Method of ultrasonic mounting and ultrasonic mounting apparatus using the same

Abstract

A method of ultrasonic mounting can increase mounting efficiency by using high-frequency ultrasound and can also mount large semiconductor chips. The method ultrasonically bonds a semiconductor chip 52 to a substrate 50 using an ultrasonic mounting apparatus including a horn 15 that propagates ultrasonic vibration of an ultrasonic vibrator, the horn 15 being made of a ceramic that has a higher vibration propagation speed than metal. The method includes steps of disposing the substrate 50 on a stage 13 , disposing the semiconductor chip 52 on the substrate 50 , and placing the semiconductor chip 52 in contact with a convex part 15 a provided on the horn 15 and applying ultrasonic vibration to bond the semiconductor chip 52 to the substrate 50.

1 . A method of ultrasonic mounting that ultrasonically bonds a semiconductor chip to a substrate using an ultrasonic mounting apparatus including a horn that propagates ultrasonic vibration of an ultrasonic vibrator, two convex parts being formed on the horn corresponding to maximum amplitude points that appear one wavelength apart and vibrate in the same direction due to the ultrasonic vibration, the method comprising steps of:
 disposing the substrate on a stage;   disposing the semiconductor chip on the substrate; and   inserting the semiconductor chip between the two convex parts of the horn and applying ultrasonic vibration from the two convex parts to bond the semiconductor chip to the substrate.   
   
   
       2 . The method of ultrasonic mounting according to  claim 1 ,
 wherein stepped parts that can be engaged by the edge parts of the semiconductor chip are formed in walls of the two convex parts that face one another, the semiconductor chip is inserted between the two convex parts so that the edge parts engage the stepped parts, and ultrasound is applied while the semiconductor chip is pressed by surfaces of the stepped parts.   
   
   
       3 . The method of ultrasonic mounting according to  claim 1 ,
 wherein the semiconductor chip is inserted between the two convex parts via an elastic body.   
   
   
       4 . A method of ultrasonic mounting that ultrasonically bonds a semiconductor chip to a substrate using an ultrasonic mounting apparatus including a stage that propagates ultrasonic vibration of an ultrasonic vibrator, two convex parts being formed on the stage corresponding to maximum amplitude points that appear one wavelength apart and vibrate in the same direction due to the ultrasonic vibration, the method comprising steps of:
 disposing the substrate on the stage so as to be inserted between the two convex parts;   disposing the semiconductor chip on the substrate; and   applying ultrasonic vibration from the two convex parts to the substrate while the semiconductor chip is pressed by a pressing mechanism to bond the semiconductor chip to the substrate.   
   
   
       5 . The method of ultrasonic mounting according to  claim 4 ,
 wherein stepped parts that can be engaged by the edge parts of the substrate are formed in walls of the two convex parts that face one another and the substrate is inserted between the two convex parts so that the edge parts engage the stepped parts.   
   
   
       6 . The method of ultrasonic mounting according to  claim 4 ,
 wherein walls of the two convex parts that face one another are formed as inclined surfaces and the substrate is disposed between the two convex parts so as to be inserted between the inclined surfaces.   
   
   
       7 . The method of ultrasonic mounting according to  claim 4 ,
 wherein the substrate is inserted between the two convex parts via an elastic body.