Inventor · disambiguated record
Wolfgang Lehnert
Also filed as: LEHNERT WOLFGANG
41 granted patents·12 pending applications·100 citations·filing 2007–2025
97Inventor score
Files withINFINEON TECHNOLOGIES AG42BERGER RUDOLF2INFINEON TECHNOLOGIES AUSTRIA2LEHNERT WOLFGANG2AHRENS CARSTEN1
Top patents by PatentIndex Score
53 records- 0192US10903078B2Methods for processing a silicon carbide wafer, and a silicon carbide semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2019·Granted Jan 26, 2021·9 cites·28 claims
- 0292US8822306B2Method for manufacturing a composite wafer having a graphite core, and composite wafer having a graphite coreBERGER RUDOLF·Filed 2011·Granted Sep 2, 2014·16 cites·24 claims
- 0391US11373863B2Method of manufacturing a silicon carbide device and wafer composite including laser modified zones in a handle substrateINFINEON TECHNOLOGIES AG·Filed 2020·Granted Jun 28, 2022·3 cites·12 claims
- 0491US8318575B2Compressive polycrystalline silicon film and method of manufacture thereofLEHNERT WOLFGANG·Filed 2011·Granted Nov 27, 2012·14 cites·11 claims
- 0588US9704750B2Method for forming a semiconductor device and a semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2016·Granted Jul 11, 2017·5 cites·20 claims
- 0687US11887894B2Methods for processing a wide band gap semiconductor wafer using a support layer and methods for forming a plurality of thin wide band gap semiconductor wafers using support layersINFINEON TECHNOLOGIES AG·Filed 2021·Granted Jan 30, 2024·1 cites·21 claims
- 0785US10103123B2Semiconductor devices and processing methodsINFINEON TECHNOLOGIES AG·Filed 2017·Granted Oct 16, 2018·4 cites·15 claims
- 0885US9590044B2Two-dimensional material containing electronic componentsINFINEON TECHNOLOGIES AG·Filed 2013·Granted Mar 7, 2017·5 cites·26 claims
- 0984US9576844B2Method for manufacturing a composite wafer having a graphite core, and composite wafer having a graphite coreINFINEON TECHNOLOGIES AG·Filed 2015·Granted Feb 21, 2017·3 cites·17 claims
- 1084US8786012B2Power semiconductor device and a method for forming a semiconductor deviceMAUDER ANTON·Filed 2012·Granted Jul 22, 2014·5 cites·15 claims
- 1182US12503238B2Fastening device for releasable connection to a perforated rail of an aircraft and method of assemblyTELAIR INT GMBH·Filed 2022·Granted Dec 23, 2025·1 cites·20 claims
- 1282US11107732B2Methods for processing a wide band gap semiconductor wafer, methods for forming a plurality of thin wide band gap semiconductor wafers, and wide band gap semiconductor wafersINFINEON TECHNOLOGIES AG·Filed 2019·Granted Aug 31, 2021·2 cites·19 claims
- 1382US9165821B2Method for providing a self-aligned pad protection in a semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2013·Granted Oct 20, 2015·4 cites·25 claims
- 1481US9219049B2Compound structure and method for forming a compound structureINFINEON TECHNOLOGIES AG·Filed 2013·Granted Dec 22, 2015·4 cites·22 claims
- 1580US12040288B2Chip package and method of forming a chip packageINFINEON TECHNOLOGIES AG·Filed 2023·Granted Jul 16, 2024·0 cites·20 claims
- 1680US9171728B2Method for forming a power semiconductor deviceINFINEON TECHNOLOGIES AUSTRIA·Filed 2014·Granted Oct 27, 2015·3 cites·10 claims
- 1780US7947569B2Method for producing a semiconductor including a foreign material layerINFINEON TECHNOLOGIES AUSTRIA·Filed 2008·Granted May 24, 2011·8 cites·22 claims
- 1877US10431504B2Method of manufacturing semiconductor devices by bonding a semiconductor disk on a base substrate, composite wafer and semiconductor deviceINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2016·Granted Oct 1, 2019·2 cites·12 claims
- 1977US10020226B2Method for forming a semiconductor device and a semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2017·Granted Jul 10, 2018·2 cites·20 claims
- 2077US2024371796A1Chip package and method of forming a chip packageINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 2175US9793167B2Method for forming a wafer structure, a method for forming a semiconductor device and a wafer structureINFINEON TECHNOLOGIES AG·Filed 2016·Granted Oct 17, 2017·2 cites·15 claims
- 2275US2025331246A1Semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2025·Application pending·0 cites
- 2373US10784145B2Wafer composite and method for producing a semiconductor componentINFINEON TECHNOLOGIES AG·Filed 2019·Granted Sep 22, 2020·1 cites·23 claims
- 2473US10651072B2Wafer composite and method for producing semiconductor componentsINFINEON TECHNOLOGIES AG·Filed 2019·Granted May 12, 2020·1 cites·28 claims
- 2571US11735534B2Chip package and method of forming a chip packageINFINEON TECHNOLOGIES AG·Filed 2021·Granted Aug 22, 2023·0 cites·20 claims
- 2668US8685828B2Method of forming a capacitorLEHNERT WOLFGANG·Filed 2011·Granted Apr 1, 2014·2 cites·24 claims
- 2767US12363961B2Semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2021·Granted Jul 15, 2025·0 cites·26 claims
- 2867US8404562B2Method for manufacturing a composite wafer having a graphite core, and composite wafer having a graphite coreBERGER RUDOLF·Filed 2010·Granted Mar 26, 2013·1 cites·16 claims
- 2965US9349804B2Composite wafer for bonding and encapsulating an SiC-based functional layerINFINEON TECHNOLOGIES AG·Filed 2013·Granted May 24, 2016·1 cites·10 claims
- 3063US12494431B2Power semiconductor device and method of producing a power semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2022·Granted Dec 9, 2025·0 cites·36 claims
- 3163US11557505B2Method of manufacturing a template waferINFINEON TECHNOLOGIES AG·Filed 2020·Granted Jan 17, 2023·0 cites·19 claims
- 3262US9236290B2Method for producing a semiconductor deviceAHRENS CARSTEN·Filed 2012·Granted Jan 12, 2016·1 cites·21 claims
- 3361US2024405092A1Semiconductor device comprising a high-k gate dielectric multilayer laminate structure and a method for manufacturing thereofINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 3459US2025006814A1Silicon carbide deviceINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 3558US9224633B2Method for manufacturing a composite wafer having a graphite core, and composite wafer having a graphite coreINFINEON TECHNOLOGIES AG·Filed 2014·Granted Dec 29, 2015·0 cites·4 claims
- 3657US9252045B2Method for manufacturing a composite wafer having a graphite coreINFINEON TECHNOLOGIES AG·Filed 2013·Granted Feb 2, 2016·0 cites·3 claims
- 3757US2025357122A1Method of manufacturing a semiconductor device including an ohmic contact and a gate dielectricINFINEON TECHNOLOGIES AG·Filed 2025·Application pending·0 cites
- 3856US11557506B2Methods for processing a semiconductor substrateINFINEON TECHNOLOGIES AG·Filed 2020·Granted Jan 17, 2023·0 cites·19 claims
- 3955US9196675B2Capacitor and method of forming a capacitorINFINEON TECHNOLOGIES AG·Filed 2014·Granted Nov 24, 2015·0 cites·16 claims
- 4055US9012295B2Compressive polycrystalline silicon film and method of manufacture thereofINFINEON TECHNOLOGIES AG·Filed 2012·Granted Apr 21, 2015·0 cites·12 claims
- 4154US9583559B2Capacitor having a top compressive polycrystalline plateINFINEON TECHNOLOGIES AG·Filed 2015·Granted Feb 28, 2017·0 cites·17 claims
- 4253US9881991B2Capacitor and method of forming a capacitorINFINEON TECHNOLOGIES AG·Filed 2015·Granted Jan 30, 2018·0 cites·20 claims
- 4352US12489017B2Method of manufacturing a semiconductor package, die, and die packageINFINEON TECHNOLOGIES AG·Filed 2022·Granted Dec 2, 2025·0 cites·20 claims
- 4452US9385031B2Method for providing a self-aligned pad protection in a semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2015·Granted Jul 5, 2016·0 cites·12 claims
- 4550US2015279941A1Composite Wafer Having a Graphite CoreINFINEON TECHNOLOGIES AG·Filed 2015·Application pending·0 cites
- 4650US2018047619A1Method of manufacturing a template waferINFINEON TECHNOLOGIES AG·Filed 2017·Application pending·0 cites
- 4749US11424201B2Method of forming an aluminum oxide layer, metal surface with aluminum oxide layer, and electronic deviceINFINEON TECHNOLOGIES AG·Filed 2018·Granted Aug 23, 2022·0 cites·13 claims
- 4849US2014110838A1Semiconductor devices and processing methodsINFINEON TECHNOLOGIES AG·Filed 2012·Application pending·0 cites
- 4947US2016225856A1Composite Wafer Having a SiC-Based Functional LayerINFINEON TECHNOLOGIES AG·Filed 2016·Application pending·0 cites
- 5046US2016086842A1Method for Producing a Semiconductor DeviceINFINEON TECHNOLOGIES AG·Filed 2015·Application pending·0 cites
Showing the top 50 of 53 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →