Method and associated apparatus for tilting a substrate upon entry for metal deposition

Abstract

An electro-chemical plating system is described. A method is performed by the electro-chemical plating system in which a seed layer formed on a substrate is immersed into an electrolyte solution. In one aspect, a substrate is immersed in the electrochemical plating system by tilting the substrate as it enters the electrolyte solution to limit the trapping or formation of air bubbles in the electrolyte solution between the substrate and the substrate holder. In another aspect, an apparatus is provided for electroplating that comprises a cell, a substrate holder, and an actuator. The actuator can displace the substrate holder assembly in the x and z directions and also tilt the substrate. In another aspect, a method is provided of driving a meniscus formed by electrolyte solution across a surface of a substrate. The method comprises enhancing the interaction between the electrolyte solution meniscus and the surface as the substrate is immersed into the electrolyte solution.

What is claimed is:  
     
         1 . A method for immersing a substrate into a plating solution, comprising: 
 positioning the substrate to a first angle relative to horizontal;    immersing the substrate into the plating solution while substantially maintaining the substrate at the first angle; and    tilting the substrate to a second angle relative to horizontal.    
     
     
         2 . The method of  claim 1 , wherein tilting the substrate to the second angle comprises tilting the substrate to the second angle as the substrate is being immersed into the plating solution.  
     
     
         3 . The method of  claim 1 , wherein tilting the substrate to the second angle comprises tilting the substrate to the second angle after the substrate is immersed into the plating solution.  
     
     
         4 . The method of  claim 1 , further comprising tilting the substrate to a processing position.  
     
     
         5 . The method of  claim 4 , wherein the processing position is generally horizontal.  
     
     
         6 . The method of  claim 4 , wherein the substrate is tilted to a processing position after the substrate is tilted to the second angle.  
     
     
         7 . The method of  claim 1 , wherein tilting the substrate to the second angle comprises moving the substrate in an x direction as the substrate is being immersed into the plating solution.  
     
     
         8 . The method of  claim 1 , wherein tilting the substrate to the second angle comprises: 
 tilting the substrate to the second angle as the substrate is being immersed into the plating solution; and    moving the substrate in an x direction as the substrate is being immersed into the plating solution.    
     
     
         9 . The method of  claim 1 , further comprising spinning the substrate as the substrate is being immersed into the plating solution.  
     
     
         10 . The method of  claim 1 , wherein the first angle is greater than the second angle.  
     
     
         11 . The method of  claim 1 , wherein the rate at which the first angle changes toward horizontal is greater than the rate at which the second angle changes toward horizontal.  
     
     
         12 . The method of  claim 1 , wherein the second angle is closer to horizontal than the first angle.  
     
     
         13 . The method of  claim 1 , wherein the first angle is greater than about 0 degrees and less than about 90 degrees from horizontal.  
     
     
         14 . The method of  claim 1 , wherein the first angle is greater than about 0 degrees and less than about 45 degrees from horizontal.  
     
     
         15 . The method of  claim 1 , wherein the first angle is greater than about 45 degrees and less than about 90 degrees from horizontal.  
     
     
         16 . The method of  claim 1 , wherein the first angle is about 45 degrees from horizontal.  
     
     
         17 . The method of  claim 1 , wherein tilting the substrate to the second angle dislodges bubbles adhering to the substrate.  
     
     
         18 . A method for immersing a substrate into a plating solution, comprising: 
 positioning the substrate to a first angle relative to horizontal;    immersing the substrate into the plating solution while substantially maintaining the substrate at the first angle;    tilting the substrate to a second angle relative to horizontal as the substrate is being immersed into the plating solution; and    tilting the substrate to a generally horizontal position for processing.    
     
     
         19 . The method of  claim 18 , further comprising spinning the substrate as the substrate is being immersed into the plating solution.  
     
     
         20 . The method of  claim 18 , wherein tilting the substrate to the second angle comprises moving the substrate in an x direction as the substrate is being immersed into the plating solution.  
     
     
         21 . A method for immersing a substrate into a plating solution, comprising: 
 positioning the substrate to a first angle relative to horizontal;    immersing the substrate into the plating solution while substantially maintaining the substrate at the first angle;    tilting the substrate to a second angle relative to horizontal after the substrate is immersed into the plating solution; and    tilting the substrate to a generally horizontal position for processing.    
     
     
         22 . The method of  claim 21 , further comprising spinning the substrate as the substrate is being immersed into the plating solution.  
     
     
         23 . The method of  claim 21 , wherein tilting the substrate to the second angle comprises moving the substrate in an x direction.