Inventor · disambiguated record
Serge Vanhaelemeersch
Also filed as: VANHAELEMEERSCH SERGE
21 granted patents·7 pending applications·688 citations·filing 1998–2023
96Inventor score
Files withIMEC INTER UNI MICRO ELECTR13IMEC VZW5IMEC3INTERUNIVERSITIAR MICROELEKTRO1INTERUNIVERSTAIR MICROELEKTRON1
Top patents by PatentIndex Score
28 records- 0196US7566634B2Method for chip singulationIMEC INTER UNI MICRO ELECTR·Filed 2005·Granted Jul 28, 2009·53 cites·30 claims
- 0295US7338896B2Formation of deep via airgaps for three dimensional wafer to wafer interconnectIMEC INTER UNI MICRO ELECTR·Filed 2005·Granted Mar 4, 2008·299 cites·29 claims
- 0392US8540890B2Protective treatment for porous materialsIMEC·Filed 2012·Granted Sep 24, 2013·11 cites·22 claims
- 0488US6607950B2MIS transistors with a metal gate and high-k dielectric and method of formingIMEC INTER UNI MICRO ELECTR·Filed 2001·Granted Aug 19, 2003·59 cites·30 claims
- 0585US6593251B2Method to produce a porous oxygen-silicon layerIMEC INTER UNI MICRO ELECTR·Filed 2001·Granted Jul 15, 2003·29 cites·16 claims
- 0680US6635964B2Metallization structure on a fluorine-containing dielectric and a method for fabrication thereofIMEC INTER UNI MICRO ELECTR·Filed 2001·Granted Oct 21, 2003·25 cites·21 claims
- 0779US6599814B1Method for removal of sicIMEC INTER UNI MICRO ELECTR·Filed 2000·Granted Jul 29, 2003·30 cites·19 claims
- 0874US7807583B2High aspect ratio via etchIMEC·Filed 2007·Granted Oct 5, 2010·7 cites·43 claims
- 0972US6844266B2Anisotropic etching of organic-containing insulating layersIMEC INTER UNI MICRO ELECTR·Filed 2003·Granted Jan 18, 2005·15 cites·8 claims
- 1064US6245489B1Fluorinated hard mask for micropatterning of polymersIMEC VZW·Filed 1998·Granted Jun 12, 2001·26 cites·12 claims
- 1163US7557027B2Method of producing microcystalline silicon germanium suitable for micromachiningIMEC INTER UNI MICRO ELECTR·Filed 2006·Granted Jul 7, 2009·3 cites·20 claims
- 1263US6352936B1Method for stripping ion implanted photoresist layerIMEC VZW·Filed 1999·Granted Mar 5, 2002·33 cites·19 claims
- 1363US6323555B1Metallization structure on a fluorine-containing dielectric and a method for fabrication thereofINTERUNIVERSITIAR MICROELEKTRO·Filed 1999·Granted Nov 27, 2001·27 cites·11 claims
- 1462US7042091B2Fluorinated hard mask for micropatterning of polymersIMEC VZW·Filed 2001·Granted May 9, 2006·7 cites·5 claims
- 1562US6821884B2Method of fabricating a semiconductor deviceIMEC INTER UNI MICRO ELECTR·Filed 2002·Granted Nov 23, 2004·6 cites·15 claims
- 1661US6900140B2Anisotropic etching of organic-containing insulating layersIMEC INTER UNI MICRO ELECTR·Filed 2004·Granted May 31, 2005·6 cites·8 claims
- 1760US6380039B2Method for forming a FET having L-shaped insulating spacersIMEC INTER UNI MICRO ELECTR·Filed 1999·Granted Apr 30, 2002·23 cites·28 claims
- 1857US7611986B2Dual damascene patterning methodIMEC·Filed 2006·Granted Nov 3, 2009·3 cites·25 claims
- 1956US2024112944A1Process for Wafer BondingIMEC VZW·Filed 2023·Application pending·0 cites
- 2053US6806501B2Integrated circuit having SiC layerINTERUNIVERSTAIR MICROELEKTRON·Filed 2003·Granted Oct 19, 2004·8 cites·19 claims
- 2146US6844267B1Anisotropic etching of organic-containing insulating layersIMEC INTER UNI MICRO ELECTR·Filed 1998·Granted Jan 18, 2005·10 cites·7 claims
- 2244US2005048782A1Method of fabricating a semiconductor deviceFiled 2004·Application pending·0 cites
- 2344US2005056941A1Method of fabricating a semiconductor deviceFiled 2004·Application pending·0 cites
- 2440US2003181066A1Method to produce a porous oxygen-silicon layerFiled 2003·Application pending·0 cites
- 2536US6096657AMethod for forming a spacerIMEC VZW·Filed 1999·Granted Aug 1, 2000·8 cites·10 claims
- 2635US2004071878A1Surface preparation using plasma for ALD FilmsIMEC INTER UNI MICRO ELECTR·Filed 2003·Application pending·0 cites
- 2735US2002076935A1Anisotropic etching of organic-containing insulating layersFiled 2001·Application pending·0 cites
- 2834US2005099078A1Method for removal of SiCFiled 2004·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →