Inventor · disambiguated record
Nishant Lakhera
Also filed as: LAKHERA NISHANT
15 granted patents·6 pending applications·10 citations·filing 2014–2023
85Inventor score
Top patents by PatentIndex Score
21 records- 0188US9953904B1Electronic component package with heatsink and multiple electronic componentsFREESCALE SEMICONDUCTOR INC·Filed 2016·Granted Apr 24, 2018·9 cites·20 claims
- 0277US12415305B2Conduit inserts for encapsulant compound formulation kneading and encapsulation back-end assembly processesNXP USA INC·Filed 2023·Granted Sep 16, 2025·0 cites·14 claims
- 0366US11787097B2Conduit inserts for encapsulant compound formulation kneading and encapsulation back-end assembly processesNXP USA INC·Filed 2021·Granted Oct 17, 2023·0 cites·6 claims
- 0463US11189557B2Hybrid packageNXP USA INC·Filed 2020·Granted Nov 30, 2021·0 cites·6 claims
- 0559US9508632B1Apparatus and methods for stackable packagingFREESCALE SEMICONDUCTOR INC·Filed 2015·Granted Nov 29, 2016·1 cites·16 claims
- 0653US9559077B2Die attachment for packaged semiconductor deviceFREESCALE SEMICONDUCTOR INC·Filed 2014·Granted Jan 31, 2017·0 cites·19 claims
- 0750US10211184B2Apparatus and methods for multi-die packagingNXP USA INC·Filed 2017·Granted Feb 19, 2019·0 cites·20 claims
- 0849US2020013711A1Hybrid packageNXP USA INC·Filed 2018·Application pending·0 cites
- 0948US2016064299A1Structure and method to minimize warpage of packaged semiconductor devicesLAKHERA NISHANT·Filed 2014·Application pending·0 cites
- 1047US10217698B2Die attachment for packaged semiconductor deviceNXP USA INC·Filed 2016·Granted Feb 26, 2019·0 cites·14 claims
- 1146US11908784B2Packaged semiconductor device assemblyNXP USA INC·Filed 2020·Granted Feb 20, 2024·0 cites·20 claims
- 1246US9978614B2Structure and method to minimize warpage of packaged semiconductor devicesFREESCALE SEMICONDUCTOR INC·Filed 2016·Granted May 22, 2018·0 cites·14 claims
- 1345US11270972B2Package with conductive underfill ground planeNXP USA INC·Filed 2019·Granted Mar 8, 2022·0 cites·14 claims
- 1444US10431534B2Package with support structureNXP USA INC·Filed 2018·Granted Oct 1, 2019·0 cites·20 claims
- 1543US2017278825A1Apparatus and Methods for Multi-Die PackagingFREESCALE SEMICONDUCTOR INC·Filed 2016·Application pending·0 cites
- 1640US9947614B2Packaged semiconductor device having bent leads and method for formingFREESCALE SEMICONDUCTOR INC·Filed 2016·Granted Apr 17, 2018·0 cites·12 claims
- 1739US9691637B2Method for packaging an integrated circuit device with stress bufferFREESCALE SEMICONDUCTOR INC·Filed 2015·Granted Jun 27, 2017·0 cites·20 claims
- 1835US2019103365A1Selectively shielded semiconductor packageNXP USA INC·Filed 2017·Application pending·0 cites
- 1935US2019157222A1Package with isolation structureNXP USA INC·Filed 2017·Application pending·0 cites
- 2034US10147645B2Wafer level chip scale package with encapsulantFREESCALE SEMICONDUCTOR INC·Filed 2015·Granted Dec 4, 2018·0 cites·17 claims
- 2133US2018053753A1Stackable molded packages and methods of manufacture thereofFREESCALE SEMICONDUCTOR INC·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →