Assignee
HO KAI-KUANG
0 granted patents·3 pending applications·0 citations·filing 2004–2006
Top patents by PatentIndex Score
3 records- 0146US2006231932A1Electrical package structure including chip with polymer thereonHO KAI-KUANG·Filed 2006·Application pending·0 cites
- 0240US2006071305A1Electrical package structure including chip with polymer thereonHO KAI-KUANG·Filed 2004·Application pending·0 cites
- 0339US2006219862A1Compact camera module with reduced thicknessHO KAI-KUANG·Filed 2005·Application pending·0 cites
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