Inventor · disambiguated record
Akhilesh Kumar Singh
Also filed as: SINGH AKHILESH K · SINGH Akhilesh · Singh Akhilesh Kumar
14 granted patents·9 pending applications·12 citations·filing 2014–2024
84Inventor score
Top patents by PatentIndex Score
23 records- 0188US9953904B1Electronic component package with heatsink and multiple electronic componentsFREESCALE SEMICONDUCTOR INC·Filed 2016·Granted Apr 24, 2018·9 cites·20 claims
- 0269US9598280B2Environmental sensor structureFREESCALE SEMICONDUCTOR INC·Filed 2014·Granted Mar 21, 2017·2 cites·20 claims
- 0363US11189557B2Hybrid packageNXP USA INC·Filed 2020·Granted Nov 30, 2021·0 cites·6 claims
- 0459US9508632B1Apparatus and methods for stackable packagingFREESCALE SEMICONDUCTOR INC·Filed 2015·Granted Nov 29, 2016·1 cites·16 claims
- 0558US2025316553A1Semiconductor device including a routable heat spreaderNXP USA INC·Filed 2024·Application pending·0 cites
- 0653US9559077B2Die attachment for packaged semiconductor deviceFREESCALE SEMICONDUCTOR INC·Filed 2014·Granted Jan 31, 2017·0 cites·19 claims
- 0750US10211184B2Apparatus and methods for multi-die packagingNXP USA INC·Filed 2017·Granted Feb 19, 2019·0 cites·20 claims
- 0849US2020013711A1Hybrid packageNXP USA INC·Filed 2018·Application pending·0 cites
- 0948US2023137977A1Stacking a semiconductor die and chip-scale-package unitNXP BV·Filed 2021·Application pending·0 cites
- 1048US2016064299A1Structure and method to minimize warpage of packaged semiconductor devicesLAKHERA NISHANT·Filed 2014·Application pending·0 cites
- 1148US2025112627A1Clock generation with glitch detection and handlingNXP USA INC·Filed 2024·Application pending·0 cites
- 1247US10217698B2Die attachment for packaged semiconductor deviceNXP USA INC·Filed 2016·Granted Feb 26, 2019·0 cites·14 claims
- 1346US11908784B2Packaged semiconductor device assemblyNXP USA INC·Filed 2020·Granted Feb 20, 2024·0 cites·20 claims
- 1446US9978614B2Structure and method to minimize warpage of packaged semiconductor devicesFREESCALE SEMICONDUCTOR INC·Filed 2016·Granted May 22, 2018·0 cites·14 claims
- 1545US11270972B2Package with conductive underfill ground planeNXP USA INC·Filed 2019·Granted Mar 8, 2022·0 cites·14 claims
- 1644US10431534B2Package with support structureNXP USA INC·Filed 2018·Granted Oct 1, 2019·0 cites·20 claims
- 1743US2017278825A1Apparatus and Methods for Multi-Die PackagingFREESCALE SEMICONDUCTOR INC·Filed 2016·Application pending·0 cites
- 1840US9947614B2Packaged semiconductor device having bent leads and method for formingFREESCALE SEMICONDUCTOR INC·Filed 2016·Granted Apr 17, 2018·0 cites·12 claims
- 1939US9691637B2Method for packaging an integrated circuit device with stress bufferFREESCALE SEMICONDUCTOR INC·Filed 2015·Granted Jun 27, 2017·0 cites·20 claims
- 2035US2019103365A1Selectively shielded semiconductor packageNXP USA INC·Filed 2017·Application pending·0 cites
- 2135US2019157222A1Package with isolation structureNXP USA INC·Filed 2017·Application pending·0 cites
- 2234US10147645B2Wafer level chip scale package with encapsulantFREESCALE SEMICONDUCTOR INC·Filed 2015·Granted Dec 4, 2018·0 cites·17 claims
- 2333US2018053753A1Stackable molded packages and methods of manufacture thereofFREESCALE SEMICONDUCTOR INC·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →