Low-cost flexible film package module and method of manufacturing the same

Abstract

Provided are a flexible film package module and a method of manufacturing the same that can be adapted for manufacture at lower cost and/or to adapt the characteristics of the flexible film package module for specific applications. The lower-cost flexible film package module includes a tape film that combines both a first insulating substrate, typically formed from a higher-cost polyimide material, and a second insulating substrate, typically formed from an insulating material or materials that are less expensive and/or provide modified performance when compared with the first insulating material. Both the first and second substrates will include complementary circuit patterns that will be electrically and physically connected to allow the composite substrate to function as a unitary substrate. The first and second substrates will also include connection regions that may be adapted for connection to printed circuit boards and/or electronic devices such as liquid crystal displays.

1 .- 9 . (canceled)  
   
   
       10 . A method of manufacturing a flexible film package module comprising: 
 preparing a plurality of semiconductor package main bodies, each package main body including an input circuit and an output circuit;    mounting a semiconductor chip on each of the package main bodies;    preparing a package common body, the package common body including a conductive pattern; and    electrically and mechanically attaching each of the package main bodies to the package common body, whereby the input circuits are connected to the conductive pattern in a parallel configuration.    
   
   
       11 . A method of manufacturing a flexible film package module according to  claim 10 , wherein: 
 preparing the package main bodies includes preparing a plurality of first insulating substrates from a first insulating material; and    preparing the package common body includes preparing a second insulating substrate from a second insulating material, wherein the first and second insulating materials are different materials.    
   
   
       12 . A method of manufacturing a flexible film package module according to  claim 11 , wherein: 
 the first insulating material is a polyimide having a first coefficient of thermal expansion CTE 1 ; and    the second insulating material is a material other than a polyimide and has a second coefficient of thermal expansion CTE 2 , wherein CTE 1 <CTE 2 .    
   
   
       13 . A method of manufacturing a flexible film package module according to  claim 11 , wherein: 
 electrically and mechanically attaching each of the package main bodies to the package common body includes positioning an anisotropic conductive film between each of the input circuits and a corresponding region of the conductive pattern.    
   
   
       14 . A method of manufacturing a flexible film package module according to  claim 11 , wherein: 
 electrically and mechanically attaching each of the package main bodies to the package common body utilizes a thermocompression bonding process.    
   
   
       15 . The method of  claim 14 , wherein: 
 the thermocompression bonding process includes the simultaneous application of ultrasonic vibrations and heat to complementary portions of the input circuits and the conductive pattern.    
   
   
       16 . A method of manufacturing a flexible film package module according to  claim 11 , wherein: 
 preparing the package common body includes forming a connection region arranged and configured to connect the conducive pattern to a printed circuit board (PCB).    
   
   
       17 . A method of manufacturing a flexible film package module according to  claim 16 , wherein: 
 the package common body has a first width W eb  and the connection region has a second width W er , wherein a ratio of W eb :W er  is at least 2:1.    
   
   
       18 . A method of manufacturing a flexible film package module according to  claim 16 , wherein: 
 the package common body has a first width W eb  and the printed circuit board has a second width W pcb , wherein a ratio of W eb :W pcb  is at least 2:1.    
   
   
       19 . A method of manufacturing a flexible film package module according to  claim 11 , wherein: 
 preparing the semiconductor package main bodies included preparing a plurality of packages having a configuration selected from a group consisting of tape carrier packages (TCPs) and chip on film (COF) packages.    
   
   
       20 . A method of manufacturing a flexible film package module according to  claim 11 , comprising: 
 preparing a connection region on the output circuit for connection with a liquid crystal display (LCD); and    preparing a connection region on the conductive pattern for connection with a printed circuit board (PCB).