Inventor · disambiguated record
Alex L. Chan
Also filed as: CHAN ALEX · CHAN ALEX L · CHAN ALEX LIPCHEN
18 granted patents·14 pending applications·130 citations·filing 2004–2024
93Inventor score
Files withALCATEL-LUCENT CANADA INC13NOKIA SOLUTIONS & NETWORKS OY5BROWN PAUL JAMES3CHAN ALEX3ALCATEL LUCENT2
Top patents by PatentIndex Score
32 records- 0192US7460689B1System and method of detecting, recognizing, and tracking moving targetsUS ARMY·Filed 2005·Granted Dec 2, 2008·30 cites·21 claims
- 0290US9830506B2Method of apparatus for cross-modal face matching using polarimetric image dataUS ARMY RES LAB·Filed 2015·Granted Nov 28, 2017·16 cites·21 claims
- 0388US7323787B2Off-grid decoupling of ball grid array (BGA) devices and methodCIT ALCATEL·Filed 2005·Granted Jan 29, 2008·18 cites·3 claims
- 0487US9635760B10204 shifted vias with merge padsALCATEL-LUCENT CANADA INC·Filed 2016·Granted Apr 25, 2017·5 cites·6 claims
- 0587US8806420B2In-grid on-device decoupling for BGACHAN ALEX·Filed 2011·Granted Aug 12, 2014·9 cites·17 claims
- 0687US7602615B2In-grid decoupling for ball grid array (BGA) devicesALCATEL LUCENT·Filed 2007·Granted Oct 13, 2009·15 cites·7 claims
- 0786US8759689B2Land pattern for 0201 components on a 0.8 mm pitch arrayCHAN ALEX·Filed 2011·Granted Jun 24, 2014·8 cites·10 claims
- 0880US9769925B2Relieved component pad for 0201 use between viasALCATEL-LUCENT CANADA INC·Filed 2015·Granted Sep 19, 2017·3 cites·7 claims
- 0978US9832899B1Side clamping BGA socketALCATEL-LUCENT CANADA INC·Filed 2016·Granted Nov 28, 2017·2 cites·20 claims
- 1078US9560742B2Backdrill reliability anchorsALCATEL-LUCENT CANADA INC·Filed 2014·Granted Jan 31, 2017·3 cites·19 claims
- 1177US8912449B2Thermal warp compensation IC packageBROWN PAUL JAMES·Filed 2012·Granted Dec 16, 2014·4 cites·10 claims
- 1275US8559180B2Removable IC package stiffening brace and methodBROWN PAUL J·Filed 2010·Granted Oct 15, 2013·4 cites·18 claims
- 1369US8863071B2De-pop on-device decoupling for BGACHAN ALEX·Filed 2011·Granted Oct 14, 2014·2 cites·14 claims
- 1464US8389864B2Warp reactive IC packageBROWN PAUL JAMES·Filed 2010·Granted Mar 5, 2013·2 cites·8 claims
- 1559US10257952B2Side clamping BGA socketALCATEL LUCENT CANADA INC·Filed 2017·Granted Apr 9, 2019·0 cites·19 claims
- 1658US10743408B2Array type discrete decoupling under BGA gridALCATEL-LUCENT CANADA INC·Filed 2018·Granted Aug 11, 2020·0 cites·11 claims
- 1758US2025254788A1In-line capacitor moduleNOKIA SOLUTIONS & NETWORKS OY·Filed 2024·Application pending·0 cites
- 1856US7738259B2Shared via decoupling for area arrays componentsALCATEL LUCENT·Filed 2004·Granted Jun 15, 2010·9 cites·12 claims
- 1956US2025031318A1Plated via-in-via vertical connectionNOKIA SOLUTIONS & NETWORKS OY·Filed 2023·Application pending·0 cites
- 2056US2024347432A1Configurable warpage control spacersNOKIA SOLUTIONS & NETWORKS OY·Filed 2023·Application pending·0 cites
- 2154US2024292546A1Sacrificial solder layer for broaching clinch nut assemblyNOKIA SOLUTIONS & NETWORKS OY·Filed 2023·Application pending·0 cites
- 2253US2015001716A1De-pop on-device decoupling for bgaALCATEL LUCENT CANADA INC·Filed 2014·Application pending·0 cites
- 2352US10650181B2Spatial location of vias in a printed circuit boardNOKIA SOLUTIONS & NETWORKS OY·Filed 2017·Granted May 12, 2020·0 cites·13 claims
- 2451US2017367180A1Array type discrete decoupling under bga gridALCATEL-LUCENT CANADA INC·Filed 2016·Application pending·0 cites
- 2549US2015092373A1Mounting solution for components on a very fine pitch arrayALCATEL LUCENT CANADA INC·Filed 2013·Application pending·0 cites
- 2648US2023132123A1Solder trenchNOKIA TECHNOLOGIES OY·Filed 2021·Application pending·0 cites
- 2743US2012081872A1Thermal warp compensation ic packageBROWN PAUL JAMES·Filed 2010·Application pending·0 cites
- 2840US2018165401A1Non-orthogonal routing on a printed circuit boardALCATEL LUCENT CANADA INC·Filed 2016·Application pending·0 cites
- 2938US2018082868A1Gravity force compensation plate for upside down ball grid arrayALCATEL LUCENT CANADA INC·Filed 2017·Application pending·0 cites
- 3038US2018020547A1Underlying recessed component placementCHAN ALEX L·Filed 2016·Application pending·0 cites
- 3137US2011235304A1Ic package stiffener with beamALCATEL LUCENT CANADA INC·Filed 2010·Application pending·0 cites
- 3237US2017280569A1Extended pads to ease rework for btc and bga type technologyALCATEL-LUCENT CANADA INC·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →