US2010295017A1PendingUtilityA1

Light emitting diode element and method for fabricating the same

Assignee: LIN HUNG-CHENGPriority: Dec 20, 2007Filed: Aug 6, 2010Published: Nov 25, 2010
Est. expiryDec 20, 2027(~1.4 yrs left)· nominal 20-yr term from priority
H10H 20/819H10H 20/814
49
PatentIndex Score
0
Cited by
0
References
0
Claims

Abstract

The present invention discloses a light emitting diode (LED) element and a method for fabricating the same, which can promote light extraction efficiency of LED, wherein a substrate is etched to obtain basins with inclined natural crystal planes, and an LED epitaxial structure is selectively formed inside the basin. Thereby, an LED element having several inclines is obtained. Via the inclines, the probability of total internal reflection is reduced, and the light extraction efficiency of LED is promoted.

Claims

exact text as granted — not AI-modified
1 . A light emitting diode element comprising:
 a light emitting diode structure with inclines formed via etching a substrate to obtain basins having inclined natural crystal planes and a bottom plane, and epitaxially growing on said bottom plane an n-type III-V group compound layer, an active layer and a p-type III-V group compound layer in sequence, wherein said active layer is interposed between said n-type III-V group compound layer and said p-type III-V group compound layer and functions as a light emitting zone;   a p-type ohmic contact metal layer formed on said p-type III-V group compound layer;   a heat-conduction substrate connected with said p-type ohmic contact metal layer; and   an n-type ohmic contact metal layer formed on said n-type III-V group compound layer.   
     
     
         2 . The light emitting diode element according to  claim 1 , wherein said light emitting diode structure has a shape of a rectangle, circle, triangle, star, or polygon. 
     
     
         3 . The light emitting diode element according to  claim 1 , wherein said light emitting diode structure has a thickness of between 0.5 and 50 microns and has a diameter of between 200 and 2000 microns. 
     
     
         4 . The light emitting diode element according to  claim 1 , wherein said n-type III-V group compound layer has a rugged surface. 
     
     
         5 . The light emitting diode element according to  claim 1 , wherein said active layer is a dual heterogeneous (DH) junction structure, a single quantum well (SQW) structure or a multiple quantum well (MQW) structure.

Join the waitlist — get patent alerts

Track US2010295017A1 — get alerts on status changes and closely related new filings.

We store only your email — no account needed. See our privacy policy.