Inventor · disambiguated record
Norio Kainuma
Also filed as: KAINUMA NORIO
44 granted patents·19 pending applications·364 citations·filing 1985–2020
98Inventor score
Top patents by PatentIndex Score
63 records- 0190US7471081B2Slider testerFUJITSU LTD·Filed 2006·Granted Dec 30, 2008·8 cites·1 claims
- 0290US6400529B1Integrated circuit chip supporting and electrically connecting a head sliderFUJITSU LTD·Filed 2000·Granted Jun 4, 2002·28 cites·15 claims
- 0389US6943971B2Slider testerFUJITSU LTD·Filed 2003·Granted Sep 13, 2005·29 cites·12 claims
- 0488US7514788B2Structure of mounting electronic componentFUJITSU LTD·Filed 2007·Granted Apr 7, 2009·13 cites·1 claims
- 0586US6437450B1Method of mounting semiconductor chipFUJITSU LTD·Filed 2000·Granted Aug 20, 2002·38 cites·4 claims
- 0685US9536857B1Heating header of semiconductor mounting apparatus and bonding method for semiconductorFUJITSU LTD·Filed 2016·Granted Jan 3, 2017·5 cites·5 claims
- 0785US7424966B2Method of ultrasonic mounting and ultrasonic mounting apparatus using the sameFUJITSU LTD·Filed 2005·Granted Sep 16, 2008·7 cites·4 claims
- 0885US6885522B1Head assembly having integrated circuit chip covered by layer which prevents foreign particle generationFUJITSU LTD·Filed 2000·Granted Apr 26, 2005·17 cites·12 claims
- 0984US10103510B2Optical module and method of manufacturing optical moduleFUJITSU LTD·Filed 2017·Granted Oct 16, 2018·4 cites·4 claims
- 1084US7347347B2Head assembly, disk unit, and bonding method and apparatusFUJITSU LTD·Filed 2004·Granted Mar 25, 2008·15 cites·11 claims
- 1183US6483190B1Semiconductor chip element, semiconductor chip element mounting structure, semiconductor chip element mounting device and mounting methodFUJITSU LTD·Filed 2000·Granted Nov 19, 2002·29 cites·2 claims
- 1276US10103126B2Laminated semiconductor device and manufacturing method of laminated semiconductor deviceFUJITSU LTD·Filed 2017·Granted Oct 16, 2018·2 cites·7 claims
- 1376US7566586B2Method of manufacturing a semiconductor deviceFUJITSU LTD·Filed 2006·Granted Jul 28, 2009·7 cites·11 claims
- 1475US6369985B1Head suspension, head assembly, and disk apparatus having a head IC mounted on a head suspension, and method for fitting a head IC to a head suspensionFUJITSU LTD·Filed 2000·Granted Apr 9, 2002·10 cites·17 claims
- 1574US7828193B2Method of mounting an electronic component and mounting apparatusFUJITSU LTD·Filed 2007·Granted Nov 9, 2010·6 cites·7 claims
- 1673US7355285B2Structure of mounting electronic componentFUJITSU LTD·Filed 2005·Granted Apr 8, 2008·4 cites·3 claims
- 1772US9719848B2Optical module, method for manufacturing optical module, and optical transceiverFUJITSU LTD·Filed 2014·Granted Aug 1, 2017·2 cites·9 claims
- 1872US6582993B1Method of underfilling semiconductor deviceFUJITSU LTD·Filed 2000·Granted Jun 24, 2003·17 cites·7 claims
- 1970US7350685B2Method of mounting electronic componentFUJITSU LTD·Filed 2005·Granted Apr 1, 2008·2 cites·7 claims
- 2070US7196512B2Magnetic head testerFUJITSU LTD·Filed 2003·Granted Mar 27, 2007·8 cites·11 claims
- 2169US7208059B2Method of ultrasonic-mounting electronic component and ultrasonic mounting machineFUJITSU LTD·Filed 2005·Granted Apr 24, 2007·4 cites·6 claims
- 2268US10261249B2Optical module and method of manufacturing optical moduleFUJITSU LTD·Filed 2017·Granted Apr 16, 2019·1 cites·7 claims
- 2367US6716665B2Method of mounting chip onto printed circuit board in shortened working timeFUJITSU LTD·Filed 2001·Granted Apr 6, 2004·13 cites·17 claims
- 2466US6770319B2Resin coating methodFUJITSU LTD·Filed 2001·Granted Aug 3, 2004·7 cites·12 claims
- 2564US7833831B2Method of manufacturing an electronic component and an electronic deviceFUJITSU LTD·Filed 2007·Granted Nov 16, 2010·2 cites·10 claims
- 2663US9793221B2Semiconductor device mounting methodFUJITSU LTD·Filed 2016·Granted Oct 17, 2017·1 cites·14 claims
- 2763US2009146653A1Slider testerFUJITSU LTD·Filed 2008·Application pending·0 cites
- 2862US6006426AMethod of producing a multichip package module in which rough-pitch and fine-pitch chips are mounted on a boardFUJITSU LTD·Filed 1998·Granted Dec 28, 1999·21 cites·17 claims
- 2960US6240634B1Method of producing a multichip package module in which rough-pitch and fine-pitch chips are mounted on a boardFUJITSU LTD·Filed 1999·Granted Jun 5, 2001·19 cites·17 claims
- 3059US2008265002A1Method of ultrasonic mounting and ultrasonic mounting apparatus using the sameFUJITSU LTD·Filed 2007·Application pending·0 cites
- 3159US2008265003A1Method of ultrasonic mounting and ultrasonic mounting apparatus using the sameFUJITSU LTD·Filed 2007·Application pending·0 cites
- 3258US7712650B2Method of mounting a semiconductor chipFUJITSU LTD·Filed 2006·Granted May 11, 2010·1 cites·5 claims
- 3358US7394163B2Method of mounting semiconductor chipFUJITSU LTD·Filed 2002·Granted Jul 1, 2008·6 cites·2 claims
- 3457US10718907B2Holding member and optical moduleFUJITSU LTD·Filed 2019·Granted Jul 21, 2020·0 cites·9 claims
- 3557US7436062B2Semiconductor chip element, semiconductor chip element mounting structure, semiconductor chip element mounting device and mounting methodFUJITSU LTD·Filed 2002·Granted Oct 14, 2008·6 cites·6 claims
- 3656US2005196703A1Resin coating method and apparatusFUJITSU LTD·Filed 2005·Application pending·0 cites
- 3755US6122823AApparatus to produce a multichip package module in which rough-pitch and fine-pitch chips are mounted on a boardFUJITSU LTD·Filed 1999·Granted Sep 26, 2000·15 cites·4 claims
- 3854US10586770B2Optical moduleFUJITSU LTD·Filed 2018·Granted Mar 10, 2020·0 cites·10 claims
- 3954US10444450B2Optical moduleFUJITSU LTD·Filed 2018·Granted Oct 15, 2019·0 cites·9 claims
- 4051US7507654B2Method for mounting electronic element on a circuit boardFUJITSU LTD·Filed 2006·Granted Mar 24, 2009·0 cites·5 claims
- 4151US2005196704A1Resin coating method and apparatusFUJITSU LTD·Filed 2005·Application pending·0 cites
- 4251US2005196529A1Resin coating method and apparatusFUJITSU LTD·Filed 2005·Application pending·0 cites
- 4350US9013048B2Semiconductor device manufacturing method and semiconductor deviceFUJITSU LTD·Filed 2014·Granted Apr 21, 2015·0 cites·8 claims
- 4450US2004213894A1Resin coating method and apparatusFUJITSU LTD·Filed 2004·Application pending·0 cites
- 4547US2020144213A1Optical module, optical communication device, and manufacturing method thereofFUJITSU LTD·Filed 2019·Application pending·0 cites
- 4646US2006030076A1Semiconductor deviceFUJITSU LTD·Filed 2005·Application pending·0 cites
- 4746US2006097029A1Method of flip-chip bondingFUJITSU LTD·Filed 2005·Application pending·0 cites
- 4845US9547126B2Optical waveguide sheet, optical unit, and method for manufacturing the sameFUJITSU LTD·Filed 2015·Granted Jan 17, 2017·0 cites·18 claims
- 4945US8076233B2Method of forming electrode connecting portionISHIKAWA KUNIKO·Filed 2009·Granted Dec 13, 2011·0 cites·6 claims
- 5044US2021191048A1Optical moduleFUJITSU LTD·Filed 2020·Application pending·0 cites
Showing the top 50 of 63 patent records by PatentIndex Score.
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