Flat plate type micro heat spreading device

Abstract

A flat plate type heat spreading device is provided. The flat plat type heat spreading device can reduce heat by generating phase transition of liquid by using heat of a heat source so as to solve various problems caused by heat generated in components of electronic devices such as personal computers or mobile phones. Specifically, the flat plate type heat spreading device includes a lower plate for evaporating liquid, a middle plate combined with an upper surface of the lower plate, which separately includes a path through which evaporated vapor passes and a path through which condensed fluid flows into the lower plate, and an upper plate combined with an upper surface of the middle plate, which condenses the evaporated vapor.

1 . A flat plate type heat spreading device comprising:
 a lower plate evaporating liquid;   a middle plate combined with an upper surface of the lower plate, which separately includes a path through which evaporated vapor passes and a path through which condensed fluid flows into the lower plate; and   an upper plate combined with an upper surface of the middle plate, which condenses the evaporated vapor.   
     
     
         2 . The flat plate type heat spreading device of  claim 1 , wherein the lower plate has a multi-channel capillary structure constructed with grooves. 
     
     
         3 . The flat plate type heat spreading device of  claim 2 , wherein the multi-channel capillary structure has at least one step difference. 
     
     
         4 . The flat plate type heat spreading device of  claim 3 , wherein in the lower plate, a bridge for preventing compression due to vacuum is formed at a center part of the lower plate. 
     
     
         5 . The flat plate type heat spreading device of  claim 1 , wherein the upper plate has a multi-channel capillary structure constructed with grooves. 
     
     
         6 . The flat plate type heat spreading device of  claim 5 , wherein in the upper plate, liquid collection grooves in which liquid condensed by the multi-channel capillary structure constructed with the grooves is collected are formed. 
     
     
         7 . The flat plate type heat spreading device of  claim 6 , wherein in the middle plate, paths through which the fluid flows are formed at positions corresponding to the liquid collection grooves. 
     
     
         8 . The flat plate type heat spreading device of  claim 7 ,
 wherein in the lower plate, the bridge for preventing compression is formed, and wherein the middle and upper plates respectively include a bridge at a position corresponding to the bridge.   
     
     
         9 . The flat plate type heat spreading device of  claim 1 , which is closed and evacuated. 
     
     
         10 . The flat plate type heat spreading device of  claim 1 , wherein the upper surface of the lower plate is constructed with at least one of a sintered wick, a fiber wick, a screen mesh wick, a fine fiber wick, and a woven wire wick. 
     
     
         11 . A flat plate type heat spreading device comprising:
 a lower plate having a step difference between a center part and edges thereof, in which a multi-channel capillary structure constructed with unidirectional grooves is formed so as to evaporate liquid by using heat of a heat source located under the lower plate;   a middle plate combined with an upper surface of the lower plate, in which a path through which evaporated vapor passes is formed at a position corresponding to the center part of the upper surface of the lower plate, and a liquid flow path through which condensed liquid flows into the lower plate is formed; and   an upper plate combined with an upper surface of the middle plate, in which a multi-channel capillary structure constructed with unidirectional grooves is formed on a lower surface, and liquid collection grooves through which condensed vapor is collected are formed in a direction perpendicular to the unidirectional grooves at a position corresponding to the liquid flow path.   
     
     
         12 . The flat plate type heat spreading device of  claim 11 ,
 wherein in the lower plate, a bridge for preventing compression is formed at a center part of the lower plate, and   wherein the middle and upper plates respectively include a bridge at a position corresponding to the bridge.   
     
     
         13 . The flat plate type heat spreading device of  claim 12 , wherein grooves of the lower and upper plates are further formed in a direction perpendicular to the unidirectional grooves. 
     
     
         14 . The flat plate type heat spreading device of  claim 13 ,
 wherein the upper plate further includes liquid collection grooves perpendicular to the further formed grooves, and   wherein the middle plate further includes liquid flow paths at a position corresponding to the liquid collection grooves.   
     
     
         15 . The flat plate type heat spreading device of  claim 11 , wherein an interval of the grooves of the lower plate is smaller than that of the grooves of the upper plate. 
     
     
         16 . The flat plate type heat spreading device of  claim 11 , wherein the grooves of the lower plate are formed to the positions corresponding to the liquid flow paths. 
     
     
         17 . The flat plate type heat spreading device of  claim 11 ,
 wherein a center part of the upper surface of the lower plate is formed by using a pushing method, and   wherein grooves of a multi-channel capillary structure are fabricated by using a laser.   
     
     
         18 . A flat plate type heat spreading device comprising:
 a lower plate having a step difference between a center part and edges thereof, in which a multi-channel capillary structure constructed with unidirectional grooves is formed so as to evaporate liquid by using heat of a heat source of a lower surface of the lower plate; and   an upper plate combined with an upper surface of the low plate, in which a multi-channel capillary structure constructed with unidirectional grooves is formed on a lower surface, and liquid collection grooves through which condensed vapor is collected are formed in a direction perpendicular to the unidirectional grooves at a position corresponding to edges of the lower plate.   
     
     
         19 . The flat plate type heat spreading device of  claim 18 ,
 wherein in the lower plate, a bridge for preventing compression is formed at a center part of the lower plate, and   wherein in the upper plate, a bridge is formed at a position corresponding to the bridge of the lower plate.   
     
     
         20 . A flat plate type heat spreading device comprising:
 a lower plate evaporating liquid by using heat of a heat source of a lower surface, in which a multi-channel capillary structure constructed with unidirectional grooves is formed in edges of an upper surface;   a middle plate combined with the upper surface of the lower plate, in which a path through which vapor evaporated in the lower plate passes is formed, a liquid flow path through which condensed liquid flows into the lower plate is formed at a center part in a direction perpendicular to the unidirectional grooves; and   an upper plate combined with the middle plate, in which a multi-channel capillary structure constructed with unidirectional grooves is formed on a lower surface, liquid collection grooves through which condensed vapor is collected are formed in a direction perpendicular to the unidirectional grooves at a position corresponding to the liquid flow path.