Inventor · disambiguated record
Kuo-Ming Chen
Also filed as: CHEN KUO-MING
20 granted patents·14 pending applications·205 citations·filing 1996–2024
95Inventor score
Files withUNITED MICROELECTRONICS CORP13JWU CHING HK CO LTD5CHEN KUO-MING4HO KAI-KUANG3SHING FUH TAI TECH CORP2
Top patents by PatentIndex Score
34 records- 0187USD631606SCosmetic caseJWU CHING HK CO LTD·Filed 2010·Granted Jan 25, 2011·40 cites·1 claims
- 0284US10646974B2Indexing deviceCHEN KUO MING·Filed 2018·Granted May 12, 2020·2 cites·5 claims
- 0383US6940176B2Solder pads for improving reliability of a packageUNITED MICROELECTRONICS CORP·Filed 2002·Granted Sep 6, 2005·30 cites·20 claims
- 0482USD690055SCosmetic caseCHEN KUO-MING·Filed 2012·Granted Sep 17, 2013·29 cites·1 claims
- 0573US6881654B2Solder bump structure and laser repair process for memory deviceUNITED MICROELECTRONICS CORP·Filed 2002·Granted Apr 19, 2005·22 cites·9 claims
- 0672US7534653B2Chip packaging processUNITED MICROELECTRONICS CORP·Filed 2006·Granted May 19, 2009·4 cites·10 claims
- 0770USD641933SCosmetic caseJWU CHING HK CO LTD·Filed 2010·Granted Jul 19, 2011·17 cites·1 claims
- 0867US7026234B2Parasitic capacitance-preventing dummy solder bump structure and method of making the sameUNITED MICROELECTRONICS CORP·Filed 2004·Granted Apr 11, 2006·14 cites·17 claims
- 0966US7241678B2Integrated die bumping processUNITED MICROELECTRONICS CORP·Filed 2005·Granted Jul 10, 2007·3 cites·15 claims
- 1061US7285739B1Waterproof structure for switch pinsZIPPY TECH CORP·Filed 2006·Granted Oct 23, 2007·3 cites·12 claims
- 1160USD660518SCosmetic caseCHEN KUO-MING·Filed 2010·Granted May 22, 2012·11 cites·1 claims
- 1259US7268440B2Fabrication of semiconductor integrated circuit chipsUNITED MICROELECTRONICS CORP·Filed 2005·Granted Sep 11, 2007·2 cites·4 claims
- 1359US7211500B2Pre-process before cutting a wafer and method of cutting a waferUNITED MICROELECTRONICS CORP·Filed 2004·Granted May 1, 2007·6 cites·13 claims
- 1458US7399695B2Integrated die bumping processUNITED MICROELECTRONICS CORP·Filed 2006·Granted Jul 15, 2008·1 cites·10 claims
- 1558US2024381447A1Mobile communication device and methodMEDIATEK INC·Filed 2024·Application pending·0 cites
- 1654US2009218679A1Chip package and process thereofUNITED MICROELECTRONICS CORP·Filed 2009·Application pending·0 cites
- 1752US2008185710A1Chip package and process thereofUNITED MICROELECTRONICS CORP·Filed 2008·Application pending·0 cites
- 1852US2024347503A1Semiconductor structure and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 1950USD630380SCosmetic caseJWU CHING HK CO LTD·Filed 2010·Granted Jan 4, 2011·7 cites·1 claims
- 2049US9269645B1Fan-out wafer level packageUNITED MICROELECTRONICS CORP·Filed 2014·Granted Feb 23, 2016·0 cites·15 claims
- 2146US2006231932A1Electrical package structure including chip with polymer thereonHO KAI-KUANG·Filed 2006·Application pending·0 cites
- 2245USD687602SCosmetic caseCHEN KUO-MING·Filed 2012·Granted Aug 6, 2013·5 cites·1 claims
- 2345US2009137097A1Method for dicing waferUNITED MICROELECTRONICS CORP·Filed 2007·Application pending·0 cites
- 2440US2006071305A1Electrical package structure including chip with polymer thereonHO KAI-KUANG·Filed 2004·Application pending·0 cites
- 2539US2005212132A1Chip package and process thereofHSUAN MIN-CHIH·Filed 2004·Application pending·0 cites
- 2639US2006219862A1Compact camera module with reduced thicknessHO KAI-KUANG·Filed 2005·Application pending·0 cites
- 2738USD630379SCosmetic caseJWU CHING HK CO LTD·Filed 2010·Granted Jan 4, 2011·3 cites·1 claims
- 2837US2019111587A1Injection molding equipmentSHING FUH TAI TECH CORP·Filed 2017·Application pending·0 cites
- 2937US2006278957A1Fabrication of semiconductor integrated circuit chipsLIN ZONG-HUEI·Filed 2005·Application pending·0 cites
- 3036USD631202SCosmetic caseJWU CHING HK CO LTD·Filed 2010·Granted Jan 18, 2011·2 cites·1 claims
- 3134US2018099441A1Feeding apparatusSHING FUH TAI TECH CORP·Filed 2016·Application pending·0 cites
- 3232US2005002167A1Microelectronic packageFiled 2003·Application pending·0 cites
- 3329US5664658ASwitch assembly for a coin collectorSHIN JIUH CORP·Filed 1996·Granted Sep 9, 1997·4 cites·2 claims
- 3427US2005099127A1Light emitting panel moduleFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →