Inventor · disambiguated record
Yoshitaka Aiba
Also filed as: AIBA YOSHITAKA
20 granted patents·3 pending applications·957 citations·filing 1999–2014
96Inventor score
Top patents by PatentIndex Score
23 records- 0198US6476503B1Semiconductor device having columnar electrode and method of manufacturing sameFUJITSU LTD·Filed 2000·Granted Nov 5, 2002·266 cites·11 claims
- 0296US7456089B2Semiconductor device and method of manufacturing the semiconductor deviceFUJITSU LTD·Filed 2006·Granted Nov 25, 2008·53 cites·4 claims
- 0395US7084513B2Semiconductor device having a plurality of semiconductor chips and method for manufacturing the sameFUJITSU LTD·Filed 2004·Granted Aug 1, 2006·91 cites·14 claims
- 0495US6548898B2External connection terminal and semiconductor deviceFUJITSU LTD·Filed 2001·Granted Apr 15, 2003·98 cites·28 claims
- 0594US6348728B1Semiconductor device having a plurality of semiconductor elements interconnected by a redistribution layerFUJITSU LTD·Filed 2000·Granted Feb 19, 2002·91 cites·9 claims
- 0693US7122897B2Semiconductor device and method of manufacturing the semiconductor deviceFUJITSU LTD·Filed 2004·Granted Oct 17, 2006·72 cites·10 claims
- 0790US9076789B2Semiconductor device having a high frequency external connection electrode positioned within a via holeFUJITSU SEMICONDUCTOR LTD·Filed 2014·Granted Jul 7, 2015·8 cites·7 claims
- 0890US6836025B2Semiconductor device configured to be surface mountableFUJITSU LTD·Filed 2003·Granted Dec 28, 2004·61 cites·16 claims
- 0986US6909181B2Light signal processing systemFUJITSU LTD·Filed 2002·Granted Jun 21, 2005·34 cites·15 claims
- 1086US6333564B1Surface mount type semiconductor device and method of producing the same having an interposing layer electrically connecting the semiconductor chip with protrusion electrodesFUJITSU LTD·Filed 1999·Granted Dec 25, 2001·87 cites·14 claims
- 1183US6784543B2External connection terminal and semiconductor deviceFUJITSU LTD·Filed 2003·Granted Aug 31, 2004·30 cites·35 claims
- 1282US7759246B2Semiconductor device having a plurality of semiconductor chips and method for manufacturing the sameFUJITSU SEMICONDUCTOR LTD·Filed 2006·Granted Jul 20, 2010·9 cites·8 claims
- 1382US6586273B2Semiconductor device manufacturing method having a step of applying a copper foil on a substrate as a part of a wiring connecting an electrode pad to a mounting terminalFUJITSU LTD·Filed 2001·Granted Jul 1, 2003·28 cites·8 claims
- 1479US8344490B2Semiconductor device having a high frequency electrode positioned with a via holeFUJITSU SEMICONDUCTOR LTD·Filed 2008·Granted Jan 1, 2013·8 cites·1 claims
- 1563US7365434B2Semiconductor device and manufacturing method for the sameFUJITSU LTD·Filed 2006·Granted Apr 29, 2008·2 cites·18 claims
- 1661US6967399B2Semiconductor device manufacturing method having a step of applying a copper foil on a substrate as a part of a wiring connecting an electrode pad to a mounting terminalFUJITSU LTD·Filed 2003·Granted Nov 22, 2005·8 cites·4 claims
- 1757US7251801B2Method of designing circuit boardFUJITSU LTD·Filed 2004·Granted Jul 31, 2007·6 cites·7 claims
- 1855US6627479B2Semiconductor device having a plurality of semiconductor elements interconnected by a redistribution layerFUJITSU LTD·Filed 2001·Granted Sep 30, 2003·5 cites·3 claims
- 1953US2013082402A1Semiconductor deviceFUJITSU SEMICONDUCTOR LTD·Filed 2012·Application pending·0 cites
- 2049US2006186524A1Semiconductor deviceFUJITSU LTD·Filed 2005·Application pending·0 cites
- 2146US2008197466A1Semiconductor device and manufacturing method thereofFUJITSU LTD·Filed 2008·Application pending·0 cites
- 2238US7602055B2Semiconductor device and method for fabricating the sameFUJITSU MICROELECTRONICS LTD·Filed 2006·Granted Oct 13, 2009·0 cites·9 claims
- 2327US8324714B2Semiconductor device and method for making the sameTSUKAKOSHI JUN·Filed 2010·Granted Dec 4, 2012·0 cites·18 claims
Join the waitlist — get patent alerts
Get an alert when Yoshitaka Aiba files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →