Inventor · disambiguated record
Sa-Yoon Kang
Also filed as: KANG SA-YOON
44 granted patents·13 pending applications·2,089 citations·filing 1998–2014
98Inventor score
Top patents by PatentIndex Score
57 records- 0199US6235552B1Chip scale package and method for manufacturing the same using a redistribution substrateSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted May 22, 2001·262 cites·8 claims
- 0298US6607938B2Wafer level stack chip package and method for manufacturing sameSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Aug 19, 2003·394 cites·16 claims
- 0398US6187615B1Chip scale packages and methods for manufacturing the chip scale packages at wafer levelSAMSUNG ELECTRONICS CO LTD·Filed 1998·Granted Feb 13, 2001·364 cites·20 claims
- 0497US6448661B1Three-dimensional multi-chip package having chip selection pads and manufacturing method thereofSAMSUNG ELECTORNICS CO LTD·Filed 2002·Granted Sep 10, 2002·420 cites·14 claims
- 0594US6376279B1method for manufacturing a semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted Apr 23, 2002·81 cites·12 claims
- 0693US6407459B2Chip scale packageSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Jun 18, 2002·68 cites·5 claims
- 0791US6849802B2Semiconductor chip, chip stack package and manufacturing methodSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Feb 1, 2005·56 cites·15 claims
- 0889US8222089B2Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and electronic apparatus including the sameCHOI KYOUNG-SEI·Filed 2011·Granted Jul 17, 2012·10 cites·12 claims
- 0988US9570400B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Feb 14, 2017·12 cites·16 claims
- 1088US7732933B2Semiconductor chip and TAB package having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Jun 8, 2010·15 cites·20 claims
- 1188US7683471B2Display driver integrated circuit device, film, and moduleSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Mar 23, 2010·9 cites·13 claims
- 1288US7208343B2Semiconductor chip, chip stack package and manufacturing methodSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Apr 24, 2007·42 cites·11 claims
- 1387US7329597B2Semiconductor chip and tab package having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Feb 12, 2008·14 cites·28 claims
- 1486US7299547B2Method for manufacturing tape wiring boardSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Nov 27, 2007·11 cites·15 claims
- 1586US6818998B2Stacked chip package having upper chip provided with trenches and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Nov 16, 2004·38 cites·12 claims
- 1684US7078331B2Method of forming redistribution bump and semiconductor chip and mount structure fabricated using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Jul 18, 2006·32 cites·11 claims
- 1783US6518675B2Wafer level package and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted Feb 11, 2003·26 cites·27 claims
- 1882US7915727B2Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and electronic apparatus including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Mar 29, 2011·8 cites·20 claims
- 1981US6555921B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Apr 29, 2003·27 cites·12 claims
- 2079US7309916B2Semiconductor package and method for its manufactureSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Dec 18, 2007·9 cites·17 claims
- 2178US7109575B2Low-cost flexible film package module and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Sep 19, 2006·15 cites·9 claims
- 2278US6586275B2Wafer level package and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Jul 1, 2003·20 cites·18 claims
- 2377US7948768B2Tape circuit substrate with reduced size of base filmSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted May 24, 2011·6 cites·6 claims
- 2477US7599193B2Tape circuit substrate with reduced size of base filmSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Oct 6, 2009·21 cites·9 claims
- 2576US7115483B2Stacked chip package having upper chip provided with trenches and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Oct 3, 2006·19 cites·9 claims
- 2672US7902647B2TAB package connecting host device elementSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Mar 8, 2011·4 cites·12 claims
- 2772US6903451B1Chip scale packages manufactured at wafer levelSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted Jun 7, 2005·18 cites·32 claims
- 2871US7190073B2Circuit film with bump, film package using the same, and related fabrication methodsSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Mar 13, 2007·4 cites·14 claims
- 2971US6836018B2Wafer level package and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Dec 28, 2004·13 cites·17 claims
- 3069US7315086B2Chip-on-board package having flip chip assembly structure and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Jan 1, 2008·3 cites·20 claims
- 3168US8575746B2Chip on flexible printed circuit type semiconductor packageLEE SI-HOON·Filed 2007·Granted Nov 5, 2013·5 cites·34 claims
- 3267US7649246B2Tab package connecting host device elementSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Jan 19, 2010·3 cites·19 claims
- 3367US7405760B2Image pickup device with non-molded DSP chip and manufacturing methodSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Jul 29, 2008·15 cites·18 claims
- 3467US6791196B2Semiconductor devices with bonding pads having intermetal dielectric layer of hybrid configuration and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Sep 14, 2004·15 cites·45 claims
- 3561US7375426B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted May 20, 2008·2 cites·43 claims
- 3660US7895742B2Method for manufacturing tape wiring boardSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Mar 1, 2011·1 cites·13 claims
- 3760US7683476B2Semiconductor package film having reinforcing member and related display moduleSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Mar 23, 2010·1 cites·6 claims
- 3860US7339262B2Tape circuit substrate and semiconductor apparatus employing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Mar 4, 2008·8 cites·39 claims
- 3955US7183660B2Tape circuit substrate and semicondutor chip package using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Feb 27, 2007·6 cites·15 claims
- 4054US2008081456A1Chip-on-board package having flip chip assembly structure and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 4153US7074704B2Bump formed on semiconductor device chip and method for manufacturing the bumpSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Jul 11, 2006·4 cites·18 claims
- 4252US7999341B2Display driver integrated circuit device, film, and moduleSAMSUNG ELECTRONICS CO LTD·Filed 2010·Granted Aug 16, 2011·0 cites·3 claims
- 4351US2006268213A1Low-cost flexible film package module and method of manufacturing the sameKANG SA-YOON·Filed 2006·Application pending·0 cites
- 4450US6902261B2Method and apparatus for bonding a flexible printed circuit cable to an ink jet print head assemblySAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Jun 7, 2005·4 cites·30 claims
- 4549US8250750B2Method for manufacturing tape wiring boardCHOI KYOUNG-SEI·Filed 2011·Granted Aug 28, 2012·0 cites·10 claims
- 4649US2007126110A1Circuit film with bump, film package using the same, and related fabrication methodsSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 4748US6717272B2Reinforced bond-pad substructure and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Apr 6, 2004·4 cites·25 claims
- 4847US2006202334A1Method of forming redistribution bump and semiconductor chip and mount structure fabricated using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 4944US2006091504A1Film circuit substrate having Sn-In alloy layerKANG UN-BYOUNG·Filed 2005·Application pending·0 cites
- 5043US2006071303A1Film substrate of a semiconductor package and a manufacturing methodLEE CHUNG-SUN·Filed 2005·Application pending·0 cites
Showing the top 50 of 57 patent records by PatentIndex Score.
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