Inventor · disambiguated record
Gerald Alonzo
Also filed as: ALONZO GERALD · ALONZO GERALD J · ALONZO GERALD JOHN
9 granted patents·12 pending applications·58 citations·filing 1992–2021
85Inventor score
Top patents by PatentIndex Score
21 records- 0189US7963826B2Apparatus and methods for conditioning a polishing padAPPLIED MATERIALS INC·Filed 2009·Granted Jun 21, 2011·9 cites·15 claims
- 0277US7314808B2Method for sequencing substratesAPPLIED MATERIALS INC·Filed 2005·Granted Jan 1, 2008·5 cites·20 claims
- 0364US5266790AFocusing technique suitable for use with an unpatterned specular substrateULTRATECH STEPPER INC·Filed 1992·Granted Nov 30, 1993·19 cites·40 claims
- 0461US11764069B2Asymmetry correction via variable relative velocity of a waferAPPLIED MATERIALS INC·Filed 2021·Granted Sep 19, 2023·0 cites·18 claims
- 0561US5402205AAlignment system for a Half-Field Dyson projection systemULTRATECH STEPPER INC·Filed 1992·Granted Mar 28, 1995·17 cites·23 claims
- 0655US2009036035A1Apparatus and methods for conditioning a polishing padAPPLIED MATERIALS INC·Filed 2008·Application pending·0 cites
- 0755US2009036036A1Apparatus and methods for conditioning a polishing padAPPLIED MATERIALS INC·Filed 2008·Application pending·0 cites
- 0854US2011318997A1Apparatus and methods for conditioning a polishing padNANGOY ROY C·Filed 2011·Application pending·0 cites
- 0953US2007151867A1Apparatus and a method for electrochemical mechanical processing with fluid flow assist elementsAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
- 1052US2007212983A1Apparatus and methods for conditioning a polishing padAPPLIED MATERIALS INC·Filed 2007·Application pending·0 cites
- 1149US11717936B2Methods for a web-based CMP systemAPPLIED MATERIALS INC·Filed 2019·Granted Aug 8, 2023·0 cites·16 claims
- 1249US2008093022A1Method for sequencing substratesYILMAZ ALPAY·Filed 2007·Application pending·0 cites
- 1347US7407433B2Pad characterization toolAPPLIED MATERIALS INC·Filed 2006·Granted Aug 5, 2008·0 cites·18 claims
- 1447US2007153453A1Fully conductive pad for electrochemical mechanical processingAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
- 1546US5329332ASystem for achieving a parallel relationship between surfaces of wafer and reticle of half-field dyson stepperULTRATECH STEPPER INC·Filed 1992·Granted Jul 12, 1994·8 cites·13 claims
- 1644US2007158207A1Methods for electrochemical processing with pre-biased cellsAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
- 1742US2007235344A1Process for high copper removal rate with good planarization and surface finishAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
- 1841US2008014845A1Conditioning disk having uniform structuresYILMAZ ALPAY·Filed 2007·Application pending·0 cites
- 1940US9646859B2Disk-brush cleaner module with fluid jetCHEN HUI·Filed 2010·Granted May 9, 2017·0 cites·19 claims
- 2040US2006276111A1Conditioning element for electrochemical mechanical processingAPPLIED MATERIALS INC·Filed 2005·Application pending·0 cites
- 2140US2009042481A1Method of calibrating or compensating sensor for measuring property of a target surfaceMAVLIEV RASHID A·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →