Inventor · disambiguated record
Joseph Stevens
Also filed as: LLOYD LEGAL REPRESENTATIVE ANN · STEVENS III JOSEPH J · STEVENS JOSEPH · STEVENS JOSEPH J
25 granted patents·8 pending applications·1,255 citations·filing 1995–2023
97Inventor score
Files withAPPLIED MATERIALS INC25ETAIN IP LLC2NEXTCHEM LLC2PRATT WILLIAM E1RIV CAPITAL US SERVICES LLC1
Top patents by PatentIndex Score
33 records- 0198US6258220B1Electro-chemical deposition systemAPPLIED MATERIALS INC·Filed 1999·Granted Jul 10, 2001·443 cites·26 claims
- 0294US6582578B1Method and associated apparatus for tilting a substrate upon entry for metal depositionAPPLIED MATERIALS INC·Filed 2000·Granted Jun 24, 2003·80 cites·28 claims
- 0393US6824612B2Electroless plating systemAPPLIED MATERIALS INC·Filed 2001·Granted Nov 30, 2004·67 cites·24 claims
- 0493US6517130B1Self positioning vacuum chuckAPPLIED MATERIALS INC·Filed 2000·Granted Feb 11, 2003·84 cites·10 claims
- 0591US6635157B2Electro-chemical deposition systemAPPLIED MATERIALS INC·Filed 2001·Granted Oct 21, 2003·43 cites·68 claims
- 0691US6613214B2Electric contact element for electrochemical deposition system and methodAPPLIED MATERIALS INC·Filed 2000·Granted Sep 2, 2003·56 cites·38 claims
- 0791US6454927B1Apparatus and method for electro chemical depositionAPPLIED MATERIALS INC·Filed 2000·Granted Sep 24, 2002·28 cites·46 claims
- 0891US5632873ATwo piece anti-stick clamp ringFiled 1995·Granted May 27, 1997·128 cites·43 claims
- 0989US6494219B1Apparatus with etchant mixing assembly for removal of unwanted electroplating depositsAPPLIED MATERIALS INC·Filed 2000·Granted Dec 17, 2002·47 cites·19 claims
- 1088US7138014B2Electroless deposition apparatusAPPLIED MATERIALS INC·Filed 2002·Granted Nov 21, 2006·37 cites·38 claims
- 1188US6585876B2Flow diffuser to be used in electro-chemical plating system and methodAPPLIED MATERIALS INC·Filed 2000·Granted Jul 1, 2003·35 cites·38 claims
- 1287US7497932B2Electro-chemical deposition systemAPPLIED MATERIALS INC·Filed 2006·Granted Mar 3, 2009·9 cites·4 claims
- 1384US6742279B2Apparatus and method for rinsing substratesAPPLIED MATERIALS INC·Filed 2002·Granted Jun 1, 2004·31 cites·41 claims
- 1483US7846318B2Polyaluminum chloride and aluminum chlorohydrate, processes and compositions: high-basicity and ultra high-basicity productsNEXTCHEM LLC·Filed 2007·Granted Dec 7, 2010·9 cites·60 claims
- 1581US7427338B2Flow diffuser to be used in electro-chemical plating systemAPPLIED MATERIALS INC·Filed 2003·Granted Sep 23, 2008·21 cites·2 claims
- 1678US6612014B1Dual post centrifugal wafer clip for spin rinse dry unitAPPLIED MATERIALS INC·Filed 2000·Granted Sep 2, 2003·22 cites·12 claims
- 1775US6720263B2Planarization of metal layers on a semiconductor wafer through non-contact de-plating and control with endpoint detectionAPPLIED MATERIALS INC·Filed 2001·Granted Apr 13, 2004·17 cites·17 claims
- 1874US6159055ARF electrode contact assembly for a detachable electrostatic chuckAPPLIED MATERIALS INC·Filed 1998·Granted Dec 12, 2000·45 cites·7 claims
- 1971US6432282B1Method and apparatus for supplying electricity uniformly to a workpieceAPPLIED MATERIALS INC·Filed 2000·Granted Aug 13, 2002·14 cites·11 claims
- 2069US6444101B1Conductive biasing member for metal layeringAPPLIED MATERIALS INC·Filed 1999·Granted Sep 3, 2002·35 cites·47 claims
- 2165US8801909B2Polymetal hydroxychloride processes and compositions: enhanced efficacy antiperspirant salt compositionsPRATT WILLIAM E·Filed 2007·Granted Aug 12, 2014·2 cites·83 claims
- 2265US2024041822A1Water soluble cannabis compositionRIV CAPITAL US SERVICES LLC·Filed 2023·Application pending·0 cites
- 2361US10780075B1Water soluble cannabis compositionETAIN IP LLC·Filed 2019·Granted Sep 22, 2020·0 cites·26 claims
- 2460US7005046B2Apparatus for electro chemical depositionAPPLIED MATERIALS INC·Filed 2002·Granted Feb 28, 2006·2 cites·12 claims
- 2558US11746021B2High purity aluminum oxide via electrodialysisNEXTCHEM LLC·Filed 2020·Granted Sep 5, 2023·0 cites·20 claims
- 2657US11813243B2Water soluble cannabis compositionETAIN IP LLC·Filed 2020·Granted Nov 14, 2023·0 cites·1 claims
- 2747US2005199489A1Electroless deposition apparatusAPPLIED MATERIALS INC·Filed 2005·Application pending·0 cites
- 2843US2004084301A1Electro-chemical deposition systemAPPLIED MATERIALS INC·Filed 2003·Application pending·0 cites
- 2939US2003038107A1Method and apparatus for removal of unwanted electroplating depositsAPPLIED MATERIALS INC·Filed 2002·Application pending·0 cites
- 3038US2006062897A1Patterned wafer thickness detection systemAPPLIED MATERIALS INC·Filed 2005·Application pending·0 cites
- 3138US2003201184A1Method and associated apparatus for tilting a substrate upon entry for metal depositionAPPLIED MATERIALS INC·Filed 2003·Application pending·0 cites
- 3237US2002066664A1Method and apparatus for supplying electricity uniformly to a workpieceAPPLIED MATERIALS INC·Filed 2001·Application pending·0 cites
- 3335US2003213772A9Integrated semiconductor substrate bevel cleaning apparatus and methodFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →