Inventor · disambiguated record
Seok-Hwan Moon
Also filed as: MOON SEOK H · MOON SEOK-HWAN
18 granted patents·29 pending applications·88 citations·filing 2002–2025
91Inventor score
Files withELECTRONICS & TELECOMMUNICATIONS RES INST17KOREA ELECTRONICS TELECOMM17MOON SEOK HWAN7MOON SEOK H2CHOI CHANG AUCK1
Top patents by PatentIndex Score
47 records- 0188US10636761B2Method of fabricating a semiconductor packageELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2018·Granted Apr 28, 2020·6 cites·11 claims
- 0286US9179577B2Flat heat pipe and fabrication method thereofMOON SEOK HWAN·Filed 2012·Granted Nov 3, 2015·10 cites·9 claims
- 0386US6619384B2Heat pipe having woven-wire wick and straight-wire wickKOREA ELECTRONICS TELECOMM·Filed 2002·Granted Sep 16, 2003·43 cites·4 claims
- 0480US9337121B2Semiconductor device and method of fabricating the sameKOREA ELECTRONICS TELECOMM·Filed 2014·Granted May 10, 2016·4 cites·14 claims
- 0577US10020201B2Semiconductor device and method of fabricating the sameELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2016·Granted Jul 10, 2018·2 cites·7 claims
- 0677US8261617B2Micro piezoresistive pressure sensor and manufacturing method thereofCHOI CHANG AUCK·Filed 2008·Granted Sep 11, 2012·8 cites·22 claims
- 0774US8490683B2Flat plate type micro heat transport deviceMOON SEOK HWAN·Filed 2008·Granted Jul 23, 2013·7 cites·10 claims
- 0873US7971633B2Loop type micro heat transport deviceKOREA ELECTRONICS TELECOMM·Filed 2005·Granted Jul 5, 2011·6 cites·6 claims
- 0973US2025154325A1Vanillic acid-based organic-inorganic compound, curable composition, and production method thereofELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2024·Application pending·0 cites
- 1071US2023391956A1Silyl ether isohexide-based organic-inorganic compound, method for preparing the same, and curable composition containing the sameELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2023·Application pending·0 cites
- 1163US2022402070A1Laser control structure and laser bonding method using the sameELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2022·Application pending·0 cites
- 1262US2010108296A1Thin cooling deviceKOREA ELECTRONICS TELECOMM·Filed 2009·Application pending·0 cites
- 1361US12457833B2Electronic device and its repair methodELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2022·Granted Oct 28, 2025·0 cites·20 claims
- 1461US2021358885A1Laser bonding method and a semiconductor package including a bonding part and a bonding targetELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2021·Application pending·0 cites
- 1560US12349505B2Method of manufacturing electric deviceELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2022·Granted Jul 1, 2025·0 cites·20 claims
- 1660US9159583B2Methods of manufacturing nitride semiconductor devicesKOREA ELECTRONICS TELECOMM·Filed 2014·Granted Oct 13, 2015·1 cites·13 claims
- 1760US2025062276A1Method for dipping adhesive materialELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2024·Application pending·0 cites
- 1859US2011079372A1Heat transfer device with functions of power generationKOREA ELECTRONICS TELECOMM·Filed 2008·Application pending·0 cites
- 1959US2014352758A1Solar cell moduleKOREA ELECTRONICS TELECOMM·Filed 2014·Application pending·0 cites
- 2058US9085140B2Active cliche for large-area printing, manufacturing method of the same, and printing method using the sameKOREA ELECTRONICS TELECOMM·Filed 2013·Granted Jul 21, 2015·0 cites·14 claims
- 2158US8584743B2Solid type heat dissipation deviceMOON SEOK-HWAN·Filed 2010·Granted Nov 19, 2013·1 cites·12 claims
- 2258US2021252620A1Transfer and bonding method using laserELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2021·Application pending·0 cites
- 2357US11107790B2Laser bonding methodELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2019·Granted Aug 31, 2021·0 cites·15 claims
- 2457US9296205B2Active cliche for large-area printing, manufacturing method of the same, and printing method using the sameKOREA ELECTRONICS TELECOMM·Filed 2015·Granted Mar 29, 2016·0 cites·5 claims
- 2557US2015280041A1Concentrated photovoltaic moduleKOREA ELECTRONICS TECHNOLOGY·Filed 2013·Application pending·0 cites
- 2657US2006157228A1Micro heat pipe with poligonal cross-section manufactured via extrusion or drawingMOON SEOK H·Filed 2006·Application pending·0 cites
- 2756US12206056B2Semiconductor package with intermetallic-compound solder-joint comprising solder, UBM, and reducing layer materialsELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2021·Granted Jan 21, 2025·0 cites·20 claims
- 2855US2023326810A1Microwave heating device and method for manufacturing semiconductor packaging using the sameELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2023·Application pending·0 cites
- 2954US2013098428A1Sunlight complex modules and apparatuses for using solar energyYUN HO-GYEONG·Filed 2012·Application pending·0 cites
- 3052US11488841B2Method for manufacturing semiconductor packageELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2020·Granted Nov 1, 2022·0 cites·15 claims
- 3152US9024511B2Impact-type piezoelectric micro power generatorKOREA ELECTRONICS TELECOMM·Filed 2013·Granted May 5, 2015·0 cites·16 claims
- 3251US2008185128A1Flat Plate-Type Heat PipeMOON SEOK HWAN·Filed 2006·Application pending·0 cites
- 3350US2009188110A1Micro heat pipe with poligonal cross-section manufactured via extrusion or drawingMOON SEOK HWAN·Filed 2009·Application pending·0 cites
- 3450US2025282908A1Flux agent and semiconductor package including cured product thereofELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2025·Application pending·0 cites
- 3548US2007130769A1Micro heat pipe with pligonal cross-section manufactured via extrusion or drawingMOON SEOK H·Filed 2007·Application pending·0 cites
- 3647US2014198195A1Terahertz health checkerKOREA ELECTRONICS TELECOMM·Filed 2014·Application pending·0 cites
- 3747US2014060780A1Flat heat pipe and fabrication method thereofKOREA ELECTRONICS TELECOMM·Filed 2013·Application pending·0 cites
- 3845US2010258278A1Flat plate type micro heat spreading deviceKOREA ELECTRONICS TELECOMM·Filed 2008·Application pending·0 cites
- 3945US2004112572A1Micro heat pipe with poligonal cross-section manufactured via extrusion or drawingFiled 2002·Application pending·0 cites
- 4045US2012145358A1Thinned flat plate heat pipe fabricated by extrusionMOON SEOK HWAN·Filed 2011·Application pending·0 cites
- 4145US2014062838A1Mobile e-binder systemKOREA ELECTRONICS TELECOMM·Filed 2013·Application pending·0 cites
- 4244US2010059212A1Heat control device and method of manufacturing the sameKOREA ELECTRONICS TELECOMM·Filed 2007·Application pending·0 cites
- 4344US2015348802A1Thinned flat plate heat pipe fabricated by extrusionKOREA ELECTRONICS TELECOMM·Filed 2015·Application pending·0 cites
- 4443US2010012300A1Heat uniforming device for electronic apparatusKOREA ELECTRONICS TELECOMM·Filed 2007·Application pending·0 cites
- 4541US2012145357A1Thin plate heat pipeMOON SEOK HWAN·Filed 2011·Application pending·0 cites
- 4641US2019287870A1Filling composition for semiconductor packageELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2019·Application pending·0 cites
- 4741US2019211231A1Adhesive film for electric device and method of fabricating semiconductor package using the sameELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →