Assignee
CHIPBOND TECHNOLOGY CORP
TW·67 granted patents·52 pending applications·58 citations·filing 2002–2025
Top patents by PatentIndex Score
119 records- 0186US11322437B2Flip chip interconnection and circuit board thereofCHIPBOND TECHNOLOGY CORP·Filed 2020·Granted May 3, 2022·2 cites·19 claims
- 0285US11792923B2Storage device for flexible circuit packages and carrier thereofCHIPBOND TECHNOLOGY CORP·Filed 2021·Granted Oct 17, 2023·1 cites·14 claims
- 0385US8347490B1Method for fabricating a carrier with a three dimensional inductorCHIPBOND TECHNOLOGY CORP·Filed 2011·Granted Jan 8, 2013·7 cites·8 claims
- 0484US10580729B2Chip on film package and flexible substrate thereofCHIPBOND TECHNOLOGY CORP·Filed 2018·Granted Mar 3, 2020·4 cites·15 claims
- 0581US11651974B2Semiconductor package and method of fabricating the sameCHIPBOND TECHNOLOGY CORP·Filed 2021·Granted May 16, 2023·1 cites·7 claims
- 0677US2025393118A1Flip-chip bonding structure and circuit board thereofCHIPBOND TECHNOLOGY CORP·Filed 2025·Application pending·0 cites
- 0776US2026068058A1Tape and manufacturing method thereofCHIPBOND TECHNOLOGY CORP·Filed 2025·Application pending·0 cites
- 0875US8050467B2Package, packaging method and substrate thereof for sliding type thin fingerprint sensorCHIPBOND TECHNOLOGY CORP·Filed 2007·Granted Nov 1, 2011·11 cites·19 claims
- 0971US10242899B2Wafer cassetteCHIPBOND TECHNOLOGY CORP·Filed 2017·Granted Mar 26, 2019·4 cites·20 claims
- 1071US8658528B2Bumping process and structure thereofCHIPBOND TECHNOLOGY CORP·Filed 2013·Granted Feb 25, 2014·3 cites·8 claims
- 1169US9177830B1Substrate with bump structure and manufacturing method thereofCHIPBOND TECHNOLOGY CORP·Filed 2014·Granted Nov 3, 2015·4 cites·6 claims
- 1269US8981536B1Semiconductor structureCHIPBOND TECHNOLOGY CORP·Filed 2013·Granted Mar 17, 2015·3 cites·6 claims
- 1368US2025343193A1Flip chip bonding method and chip used thereinCHIPBOND TECHNOLOGY CORP·Filed 2025·Application pending·0 cites
- 1467US12224734B2Surface acoustic wave device and method of manufacturing the sameCHIPBOND TECHNOLOGY CORP·Filed 2022·Granted Feb 11, 2025·0 cites·8 claims
- 1567US9247635B2Flexible substrateCHIPBOND TECHNOLOGY CORP·Filed 2014·Granted Jan 26, 2016·2 cites·9 claims
- 1667US8513772B2Method for fabricating a three-dimensional inductor carrier with metal core and structure thereofCHIPBOND TECHNOLOGY CORP·Filed 2013·Granted Aug 20, 2013·2 cites·12 claims
- 1766US12432849B2Flip-chip bonding structure and circuit board thereofCHIPBOND TECHNOLOGY CORP·Filed 2023·Granted Sep 30, 2025·0 cites·10 claims
- 1864US2026020137A1Heat dissipation sheet, circuit board, and electronic deviceCHIPBOND TECHNOLOGY CORP·Filed 2025·Application pending·0 cites
- 1964US2022336233A1Semiconductor package and method of fabricating the sameCHIPBOND TECHNOLOGY CORP·Filed 2022·Application pending·0 cites
- 2063US12543262B2Thin film circuit boardCHIPBOND TECHNOLOGY CORP·Filed 2023·Granted Feb 3, 2026·0 cites·16 claims
- 2162US7953257B2Sliding type thin fingerprint sensor packageCHIPBOND TECHNOLOGY CORP·Filed 2007·Granted May 31, 2011·3 cites·18 claims
- 2262US6602762B2System and method of laser sintering dies and dies sintered by laser sinteringCHIPBOND TECHNOLOGY CORP·Filed 2002·Granted Aug 5, 2003·10 cites·5 claims
- 2362US2025239491A1Chip structure and method of manufacturing the sameCHIPBOND TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 2462US2025239568A1Semiconductor package and method of manufacturing the sameCHIPBOND TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 2561US2026020162A1Substrate structure and method of manufacturing the sameCHIPBOND TECHNOLOGY CORP·Filed 2025·Application pending·0 cites
- 2661US2023380072A1Tape and manufacturing method thereofCHIPBOND TECHNOLOGY CORP·Filed 2023·Application pending·0 cites
- 2760US12424551B2Semiconductor structure and method of manufacturing the sameCHIPBOND TECHNOLOGY CORP·Filed 2022·Granted Sep 23, 2025·0 cites·10 claims
- 2860US2025038130A1Wafer and chip thereofCHIPBOND TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 2959US8823169B2Semiconductor manufacturing method and semiconductor structure thereofCHIPBOND TECHNOLOGY CORP·Filed 2012·Granted Sep 2, 2014·1 cites·8 claims
- 3059US2025038052A1Chip structure and method of manufacturing the sameCHIPBOND TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 3158US12588541B2Flip chip bonding method and chip used thereinCHIPBOND TECHNOLOGY CORP·Filed 2022·Granted Mar 24, 2026·0 cites·5 claims
- 3258US12224183B2Method of manufacturing semiconductor deviceCHIPBOND TECHNOLOGY CORP·Filed 2022·Granted Feb 11, 2025·0 cites·18 claims
- 3357US12543581B2Flip-chip bonding structure and substrate thereofCHIPBOND TECHNOLOGY CORP·Filed 2023·Granted Feb 3, 2026·0 cites·10 claims
- 3457US12538805B2Semiconductor package and method of manufacturing the sameCHIPBOND TECHNOLOGY CORP·Filed 2022·Granted Jan 27, 2026·0 cites·8 claims
- 3557US12525481B2Clamp assemblyCHIPBOND TECHNOLOGY CORP·Filed 2023·Granted Jan 13, 2026·0 cites·11 claims
- 3657US12317462B2Electronic package and method of manufacturing the sameCHIPBOND TECHNOLOGY CORP·Filed 2023·Granted May 27, 2025·0 cites·14 claims
- 3757US11522517B2Surface acoustic wave device and method of manufacturing the sameCHIPBOND TECHNOLOGY CORP·Filed 2019·Granted Dec 6, 2022·0 cites·7 claims
- 3857US11503698B1Flexible circuit board and heat spreader thereofCHIPBOND TECHNOLOGY CORP·Filed 2021·Granted Nov 15, 2022·0 cites·10 claims
- 3957US2021035947A1Method and device for compression bonding chip to substrateCHIPBOND TECHNOLOGY CORP·Filed 2020·Application pending·0 cites
- 4057US2025071895A1Flexible circuit tape and flexible circuit board thereofCHIPBOND TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 4156US11084684B2Restriction device for preventing deformation of restriction plate of reelCHIPBOND TECHNOLOGY CORP·Filed 2019·Granted Aug 10, 2021·0 cites·13 claims
- 4256US2025157970A1Flip chip structure and circuit board thereofCHIPBOND TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 4355US10999928B1Circuit boardCHIPBOND TECHNOLOGY CORP·Filed 2020·Granted May 4, 2021·0 cites·13 claims
- 4455US2024194646A1Semiconductor packageCHIPBOND TECHNOLOGY CORP·Filed 2023·Application pending·0 cites
- 4554US11234328B2Circuit boardCHIPBOND TECHNOLOGY CORP·Filed 2020·Granted Jan 25, 2022·0 cites·14 claims
- 4654US8963675B2Method for fabricating a carrier with a three dimensional inductor and structure thereofCHIPBOND TECHNOLOGY CORP·Filed 2012·Granted Feb 24, 2015·0 cites·2 claims
- 4754US2025220807A1Test padCHIPBOND TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 4854US2025159801A1Flexible circuit boardCHIPBOND TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 4953US12456673B2Flip chip package and substrate thereofCHIPBOND TECHNOLOGY CORP·Filed 2023·Granted Oct 28, 2025·0 cites·17 claims
- 5053US9961759B2Flexible substrateCHIPBOND TECHNOLOGY CORP·Filed 2016·Granted May 1, 2018·0 cites·13 claims
Showing the top 50 of 119 patent records by PatentIndex Score.
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