US2010059212A1PendingUtilityA1

Heat control device and method of manufacturing the same

Assignee: KOREA ELECTRONICS TELECOMMPriority: Dec 7, 2006Filed: Oct 31, 2007Published: Mar 11, 2010
Est. expiryDec 7, 2026(~0.4 yrs left)· nominal 20-yr term from priority
H10W 40/73B23P 2700/09F28D 15/0233F28D 15/046F28D 15/06Y10T29/4935F28D 15/02F28D 15/04
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Claims

Abstract

Provided are a heat control device and a method of manufacturing a heat control device. The method of manufacturing a heat control device having an envelope used as a path of a working fluid that absorbs/dissipates heat by a latent heat transfer and a groove formed in an inner wall of the envelope and generating a capillary force moving the working fluid, wherein the method includes: providing first and second templates each including a protruding portion having a shape corresponding to the groove; forming first and second deposition films by depositing metal on the first and second templates; stacking first and second metal plates respectively on the first and second deposition films; burning out the first and second templates from the first and second metal plates; and forming the envelope by combining the first and second metal plates.

Claims

exact text as granted — not AI-modified
1 . A method of manufacturing a heat control device having an envelope used as a path of a working fluid that absorbs/dissipates heat by a latent heat transfer and a groove formed in an inner wall of the envelope and generating a capillary force moving the working fluid, the method comprising:
 providing first and second templates each including a protruding portion having a shape corresponding to the groove;   forming first and second deposition films by depositing metal on the first and second templates;   stacking first and second metal plates respectively on the first and second deposition films;   burning out the first and second templates from the first and second metal plates; and   forming the envelope by combining the first and second metal plates.   
   
   
       2 . The method of  claim 1 , wherein, in the providing of the first and second templates each including a protruding portion having a shape corresponding to the groove, each of the first and second templates is provided using a mold having a concave portion corresponding to the protruding portion. 
   
   
       3 . The method of  claim 2 , wherein the first and second templates are formed of a polymer. 
   
   
       4 . The method of  claim 3 , wherein the polymer includes at least polymethly methacrylate (PMMA). 
   
   
       5 . The method of  claim 2 , wherein, in the stacking of the first and second metal plates respectively on the first and second deposition films, the first and second metal plates are respectively stacked by plating a metal forming the envelope on the first and second deposition films. 
   
   
       6 . A method of manufacturing a heat control device having an envelope used as a path of a working fluid that absorbs/dissipates heat by a latent heat transfer and a groove formed in an inner wall of the envelope and generating a capillary force moving the working fluid, the method comprising:
 providing an integrated single template including a protruding portion having a shape corresponding to the groove;   forming a deposition film by depositing metal on the integrated single template;   stacking an integrated single metal plate surrounding the deposition film; and   burning out the integrated single template from the integrated single metal plate.   
   
   
       7 . The method of  claim 6 , wherein, in the providing of the integrated single template including a protruding portion having a shape corresponding to the groove, each of the first and second templates is provided using a mold having a concave portion corresponding to the protruding portion. 
   
   
       8 . The method of  claim 7 , wherein the integrated single template is formed of a polymer. 
   
   
       9 . The method of  claim 8 , wherein the polymer includes at least polymethly methacrylate (PMMA). 
   
   
       10 . The method of  claim 7 , wherein, in the stacking of the integrated single metal plate surrounding the deposition film, the integrated single metal plate is stacked by plating a metal forming the envelope on the deposition film. 
   
   
       11 . A method of manufacturing a heat control device having an envelope used as a path of a working fluid that absorbs/dissipates heat by a latent heat transfer and a groove formed in an inner wall of the envelope and generating a capillary force moving the working fluid, the method comprising:
 providing a pair of reinforcement templates, each having a reinforcement film at one side and a groove formed at the other side;   pairing the reinforcement templates to contact each other; and   forming the envelope by stacking an integrated single metal plate on a pair of the reinforcement templates.   
   
   
       12 . The method of  claim 11 , wherein, in the providing a pair of reinforcement templates, each of the reinforcement templates is provided using a mold having a protruding portion having a shape corresponding to the groove. 
   
   
       13 . The method of  claim 12 , wherein the reinforcement template is formed by stacking a polymer on the reinforcement films. 
   
   
       14 . The method of  claim 13 , wherein the polymer includes at least polymethly methacrylate (PMMA). 
   
   
       15 . The method of  claim 12 , wherein, in the forming of the envelope by stacking an integrated single metal plate on a pair of the reinforcement templates, the integrated single metal plate is stacked by plating a metal forming the envelope on the reinforcement film. 
   
   
       16 . A heat control device comprising:
 an envelope used as a path of a working fluid that absorbs/dissipates heat by a latent heat transfer; and   a groove formed in an inner wall of the envelope and generating a capillary force moving the working fluid,   wherein the groove or a protruding portion having a shape corresponding to the groove is formed on a template formed of a polymer, a metal deposition film is deposited on the template, metal forming the envelope is stacked on the deposition film and the template is burned out, thus forming the envelope.

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