Inventor · disambiguated record
Yen-Kun Wang
Also filed as: WANG YEN-KUN · WANG YEN-KUN V · WANG YEN-KUN VICTOR
25 granted patents·10 pending applications·2,027 citations·filing 1997–2023
97Inventor score
Top patents by PatentIndex Score
35 records- 0197US6148761ADual channel gas distribution plateAPPLIED MATERIALS INC·Filed 1998·Granted Nov 21, 2000·746 cites·19 claims
- 0296US7854820B2Upper electrode backing member with particle reducing featuresLAM RES CORP·Filed 2006·Granted Dec 21, 2010·38 cites·7 claims
- 0396US7335609B2Gap-fill depositions introducing hydroxyl-containing precursors in the formation of silicon containing dielectric materialsAPPLIED MATERIALS INC·Filed 2005·Granted Feb 26, 2008·70 cites·18 claims
- 0495US6176198B1Apparatus and method for depositing low K dielectric materialsAPPLIED MATERIALS INC·Filed 1998·Granted Jan 23, 2001·298 cites·18 claims
- 0595US5866795ALiquid flow rate estimation and verification by direct liquid measurementAPPLIED MATERIALS INC·Filed 1997·Granted Feb 2, 1999·564 cites·24 claims
- 0694US8313612B2Method and apparatus for reduction of voltage potential spike during dechuckingMCMILLIN BRIAN·Filed 2009·Granted Nov 20, 2012·55 cites·5 claims
- 0791US7722719B2Gas baffle and distributor for semiconductor processing chamberAPPLIED MATERIALS INC·Filed 2005·Granted May 25, 2010·22 cites·29 claims
- 0889US12031885B2Leak detection for gas sticksAPPLIED MATERIALS INC·Filed 2023·Granted Jul 9, 2024·1 cites·18 claims
- 0989US7456116B2Gap-fill depositions in the formation of silicon containing dielectric materialsAPPLIED MATERIALS INC·Filed 2004·Granted Nov 25, 2008·42 cites·16 claims
- 1087US8895452B2Substrate support providing gap height and planarization adjustment in plasma processing chamberANTOLIK JERREL KENT·Filed 2012·Granted Nov 25, 2014·12 cites·22 claims
- 1187US8628675B2Method for reduction of voltage potential spike during dechuckingLAM RES CORP·Filed 2012·Granted Jan 14, 2014·7 cites·20 claims
- 1286US8702866B2Showerhead electrode assembly with gas flow modification for extended electrode lifeAUGUSTINO JASON·Filed 2006·Granted Apr 22, 2014·10 cites·19 claims
- 1385US7011710B2Concentration profile on demand gas delivery system (individual divert delivery system)APPLIED MATERIALS INC·Filed 2001·Granted Mar 14, 2006·29 cites·10 claims
- 1484US8492736B2Ozone plenum as UV shutter or tunable UV filter for cleaning semiconductor substratesWANG YEN-KUN VICTOR·Filed 2010·Granted Jul 23, 2013·10 cites·9 claims
- 1578US8624210B2Ozone plenum as UV shutter or tunable UV filter for cleaning semiconductor substratesLAM RES CORP·Filed 2013·Granted Jan 7, 2014·5 cites·13 claims
- 1678US6506994B2Low profile thick film heaters in multi-slot bake chamberAPPLIED MATERIALS INC·Filed 2001·Granted Jan 14, 2003·22 cites·36 claims
- 1777US5968588AIn-situ liquid flow rate estimation and verification by sonic flow methodAPPLIED MATERIALS INC·Filed 1997·Granted Oct 19, 1999·50 cites·33 claims
- 1876US7204888B2Lift pin assembly for substrate processingAPPLIED MATERIALS INC·Filed 2003·Granted Apr 17, 2007·22 cites·21 claims
- 1976US7192486B2Clog-resistant gas delivery systemAPPLIED MATERIALS INC·Filed 2002·Granted Mar 20, 2007·15 cites·18 claims
- 2071US8709202B2Upper electrode backing member with particle reducing featuresDE LA LLERA ANTHONY·Filed 2010·Granted Apr 29, 2014·2 cites·11 claims
- 2164US7754282B2Adjusting a spacing between a gas distribution member and a substrate supportAPPLIED MATERIALS INC·Filed 2008·Granted Jul 13, 2010·2 cites·19 claims
- 2262USRE47275ESubstrate support providing gap height and planarization adjustment in plasma processing chamberLAM RES CORP·Filed 2015·Granted Mar 5, 2019·1 cites·71 claims
- 2356US7841582B2Variable seal pressure slit valve doors for semiconductor manufacturing equipmentAPPLIED MATERIALS INC·Filed 2004·Granted Nov 30, 2010·4 cites·14 claims
- 2455US2009197356A1Substrate positioning on a vacuum chuckAPPLIED MATERIALS INC·Filed 2009·Application pending·0 cites
- 2555US2009113684A1Uniformly Compressed Process Chamber Gate Seal for Semiconductor Processing ChamberAPPLIED MATERIALS INC·Filed 2008·Application pending·0 cites
- 2653US9093483B2Showerhead electrode assembly with gas flow modification for extended electrode lifeLAM RES CORP·Filed 2014·Granted Jul 28, 2015·0 cites·17 claims
- 2751US2024203695A1Fast gas switchingAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 2851US2008115726A1gap-fill depositions introducing hydroxyl-containing precursors in the formation of silicon containing dielectric materialsAPPLIED MATERIALS INC·Filed 2007·Application pending·0 cites
- 2949US2007076345A1Substrate placement determination using substrate backside pressure measurementBANG WON B·Filed 2005·Application pending·0 cites
- 3047US2011120017A1Variable seal pressure slit valve doors for semiconductor manufacturing equipmentAPPLIED MATERIALS INC·Filed 2010·Application pending·0 cites
- 3144US2005268857A1Uniformly compressed process chamber gate seal for semiconductor processing chamberAPPLIED MATERIALS INC·Filed 2004·Application pending·0 cites
- 3244US2004089420A1Bypass set up for integration of remote optical endpoint for CVD chamberAPPLIED MATERIALS INC·Filed 2003·Application pending·0 cites
- 3341US2003027428A1Bypass set up for integration of remote optical endpoint for CVD chamberAPPLIED MATERIALS INC·Filed 2001·Application pending·0 cites
- 3439US2004163590A1In-situ health check of liquid injection vaporizerAPPLIED MATERIALS INC·Filed 2003·Application pending·0 cites
- 3538US7205205B2Ramp temperature techniques for improved mean wafer before cleanAPPLIED MATERIALS INC·Filed 2003·Granted Apr 17, 2007·0 cites·29 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →