Inventor · disambiguated record
Kenji Kobae
Also filed as: KOBAE KENJI
43 granted patents·27 pending applications·303 citations·filing 1998–2013
98Inventor score
Top patents by PatentIndex Score
70 records- 0190US7471081B2Slider testerFUJITSU LTD·Filed 2006·Granted Dec 30, 2008·8 cites·1 claims
- 0288US7514788B2Structure of mounting electronic componentFUJITSU LTD·Filed 2007·Granted Apr 7, 2009·13 cites·1 claims
- 0387US7385788B2Carriage assembly of a hard disk driveFUJITSU LTD·Filed 2004·Granted Jun 10, 2008·38 cites·6 claims
- 0486US6437450B1Method of mounting semiconductor chipFUJITSU LTD·Filed 2000·Granted Aug 20, 2002·38 cites·4 claims
- 0585US7424966B2Method of ultrasonic mounting and ultrasonic mounting apparatus using the sameFUJITSU LTD·Filed 2005·Granted Sep 16, 2008·7 cites·4 claims
- 0685US6885522B1Head assembly having integrated circuit chip covered by layer which prevents foreign particle generationFUJITSU LTD·Filed 2000·Granted Apr 26, 2005·17 cites·12 claims
- 0784US7347347B2Head assembly, disk unit, and bonding method and apparatusFUJITSU LTD·Filed 2004·Granted Mar 25, 2008·15 cites·11 claims
- 0876US8381963B2Compression-bonding apparatusFUJITSU LTD·Filed 2010·Granted Feb 26, 2013·4 cites·10 claims
- 0976US7566586B2Method of manufacturing a semiconductor deviceFUJITSU LTD·Filed 2006·Granted Jul 28, 2009·7 cites·11 claims
- 1074US7982295B2Electronic device, electronic apparatus mounted with electronic device, article equipped with electronic device and method of producing electronic deviceFUJITSU LTD·Filed 2009·Granted Jul 19, 2011·5 cites·9 claims
- 1173US7355285B2Structure of mounting electronic componentFUJITSU LTD·Filed 2005·Granted Apr 8, 2008·4 cites·3 claims
- 1272US6582993B1Method of underfilling semiconductor deviceFUJITSU LTD·Filed 2000·Granted Jun 24, 2003·17 cites·7 claims
- 1371US7960215B2Electronic device, electronic apparatus mounted with electronic device, article equipped with electronic device and method of producing electronic deviceFUJITSU LTD·Filed 2009·Granted Jun 14, 2011·4 cites·6 claims
- 1470US7350685B2Method of mounting electronic componentFUJITSU LTD·Filed 2005·Granted Apr 1, 2008·2 cites·7 claims
- 1570US7196512B2Magnetic head testerFUJITSU LTD·Filed 2003·Granted Mar 27, 2007·8 cites·11 claims
- 1669US7208059B2Method of ultrasonic-mounting electronic component and ultrasonic mounting machineFUJITSU LTD·Filed 2005·Granted Apr 24, 2007·4 cites·6 claims
- 1767US6716665B2Method of mounting chip onto printed circuit board in shortened working timeFUJITSU LTD·Filed 2001·Granted Apr 6, 2004·13 cites·17 claims
- 1866US8308071B2RFID tag and manufacturing method thereofTAKEUCHI SHUICHI·Filed 2010·Granted Nov 13, 2012·2 cites·6 claims
- 1966US8169075B2Electronic part with affixed MEMSTAKAHASHI TETSUYA·Filed 2009·Granted May 1, 2012·3 cites·3 claims
- 2066US7670873B2Method of flip-chip mountingFUJITSU LTD·Filed 2006·Granted Mar 2, 2010·3 cites·1 claims
- 2166US6770319B2Resin coating methodFUJITSU LTD·Filed 2001·Granted Aug 3, 2004·7 cites·12 claims
- 2265US7789316B2Electronic device, electronic apparatus mounted with electronic device, article equipped with electronic device and method of producing electronic deviceFUJITSU LTD·Filed 2009·Granted Sep 7, 2010·2 cites·6 claims
- 2365US7687314B2Electronic apparatus manufacturing methodFUJITSU LTD·Filed 2008·Granted Mar 30, 2010·2 cites·7 claims
- 2464US7902983B2RFID tagFUJITSU LTD·Filed 2008·Granted Mar 8, 2011·2 cites·8 claims
- 2563US7134588B2Bonding tool for ultrasonic bonding and method of ultrasonic bondingFUJITSU LTD·Filed 2004·Granted Nov 14, 2006·8 cites·6 claims
- 2663US2009146653A1Slider testerFUJITSU LTD·Filed 2008·Application pending·0 cites
- 2762US6006426AMethod of producing a multichip package module in which rough-pitch and fine-pitch chips are mounted on a boardFUJITSU LTD·Filed 1998·Granted Dec 28, 1999·21 cites·17 claims
- 2860US6240634B1Method of producing a multichip package module in which rough-pitch and fine-pitch chips are mounted on a boardFUJITSU LTD·Filed 1999·Granted Jun 5, 2001·19 cites·17 claims
- 2959US2008265002A1Method of ultrasonic mounting and ultrasonic mounting apparatus using the sameFUJITSU LTD·Filed 2007·Application pending·0 cites
- 3059US2008265003A1Method of ultrasonic mounting and ultrasonic mounting apparatus using the sameFUJITSU LTD·Filed 2007·Application pending·0 cites
- 3158US7712650B2Method of mounting a semiconductor chipFUJITSU LTD·Filed 2006·Granted May 11, 2010·1 cites·5 claims
- 3258US7394163B2Method of mounting semiconductor chipFUJITSU LTD·Filed 2002·Granted Jul 1, 2008·6 cites·2 claims
- 3356US8062926B2Manufacturing method for RFID tagKOBAYASHI HIROSHI·Filed 2008·Granted Nov 22, 2011·1 cites·14 claims
- 3456US2005196703A1Resin coating method and apparatusFUJITSU LTD·Filed 2005·Application pending·0 cites
- 3555US6122823AApparatus to produce a multichip package module in which rough-pitch and fine-pitch chips are mounted on a boardFUJITSU LTD·Filed 1999·Granted Sep 26, 2000·15 cites·4 claims
- 3653US8081081B2Electronic apparatus and method of manufacturing the sameKOBAYASHI HIROSHI·Filed 2008·Granted Dec 20, 2011·0 cites·14 claims
- 3751US8299925B2RFID tag and manufacturing method thereofKOBAYASHI HIROSHI·Filed 2008·Granted Oct 30, 2012·0 cites·2 claims
- 3851US7507654B2Method for mounting electronic element on a circuit boardFUJITSU LTD·Filed 2006·Granted Mar 24, 2009·0 cites·5 claims
- 3951US7367108B2Method of bonding flying leadsFUJITSU LTD·Filed 2006·Granted May 6, 2008·0 cites·8 claims
- 4051US7356907B2Method of manufacturing a carriage assembly of a hard disk driveFUJITSU LTD·Filed 2004·Granted Apr 15, 2008·3 cites·9 claims
- 4151US2009236127A1Electronic deviceFUJITSU LTD·Filed 2009·Application pending·0 cites
- 4251US2005196704A1Resin coating method and apparatusFUJITSU LTD·Filed 2005·Application pending·0 cites
- 4351US2005196529A1Resin coating method and apparatusFUJITSU LTD·Filed 2005·Application pending·0 cites
- 4450US2004213894A1Resin coating method and apparatusFUJITSU LTD·Filed 2004·Application pending·0 cites
- 4549US2013249087A1Electronic component and manufacture method thereofFUJITSU LTD·Filed 2013·Application pending·0 cites
- 4648US2009243062A1Ic tag and manufacturing method of the sameFUJITSU LTD·Filed 2009·Application pending·0 cites
- 4746US2006030076A1Semiconductor deviceFUJITSU LTD·Filed 2005·Application pending·0 cites
- 4846US2006097029A1Method of flip-chip bondingFUJITSU LTD·Filed 2005·Application pending·0 cites
- 4945US8076233B2Method of forming electrode connecting portionISHIKAWA KUNIKO·Filed 2009·Granted Dec 13, 2011·0 cites·6 claims
- 5044US7582553B2Method of bonding flying leadsFUJITSU LTD·Filed 2006·Granted Sep 1, 2009·0 cites·9 claims
Showing the top 50 of 70 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →