Inventor · disambiguated record
Hung-Cheng Lin
Also filed as: LIN HUNG-CHENG
25 granted patents·16 pending applications·67 citations·filing 2004–2025
94Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD14UNIV NAT CENTRAL5LIN HUNG-CHENG4TEKCORE CO LTD4VISIONLABS CORP4
Top patents by PatentIndex Score
41 records- 0197US11437492B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 6, 2022·4 cites·20 claims
- 0297US11316034B2Post-formation mends of dielectric featuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 26, 2022·3 cites·20 claims
- 0396US11916132B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 27, 2024·2 cites·20 claims
- 0496US11710782B2Post-formation mends of dielectric featuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 25, 2023·2 cites·20 claims
- 0594US11296254B2Diode device, display device and method for manufacturing the sameLIN HUNG CHENG·Filed 2020·Granted Apr 5, 2022·6 cites·20 claims
- 0693US7598105B2Light emitting diode structure and method for fabricating the sameTEKCORE CO LTD·Filed 2007·Granted Oct 6, 2009·22 cites·23 claims
- 0791US11881540B2Diode arrayVISIONLABS CORP·Filed 2022·Granted Jan 23, 2024·2 cites·22 claims
- 0885US7713769B2Method for fabricating light emitting diode structure having irregular serrationsTEKCORE CO LTD·Filed 2007·Granted May 11, 2010·10 cites·9 claims
- 0983US2024387705A1Post-formation mends of dielectric featuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1082US12288814B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Apr 29, 2025·0 cites·20 claims
- 1182US12206013B2Post-formation mends of dielectric featuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jan 21, 2025·0 cites·20 claims
- 1280US12176349B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 24, 2024·0 cites·20 claims
- 1380US2025048726A1Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1480US2025040299A1Diode arrayVISIONLABS CORP·Filed 2024·Application pending·0 cites
- 1578US12136686B2Diode arrayVISIONLABS CORP·Filed 2023·Granted Nov 5, 2024·0 cites·20 claims
- 1678US2025311267A1Dummy fin structures and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1777US8101447B2Light emitting diode element and method for fabricating the sameLIN HUNG-CHENG·Filed 2007·Granted Jan 24, 2012·6 cites·7 claims
- 1874US7608532B2Method of growing nitride semiconductor materialUNIV NAT CENTRAL·Filed 2008·Granted Oct 27, 2009·4 cites·7 claims
- 1969US11764221B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 19, 2023·0 cites·20 claims
- 2068US12495568B2Dummy Fin structures and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 9, 2025·0 cites·20 claims
- 2168US7799593B2Light emitting diode structure and method for fabricating the sameTEKCORE CO LTD·Filed 2009·Granted Sep 21, 2010·2 cites·6 claims
- 2262US9404028B2Heat conducting composite material and light-emitting diode having the sameRITEDIA CORP·Filed 2013·Granted Aug 2, 2016·1 cites·13 claims
- 2361US2025267907A1Semiconductor device and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2454US2025098276A1Semiconductor device structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2553US8453916B2Thermal conduction device and method for fabricating the sameHU SHAO-CHUNG·Filed 2011·Granted Jun 4, 2013·1 cites·17 claims
- 2652US12295191B2Display deviceVISIONLABS CORP·Filed 2021·Granted May 6, 2025·0 cites·10 claims
- 2752US2025323173A1Electronic device and method of manufacturing the sameINNOLUX CORP·Filed 2025·Application pending·0 cites
- 2849US7445949B2Method of manufacturing semiconductor laser device structureUNIV NAT CENTRAL·Filed 2004·Granted Nov 4, 2008·2 cites·10 claims
- 2949US2010295017A1Light emitting diode element and method for fabricating the sameLIN HUNG-CHENG·Filed 2010·Application pending·0 cites
- 3049US2016022281A1Medical drillUNIV NAT CENTRAL·Filed 2015·Application pending·0 cites
- 3148US2010140653A1Light emitting diode structure and method for fabricating the sameLIN HUNG-CHENG·Filed 2010·Application pending·0 cites
- 3247US2015023827A1Porous Amorphous Alloy Artificial Joint and Manufacturing Method ThereofUNIV NAT CENTRAL·Filed 2014·Application pending·0 cites
- 3346US7645624B2Method for self bonding epitaxyTEKCORE CO LTD·Filed 2007·Granted Jan 12, 2010·0 cites·8 claims
- 3446US2015004431A1Anti-corrosion film, metal substrate with anti-corrosion layer and manufacturing method thereofUNIV NAT CENTRAL·Filed 2014·Application pending·0 cites
- 3545US9944530B2Graphene platelet fabrication method and graphene platelet fabricated therebyRITEDIA CORP·Filed 2013·Granted Apr 17, 2018·0 cites·14 claims
- 3644US9220512B2Medical drillCHING JASON SHIANG·Filed 2012·Granted Dec 29, 2015·0 cites·8 claims
- 3744US7956977B2Liquid crystal display having sealant observation windowsCHUNGHWA PICTURE TUBES LTD·Filed 2006·Granted Jun 7, 2011·0 cites·12 claims
- 3843US2013183625A1Patterned graphene fabrication methodSUNG CHIEN-MIN·Filed 2012·Application pending·0 cites
- 3942US2013216823A1Thermal conduction device and method for fabricating the sameRITEDIA CORP·Filed 2013·Application pending·0 cites
- 4041US2013221268A1Thermally-conductive pasteSUNG CHIEN-MIN·Filed 2012·Application pending·0 cites
- 4131US2018294155A1Process for obtaining semiconductor nanodevices with patterned metal-oxide thin films deposited onto a substrate, and semiconductor nanodevices thereofCENTRE NAT RECH SCIENT·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →