Inventor · disambiguated record
Sebastian U. Engelmann
Also filed as: ENGELMANN SEBASTIAN U · ENGELMANN SEBASTIAN ULRICH
44 granted patents·10 pending applications·139 citations·filing 2009–2021
97Inventor score
Top patents by PatentIndex Score
54 records- 0195US9437443B2Low-temperature sidewall image transfer process using ALD metals, metal oxides and metal nitridesGLOBALFOUNDRIES INC·Filed 2013·Granted Sep 6, 2016·26 cites·19 claims
- 0293US9490164B1Techniques for forming contacts for active BEOLIBM·Filed 2015·Granted Nov 8, 2016·10 cites·20 claims
- 0393US8431486B2Interconnect structure for improved time dependent dielectric breakdownCABRAL JR CYRIL·Filed 2010·Granted Apr 30, 2013·15 cites·19 claims
- 0491US8829625B2Nanowire FET with trapezoid gate structureSLEIGHT JEFFREY W·Filed 2012·Granted Sep 9, 2014·11 cites·19 claims
- 0590US8298881B2Nanowire FET with trapezoid gate structureSLEIGHT JEFFREY W·Filed 2010·Granted Oct 30, 2012·11 cites·8 claims
- 0689US9633948B2Low energy etch process for nitrogen-containing dielectric layerGLOBALFOUNDRIES INC·Filed 2015·Granted Apr 25, 2017·5 cites·19 claims
- 0788US7816275B1Gate patterning of nano-channel devicesIBM·Filed 2009·Granted Oct 19, 2010·13 cites·18 claims
- 0887US9941121B1Selective dry etch for directed self assembly of block copolymersIBM·Filed 2017·Granted Apr 10, 2018·4 cites·20 claims
- 0984US9190316B2Low energy etch process for nitrogen-containing dielectric layerBRINK MARKUS·Filed 2011·Granted Nov 17, 2015·6 cites·15 claims
- 1082US10276384B2Plasma shallow doping and wet removal of depth control capIBM·Filed 2017·Granted Apr 30, 2019·2 cites·14 claims
- 1181US8658050B2Method to transfer lithographic patterns into inorganic substratesENGELMANN SEBASTIAN ULRICH·Filed 2011·Granted Feb 25, 2014·6 cites·19 claims
- 1278US10714341B2Reactive ion etching assisted lift-off processes for fabricating thick metallization patterns with tight pitchELPIS TECH INC·Filed 2017·Granted Jul 14, 2020·2 cites·20 claims
- 1377US9728421B2High aspect ratio patterning of hard mask materials by organic soft masksIBM·Filed 2015·Granted Aug 8, 2017·2 cites·16 claims
- 1477US9643179B1Techniques for fabricating horizontally aligned nanochannels for microfluidics and biosensorsIBM·Filed 2016·Granted May 9, 2017·1 cites·20 claims
- 1577US9214355B2Molecular radical etch chemistry for increased throughput in pulsed plasma applicationsIBM·Filed 2014·Granted Dec 15, 2015·3 cites·14 claims
- 1677US8916054B2High fidelity patterning employing a fluorohydrocarbon-containing polymerBRINK MARKUS·Filed 2011·Granted Dec 23, 2014·4 cites·12 claims
- 1776US8445948B2Gate patterning of nano-channel devicesFULLER NICHOLAS C M·Filed 2010·Granted May 21, 2013·4 cites·14 claims
- 1875US10325998B2High selectivity nitride removal process based on selective polymer depositionIBM·Filed 2017·Granted Jun 18, 2019·1 cites·11 claims
- 1975US10269924B2High selectivity nitride removal process based on selective polymer depositionIBM·Filed 2017·Granted Apr 23, 2019·1 cites·7 claims
- 2075US9881793B2Neutral hard mask and its application to graphoepitaxy-based directed self-assembly (DSA) patterningIBM·Filed 2015·Granted Jan 30, 2018·2 cites·19 claims
- 2171US10276439B2Rapid oxide etch for manufacturing through dielectric via structuresIBM·Filed 2017·Granted Apr 30, 2019·2 cites·19 claims
- 2270US9627533B2High selectivity nitride removal process based on selective polymer depositionIBM·Filed 2015·Granted Apr 18, 2017·1 cites·10 claims
- 2370US9299638B2Patterning transition metals in integrated circuitsGLOBALFOUNDRIES INC·Filed 2012·Granted Mar 29, 2016·2 cites·19 claims
- 2470US8765613B2High selectivity nitride etch processCHANG JOSEPHINE B·Filed 2011·Granted Jul 1, 2014·2 cites·5 claims
