Inventor · disambiguated record
Fu-Tang Huang
Also filed as: HUANG FU-TANG
23 granted patents·10 pending applications·99 citations·filing 2011–2020
94Inventor score
Top patents by PatentIndex Score
33 records- 0193US8162672B2High power receptacle connectorHUANG FU-TANG·Filed 2011·Granted Apr 24, 2012·49 cites·7 claims
- 0285US10522453B2Substrate structure with filling material formed in concave portionSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2016·Granted Dec 31, 2019·4 cites·11 claims
- 0385US10510720B2Electronic package and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2016·Granted Dec 17, 2019·5 cites·30 claims
- 0485US9812340B2Method of fabricating semiconductor package having semiconductor elementSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2016·Granted Nov 7, 2017·4 cites·14 claims
- 0585US9735124B2Semiconductor structure and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Aug 15, 2017·5 cites·10 claims
- 0684US9907186B1Electronic package structure and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Granted Feb 27, 2018·6 cites·23 claims
- 0781US10361150B2Substrate construction and electronic package including the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Granted Jul 23, 2019·4 cites·30 claims
- 0881US10325872B2Fabrication method of semiconductor structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Granted Jun 18, 2019·3 cites·12 claims
- 0979US9356008B2Semiconductor package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted May 31, 2016·4 cites·20 claims
- 1078US10872870B2Fabrication method of semiconductor structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2019·Granted Dec 22, 2020·2 cites·11 claims
- 1178US9524944B2Method for fabricating package structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2016·Granted Dec 20, 2016·4 cites·9 claims
- 1272US9842771B2Semiconductor device and fabrication method thereof and semiconductor structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Dec 12, 2017·3 cites·13 claims
- 1371US9324585B2Semiconductor package and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2012·Granted Apr 26, 2016·2 cites·5 claims
- 1469US10199331B2Fabrication method of electronic package having embedded package blockSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2018·Granted Feb 5, 2019·1 cites·10 claims
- 1566US9900996B2Package substrate and structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Feb 20, 2018·2 cites·17 claims
- 1660US9607963B2Semiconductor device and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Mar 28, 2017·1 cites·12 claims
- 1759US11973014B2Method of manufacturing substrate structure with filling material formed in concave portionSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2019·Granted Apr 30, 2024·0 cites·7 claims
- 1859US11516925B2Package stack structure and method for manufacturing the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2020·Granted Nov 29, 2022·0 cites·8 claims
- 1959US11205644B2Method for fabricating electronic packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2020·Granted Dec 21, 2021·0 cites·12 claims
- 2053US10192834B2Semiconductor package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Granted Jan 29, 2019·0 cites·16 claims
- 2152US10629572B2Electronic package and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2018·Granted Apr 21, 2020·0 cites·12 claims
- 2250US2014191376A1Semiconductor package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Application pending·0 cites
- 2347US9520351B2Packaging substrate and package structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Dec 13, 2016·0 cites·36 claims
- 2447US2018288886A1Package stack structure and method for manufacturing the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2018·Application pending·0 cites
- 2545US2015004752A1Semiconductor package, semiconductor substrate, semiconductor structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Application pending·0 cites
- 2645US2017148679A1Semiconductor package, semiconductor substrate, semiconductor structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Application pending·0 cites
- 2745US2017077047A1Electronic package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Application pending·0 cites
- 2843US2015235914A1Flip-chip packaging substrate, flip-chip package and fabrication methods thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Application pending·0 cites
- 2942US2014183755A1Semiconductor package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Application pending·0 cites
- 3039US9362245B2Package structure and fabrication method thereofYEH CHUN-WEI·Filed 2013·Granted Jun 7, 2016·0 cites·10 claims
- 3136US2018130774A1Package stack structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Application pending·0 cites
- 3234US2016099204A1Package substrate, package structure, and methods of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Application pending·0 cites
- 3330US2016126176A1Package substrate, package structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →