 , wherein the matrix resin raw materials include an organic polyisocyanate (component A), at least one member selected from an organic polyol (component B) and an organic polyamine (component C), and a foaming agent (component D).  
     
     
         4 . The abrasive according to  claim 1  or  2 , wherein the matrix resin raw materials are an organic polyisocyanate (component A), at least one member selected from an organic polyol (component B) and an organic polyamine (component C), and an organic polycarboxylic acid (component J).  
     
     
         5 . The abrasive according to  claim 1  or  2 , wherein the matrix resin (resin F) is a resin having at least one of urethane bond, urea bond and amide bond.  
     
     
         6 . The abrasive according to  claim 1  or  2 , which has an expansion ratio of 1.1 to 5.  
     
     
         7 . The abrasive according to  claim 1  or  2 , wherein the particle (component E) is colloidal silica.  
     
     
         8 . The abrasive according to  claim 1  or  2 , wherein the amount of the hydroxyl group of the particle (component E 1 ) is 0.01 to 6 mmol/g (measured by neutralization titration).  
     
     
         9 . The abrasive according to  claim 1  or  2 , wherein the particle having a hydroxyl group (component E 1 ) is at least one member selected from diamond, cubic boron nitride, zirconia, ceria, manganese oxide, titanium oxide, calcium carbonate, barium carbonate, magnesium oxide, alumina-silica and silicon carbide all of which are provided with a hydroxyl group.  
     
     
         10 . The abrasive according to  claim 1  or  2 , wherein the matrix resin (resin F) is contained in the abrasive in an amount of 60 to 95 wt %.  
     
     
         11 . The abrasive according to  claim 1  or  2 , which is a foamed material obtained by curing raw materials containing an organic polyisocyanate compound (component A), at least one member selected from an organic polyol (component B) and an organic polyamine (component C), a foaming agent (component D), a catalyst and a particle (component E) by a polymerization reaction.  
     
     
         12 . The abrasive according to  claim 1 , which is obtained by adding an organic polyisocyanate compound (component A) to a mixture of at least one member selected from an organic polyol (component B) and an organic polyamine (component C), a foaming agent (component D), a catalyst and a particle (component E), mixing them together under stirring, and curing and molding the resulting mixture by a polymerization reaction.  
     
     
         13 . The abrasive according to  claim 11 , which is obtained by adding a mixture of at least one member selected from an organic polyol (component B) and an organic polyamine (component C) and a particle (component E) to a mixture of an organic polyisocyanate compound (component A), a foaming agent (component D) and a catalyst, stirring and mixing them together, and curing and molding the resulting mixture by a polymerization reaction.  
     
     
         14 . A fixed abrasive grain polishing pad (polishing pad G) that is composed of the abrasive according to claims  12  and  12  and is mounted on a polishing table, which is used for polishing a workpiece to be polished by the relative movements of the fixed abrasive grain polishing pad and the workpiece while pressing the workpiece between the fixed abrasive grain polishing pad (polishing pad) and a workpiece holding portion and supplying an abrasive liquid (abrasive liquid H) between the fixed abrasive grain polishing pad and the workpiece.  
     
     
         15 . The fixed abrasive grain polishing pad according to  claim 14  which has grooves extending radially from its center point toward its circumferential direction.  
     
     
         16 . The fixed abrasive grain polishing pad according to  claim 14  which has lattice type grooves.  
     
     
         17 . A method of polishing a workpiece to be polished, comprising the steps of: 
 mounting a fixed abrasive grain polishing pad (polishing pad G) composed of the abrasive of claims  12  and  12  on a polishing table;    pressing the workpiece between the fixed abrasive grain polishing pad (polishing pad G) and a workpiece holding portion;    polishing the workpiece by the relative movements of the fixed abrasive grain polishing pad (polishing pad G) and the workpiece while an abrasive liquid (abrasive liquid H) is supplied between the fixed abrasive grain polishing pad (polishing pad G) and the workpiece.    
     
     
         18 . The method of polishing a workpiece to be polished according to  claim 17 , wherein the abrasive liquid (abrasive liquid H) is an alkaline aqueous solution.  
     
     
         19 . The method of polishing a workpiece to be polished according to  claim 18 , wherein the alkaline aqueous solution has a pH of 10 or higher.