Thin cooling device

Abstract

Provided is a vapor-liquid phase change cooling device, which may be manufactured with no limitation of thickness. The cooling device includes a first thin plate including a groove-shaped capillary region, an evaporator section for evaporating a working fluid injected from outside, and a condenser section having a vapor condensation space for condensing the evaporated working fluid, a second thin plate having a vapor pathway for transporting the evaporated working fluid to the condenser section, and a third thin plate having a liquid pathway for transporting the working fluid condensed in the condenser section to the evaporator section.

1 . A thin cooling device, comprising:
 a first thin plate including a groove-shaped capillary region, an evaporator section for evaporating a working fluid injected from outside, and a condenser section having a vapor condensation space for condensing the evaporated working fluid;   a second thin plate having a vapor pathway for transporting the evaporated working fluid to the condenser section; and   a third thin plate having a liquid pathway for transporting the working fluid condensed in the condenser section to the evaporator section.   
   
   
       2 . The thin cooling device according to  claim 1 , wherein the first thin plate has a through hole for injecting the working fluid. 
   
   
       3 . The thin cooling device according to  claim 1 , wherein the second thin plate has a plurality of bridges formed lengthwise at regular intervals in the second thin plate to form the vapor pathway, and a through hole for injecting the working fluid. 
   
   
       4 . The thin cooling device according to  claim 1 , wherein the third thin plate has a hole for aligning the first and second thin plates when the first and second thin plates are combined. 
   
   
       5 . The thin cooling device according to  claim 1 , wherein the capillary region in the evaporator section has a multi-channel groove structure to generate capillary force. 
   
   
       6 . The thin cooling device according to  claim 5 , wherein the multi-channel groove structure is formed through the first to third thin plates when the first to third thin plates are combined. 
   
   
       7 . The thin cooling device according to  claim 1 , wherein the thin cooling device is formed by combining the second thin plate below the first thin plate, and combining the third thin plate above the first thin plate. 
   
   
       8 . The thin cooling device according to  claim 1 , wherein the thin cooling device is formed by sequentially combining the first and third thin plates above and below the second thin plate. 
   
   
       9 . The thin cooling device according to  claim 1 , wherein the thin cooling device is formed to circulate the working fluid through the evaporator section, the vapor pathway and the liquid pathway. 
   
   
       10 . The thin cooling device according to  claim 1 , wherein the thin cooling device is hermetically sealed in a vacuum state, and filled with a predetermined amount of the working fluid. 
   
   
       11 . A thin cooling device, comprising two thin plates each having a groove-shaped capillary region, an evaporator section for evaporating a working fluid injected from outside, and a liquid pathway for transporting condensed working fluid to the evaporator section,
 wherein the two thin plates are combined to face each other.   
   
   
       12 . The thin cooling device according to  claim 11 , wherein the thin plate further has a plurality of bridges formed lengthwise at regular intervals in the thin plate. 
   
   
       13 . The thin cooling device according to  claim 11 , wherein a step is formed between the evaporator section, the liquid pathway and the bridges, and a space formed by the step is utilized as a vapor pathway for transporting the evaporated working fluid to a vapor condensation space and the vapor condensation space for condensing the evaporated working fluid. 
   
   
       14 . The thin cooling device according to  claim 11 , wherein the two thin plates are combined by stamping. 
   
   
       15 . The thin cooling device according to  claim 11 , wherein the thin cooling device is hermetically sealed in a vacuum state and filled with a predetermined amount of the working fluid.