Resin coating method and apparatus

Abstract

A resin coating method for applying resin to a predetermined region of a wiring board includes the steps of imaging an external appearance of the resin extruded from a resin application device; and automatically adjusting an amount of the resin extruded from the resin application device based on the external appearance of the resin obtained in the imaging step.

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         10 . A resin coating apparatus for applying a resin to a predetermined region of a printed wiring board, comprising: 
 a positioning unit for positioning a tip of an extrusion nozzle of the resin coating apparatus at a predetermined reference height.    
     
     
         11 . A resin coating apparatus for applying resin to a predetermined region of a printed wiring board, comprising: 
 an imaging unit for imaging an external appearance of a resin drop after the resin drop has been expelled from an extrusion nozzle of the resin coating apparatus but before the resin drop contacts the printed wiring board; and    an adjustment unit for adjusting a distance between a tip of the extrusion nozzle and the printed wiring board based on the external appearance of the resin drop.    
     
     
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