- 2568US8232171B2Structure with isotropic silicon recess profile in nanoscale dimensionsENGELMANN SEBASTIAN ULRICH·Filed 2009·Granted Jul 31, 2012·2 cites·9 claims
- 2667US9691972B1Low temperature encapsulation for magnetic tunnel junctionIBM·Filed 2015·Granted Jun 27, 2017·1 cites·20 claims
- 2764US10651286B2High selectivity nitride removal process based on selective polymer depositionIBM·Filed 2019·Granted May 12, 2020·0 cites·2 claims
- 2863US9891189B2Techniques for fabricating horizontally aligned nanochannels for microfluidics and biosensorsIBM·Filed 2017·Granted Feb 13, 2018·0 cites·8 claims
- 2958US9536731B2Wet clean process for removing CxHyFz etch residueIBM·Filed 2014·Granted Jan 3, 2017·0 cites·15 claims
- 3057US10043668B1Selective dry etch for directed self assembly of block copolymersIBM·Filed 2017·Granted Aug 7, 2018·0 cites·13 claims
- 3156US2018218909A1Plasma shallow doping and wet removal of depth control capIBM·Filed 2018·Application pending·0 cites
- 3256US2018218908A1Plasma shallow doping and wet removal of depth control capIBM·Filed 2018·Application pending·0 cites
- 3355US10167443B2Wet clean process for removing CxHyFz etch residueIBM·Filed 2016·Granted Jan 1, 2019·0 cites·5 claims
- 3453US2019311945A1Self-aligned trench metal-alloying for iii-v nfetsIBM·Filed 2019·Application pending·0 cites
- 3552US12329044B2Applying inert ion beam etching for improving a profile and repairing sidewall damage for phase change memory devicesIBM·Filed 2021·Granted Jun 10, 2025·0 cites·18 claims
- 3652US9299639B2Patterning transition metals in integrated circuitsGLOBALFOUNDRIES INC·Filed 2013·Granted Mar 29, 2016·0 cites·20 claims
- 3752US2013234260A1Interconnect structure for improved time dependent dielectric breakdownIBM·Filed 2013·Application pending·0 cites
- 3851US9728444B2Reactive ion etching assisted lift-off processes for fabricating thick metallization patterns with tight pitchIBM·Filed 2015·Granted Aug 8, 2017·0 cites·10 claims
- 3951US9000556B2Lateral etch stop for NEMS release etch for high density NEMS/CMOS monolithic integrationCHANG JOSEPHINE B·Filed 2011·Granted Apr 7, 2015·0 cites·22 claims
- 4049US12057322B2Methods for etching metal films using plasma processingTOKYO ELECTRON LTD·Filed 2019·Granted Aug 6, 2024·0 cites·12 claims
- 4149US10305029B1Image reversal process for tight pitch pillar arraysIBM·Filed 2017·Granted May 28, 2019·0 cites·20 claims
- 4248US10529633B2Method of integrated circuit (IC) chip fabricationIBM·Filed 2017·Granted Jan 7, 2020·0 cites·17 claims
- 4348US9162877B2Lateral etch stop for NEMS release etch for high density NEMS/CMOS monolithic integrationIBM·Filed 2015·Granted Oct 20, 2015·0 cites·10 claims
- 4448US2012193680A1Structure with isotropic silicon recess profile in nanoscale dimensionsENGELMANN SEBASTIAN ULRICH·Filed 2012·Application pending·0 cites
- 4548US2012193715A1Structure with isotropic silicon recess profile in nanoscale dimensionsENGELMANN SEBASTIAN ULRICH·Filed 2012·Application pending·0 cites
- 4647US10366918B2Self-aligned trench metal-alloying for III-V nFETsIBM·Filed 2016·Granted Jul 30, 2019·0 cites·15 claims
- 4747US2014048884A1Disposable carbon-based template layer for formation of borderless contact structuresBREYTA GREGORY·Filed 2012·Application pending·0 cites
- 4847US2014051239A1Disposable carbon-based template layer for formation of borderless contact structuresBREYTA GREGORY·Filed 2012·Application pending·0 cites
- 4945US11270893B2Layer-by-layer etching of poly-granular metal-based materials for semiconductor structuresIBM·Filed 2019·Granted Mar 8, 2022·0 cites·20 claims
- 5045US10304692B1Method of forming field effect transistor (FET) circuits, and forming integrated circuit (IC) chips with the FET circuitsIBM·Filed 2017·Granted May 28, 2019·0 cites·20 claims
Showing the top 50 of 54 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →