US2005196529A1PendingUtilityA1

Resin coating method and apparatus

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Assignee: FUJITSU LTDPriority: Sep 26, 2000Filed: Apr 29, 2005Published: Sep 8, 2005
Est. expirySep 26, 2020(expired)· nominal 20-yr term from priority
Inventors:Shunji BabaTakatoyo YamakamiNorio KainumaKenji KobaeHidehiko KiraHiroshi Kobayashi
H05K 3/284H05K 3/0091H05K 2203/163H05K 2203/0126B05C 11/1034H05K 1/0269B05C 5/0212H10W 90/734H10W 90/724H10W 74/15H10W 74/012H10W 72/9415H10W 72/90H10W 72/073H10W 72/0113
51
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Claims

Abstract

A resin coating method for applying resin to a predetermined region of a wiring board includes the steps of imaging an external appearance of the resin extruded from a resin application device; and automatically adjusting an amount of the resin extruded from the resin application device based on the external appearance of the resin obtained in the imaging step.

Claims

exact text as granted — not AI-modified
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         9 . A resin coating apparatus for applying resin to a predetermined region of a printed wiring board, comprising: 
 a temperature sensor for measuring a temperature of an extrusion nozzle of the resin coating apparatus; and    an automatic adjustment unit for adjusting an amount of the resin extruded from the resin coating apparatus based on the temperature of the nozzle.    
     
     
         10 . (canceled)  
     
     
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         12 . (canceled)

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