Inventor · disambiguated record
Yung-Wei Hsieh
Also filed as: HSIEH YUNG-WEI
6 granted patents·11 pending applications·30 citations·filing 2012–2024
79Inventor score
Top patents by PatentIndex Score
17 records- 0190US8501614B1Method for manufacturing fine-pitch bumps and structure thereofSHIH CHENG-HUNG·Filed 2012·Granted Aug 6, 2013·16 cites·7 claims
- 0277US8530344B1Method for manufacturing fine-pitch bumps and structure thereofSHIH CHENG-HUNG·Filed 2012·Granted Sep 10, 2013·5 cites·7 claims
- 0373US8497579B1Semiconductor packaging method and structure thereofSHIH CHENG-HUNG·Filed 2012·Granted Jul 30, 2013·4 cites·7 claims
- 0472US9508676B1Semiconductor package structure having hollow chamber and bottom substrate and package process thereofCHIPBOND TECH CORP·Filed 2015·Granted Nov 29, 2016·3 cites·17 claims
- 0562US2025239491A1Chip structure and method of manufacturing the sameCHIPBOND TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 0662US2025239568A1Semiconductor package and method of manufacturing the sameCHIPBOND TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 0760US8581239B2Package structure and semiconductor structure thereofSHIH CHENG-HUNG·Filed 2012·Granted Nov 12, 2013·2 cites·9 claims
- 0859US2025038052A1Chip structure and method of manufacturing the sameCHIPBOND TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 0948US2014367856A1Semiconductor manufacturing process and structure thereofCHIPBOND TECHNOLOGY CORP·Filed 2014·Application pending·0 cites
- 1047US2013256882A1Method for manufacturing fine-pitch bumps and structure thereofCHIPBOND TECHNOLOGY CORP·Filed 2013·Application pending·0 cites
- 1147US2013249089A1Method for manufacturing fine-pitch bumps and structure thereofCHIPBOND TECHNOLOGY CORP·Filed 2013·Application pending·0 cites
- 1245US8877629B2Semiconductor manufacturing process and structure thereofCHIPBOND TECHNOLOGY CORP·Filed 2013·Granted Nov 4, 2014·0 cites·11 claims
- 1345US2013252374A1Semiconductor packaging method and structure thereofCHIPBOND TECHNOLOGY CORP·Filed 2013·Application pending·0 cites
- 1440US2016020166A1Trace structure of fine-pitch patternCHIPBOND TECHNOLOGY CORP·Filed 2014·Application pending·0 cites
- 1535US2013183823A1Bumping processKUO CHIH-MING·Filed 2012·Application pending·0 cites
- 1635US2013214419A1Semiconductor packaging method and structure thereofSHIH CHENG-HUNG·Filed 2012·Application pending·0 cites
- 1728US2016318756A1Process for manufacturing semiconductor package having hollow chamberCHIPBOND TECH CORP·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →